JPH01169034U - - Google Patents

Info

Publication number
JPH01169034U
JPH01169034U JP6612288U JP6612288U JPH01169034U JP H01169034 U JPH01169034 U JP H01169034U JP 6612288 U JP6612288 U JP 6612288U JP 6612288 U JP6612288 U JP 6612288U JP H01169034 U JPH01169034 U JP H01169034U
Authority
JP
Japan
Prior art keywords
tray
spring
semiconductor substrate
storing
packaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6612288U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6612288U priority Critical patent/JPH01169034U/ja
Publication of JPH01169034U publication Critical patent/JPH01169034U/ja
Pending legal-status Critical Current

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Landscapes

  • Packaging Frangible Articles (AREA)
JP6612288U 1988-05-19 1988-05-19 Pending JPH01169034U (me)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6612288U JPH01169034U (me) 1988-05-19 1988-05-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6612288U JPH01169034U (me) 1988-05-19 1988-05-19

Publications (1)

Publication Number Publication Date
JPH01169034U true JPH01169034U (me) 1989-11-29

Family

ID=31291537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6612288U Pending JPH01169034U (me) 1988-05-19 1988-05-19

Country Status (1)

Country Link
JP (1) JPH01169034U (me)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005112106A1 (ja) * 2004-05-19 2005-11-24 Nippon Mining & Metals Co., Ltd. ウェハ保管容器
JP2008531416A (ja) * 2005-02-27 2008-08-14 インテグリス・インコーポレーテッド 絶縁システムを備えるレチクルポッド
JP2010165882A (ja) * 2009-01-16 2010-07-29 Lintec Corp 半導体ウエハの搬送装置及び搬送方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005112106A1 (ja) * 2004-05-19 2005-11-24 Nippon Mining & Metals Co., Ltd. ウェハ保管容器
JPWO2005112106A1 (ja) * 2004-05-19 2008-07-31 日鉱金属株式会社 ウェハ保管容器
US7510082B2 (en) 2004-05-19 2009-03-31 Nippon Mining & Metals Co., Ltd. Wafer storage container
JP4676430B2 (ja) * 2004-05-19 2011-04-27 Jx日鉱日石金属株式会社 ウェハ保管容器
JP2008531416A (ja) * 2005-02-27 2008-08-14 インテグリス・インコーポレーテッド 絶縁システムを備えるレチクルポッド
JP2010165882A (ja) * 2009-01-16 2010-07-29 Lintec Corp 半導体ウエハの搬送装置及び搬送方法

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