JPH01169034U - - Google Patents
Info
- Publication number
- JPH01169034U JPH01169034U JP6612288U JP6612288U JPH01169034U JP H01169034 U JPH01169034 U JP H01169034U JP 6612288 U JP6612288 U JP 6612288U JP 6612288 U JP6612288 U JP 6612288U JP H01169034 U JPH01169034 U JP H01169034U
- Authority
- JP
- Japan
- Prior art keywords
- tray
- spring
- semiconductor substrate
- storing
- packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 229920002635 polyurethane Polymers 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 claims 1
Landscapes
- Packaging Frangible Articles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6612288U JPH01169034U (id) | 1988-05-19 | 1988-05-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6612288U JPH01169034U (id) | 1988-05-19 | 1988-05-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01169034U true JPH01169034U (id) | 1989-11-29 |
Family
ID=31291537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6612288U Pending JPH01169034U (id) | 1988-05-19 | 1988-05-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01169034U (id) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005112106A1 (ja) * | 2004-05-19 | 2005-11-24 | Nippon Mining & Metals Co., Ltd. | ウェハ保管容器 |
| JP2008531416A (ja) * | 2005-02-27 | 2008-08-14 | インテグリス・インコーポレーテッド | 絶縁システムを備えるレチクルポッド |
| JP2010165882A (ja) * | 2009-01-16 | 2010-07-29 | Lintec Corp | 半導体ウエハの搬送装置及び搬送方法 |
-
1988
- 1988-05-19 JP JP6612288U patent/JPH01169034U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005112106A1 (ja) * | 2004-05-19 | 2005-11-24 | Nippon Mining & Metals Co., Ltd. | ウェハ保管容器 |
| JPWO2005112106A1 (ja) * | 2004-05-19 | 2008-07-31 | 日鉱金属株式会社 | ウェハ保管容器 |
| US7510082B2 (en) | 2004-05-19 | 2009-03-31 | Nippon Mining & Metals Co., Ltd. | Wafer storage container |
| JP4676430B2 (ja) * | 2004-05-19 | 2011-04-27 | Ｊｘ日鉱日石金属株式会社 | ウェハ保管容器 |
| JP2008531416A (ja) * | 2005-02-27 | 2008-08-14 | インテグリス・インコーポレーテッド | 絶縁システムを備えるレチクルポッド |
| JP2010165882A (ja) * | 2009-01-16 | 2010-07-29 | Lintec Corp | 半導体ウエハの搬送装置及び搬送方法 |