JPH0116772Y2 - - Google Patents
Info
- Publication number
- JPH0116772Y2 JPH0116772Y2 JP11866686U JP11866686U JPH0116772Y2 JP H0116772 Y2 JPH0116772 Y2 JP H0116772Y2 JP 11866686 U JP11866686 U JP 11866686U JP 11866686 U JP11866686 U JP 11866686U JP H0116772 Y2 JPH0116772 Y2 JP H0116772Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- barrel case
- plating
- rotating shaft
- hollow body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 26
- 238000007747 plating Methods 0.000 claims description 23
- 238000003780 insertion Methods 0.000 claims description 13
- 230000037431 insertion Effects 0.000 claims description 13
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005246 galvanizing Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11866686U JPH0116772Y2 (pl) | 1986-07-31 | 1986-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11866686U JPH0116772Y2 (pl) | 1986-07-31 | 1986-07-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6324271U JPS6324271U (pl) | 1988-02-17 |
| JPH0116772Y2 true JPH0116772Y2 (pl) | 1989-05-17 |
Family
ID=31005337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11866686U Expired JPH0116772Y2 (pl) | 1986-07-31 | 1986-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0116772Y2 (pl) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4530701B2 (ja) * | 2004-03-30 | 2010-08-25 | 太陽化学工業株式会社 | バレルメッキ装置 |
-
1986
- 1986-07-31 JP JP11866686U patent/JPH0116772Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6324271U (pl) | 1988-02-17 |
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