JPH01167065U - - Google Patents
Info
- Publication number
- JPH01167065U JPH01167065U JP1988063522U JP6352288U JPH01167065U JP H01167065 U JPH01167065 U JP H01167065U JP 1988063522 U JP1988063522 U JP 1988063522U JP 6352288 U JP6352288 U JP 6352288U JP H01167065 U JPH01167065 U JP H01167065U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- recess
- diode chip
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988063522U JPH0639464Y2 (ja) | 1988-05-13 | 1988-05-13 | 発光ダイオード |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988063522U JPH0639464Y2 (ja) | 1988-05-13 | 1988-05-13 | 発光ダイオード |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01167065U true JPH01167065U (US20030220297A1-20031127-C00074.png) | 1989-11-22 |
| JPH0639464Y2 JPH0639464Y2 (ja) | 1994-10-12 |
Family
ID=31289018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988063522U Expired - Lifetime JPH0639464Y2 (ja) | 1988-05-13 | 1988-05-13 | 発光ダイオード |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0639464Y2 (US20030220297A1-20031127-C00074.png) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005537665A (ja) * | 2002-08-30 | 2005-12-08 | ゲルコアー リミテッド ライアビリティ カンパニー | Ｌｅｄ平面型光源及びこれを備えた薄型ヘッドライト |
| JP2006313896A (ja) * | 2005-05-02 | 2006-11-16 | Samsung Electro Mech Co Ltd | 発光素子パッケージ |
| WO2008126696A1 (ja) * | 2007-04-05 | 2008-10-23 | Rohm Co., Ltd. | 半導体発光装置 |
| WO2013161295A1 (ja) * | 2012-04-24 | 2013-10-31 | パナソニック株式会社 | Ｌｅｄパッケージおよびｌｅｄ発光素子 |
| JP2016502289A (ja) * | 2013-01-08 | 2016-01-21 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ | オプトエレクトロニクス半導体コンポーネント用のトラフ型反射体 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5577874U (US20030220297A1-20031127-C00074.png) * | 1978-11-21 | 1980-05-29 | ||
| JPS58220480A (ja) * | 1982-06-16 | 1983-12-22 | Toshiba Corp | 光半導体装置 |
| JPS59115669U (ja) * | 1983-01-25 | 1984-08-04 | 三洋電機株式会社 | 発光素子 |
-
1988
- 1988-05-13 JP JP1988063522U patent/JPH0639464Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5577874U (US20030220297A1-20031127-C00074.png) * | 1978-11-21 | 1980-05-29 | ||
| JPS58220480A (ja) * | 1982-06-16 | 1983-12-22 | Toshiba Corp | 光半導体装置 |
| JPS59115669U (ja) * | 1983-01-25 | 1984-08-04 | 三洋電機株式会社 | 発光素子 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005537665A (ja) * | 2002-08-30 | 2005-12-08 | ゲルコアー リミテッド ライアビリティ カンパニー | Ｌｅｄ平面型光源及びこれを備えた薄型ヘッドライト |
| JP2006313896A (ja) * | 2005-05-02 | 2006-11-16 | Samsung Electro Mech Co Ltd | 発光素子パッケージ |
| WO2008126696A1 (ja) * | 2007-04-05 | 2008-10-23 | Rohm Co., Ltd. | 半導体発光装置 |
| JP2008258413A (ja) * | 2007-04-05 | 2008-10-23 | Rohm Co Ltd | 半導体発光装置 |
| WO2013161295A1 (ja) * | 2012-04-24 | 2013-10-31 | パナソニック株式会社 | Ｌｅｄパッケージおよびｌｅｄ発光素子 |
| JP2013229395A (ja) * | 2012-04-24 | 2013-11-07 | Panasonic Corp | Ｌｅｄパッケージおよびｌｅｄ発光素子 |
| JP2016502289A (ja) * | 2013-01-08 | 2016-01-21 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ | オプトエレクトロニクス半導体コンポーネント用のトラフ型反射体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0639464Y2 (ja) | 1994-10-12 |
