JPH01167052U - - Google Patents
Info
- Publication number
- JPH01167052U JPH01167052U JP1988063301U JP6330188U JPH01167052U JP H01167052 U JPH01167052 U JP H01167052U JP 1988063301 U JP1988063301 U JP 1988063301U JP 6330188 U JP6330188 U JP 6330188U JP H01167052 U JPH01167052 U JP H01167052U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- portions
- width
- end surface
- step portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988063301U JPH0451485Y2 (https=) | 1988-05-16 | 1988-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988063301U JPH0451485Y2 (https=) | 1988-05-16 | 1988-05-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01167052U true JPH01167052U (https=) | 1989-11-22 |
| JPH0451485Y2 JPH0451485Y2 (https=) | 1992-12-03 |
Family
ID=31288809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988063301U Expired JPH0451485Y2 (https=) | 1988-05-16 | 1988-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451485Y2 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0268447U (https=) * | 1988-11-11 | 1990-05-24 | ||
| JP2012119533A (ja) * | 2010-12-01 | 2012-06-21 | Murata Mfg Co Ltd | セラミック多層基板 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5572064A (en) * | 1978-11-25 | 1980-05-30 | Kyocera Corp | Ceramic substrate |
| JPS5750062A (en) * | 1980-09-09 | 1982-03-24 | Toshiba Corp | Magnetic disk controller |
-
1988
- 1988-05-16 JP JP1988063301U patent/JPH0451485Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5572064A (en) * | 1978-11-25 | 1980-05-30 | Kyocera Corp | Ceramic substrate |
| JPS5750062A (en) * | 1980-09-09 | 1982-03-24 | Toshiba Corp | Magnetic disk controller |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0268447U (https=) * | 1988-11-11 | 1990-05-24 | ||
| JP2012119533A (ja) * | 2010-12-01 | 2012-06-21 | Murata Mfg Co Ltd | セラミック多層基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0451485Y2 (https=) | 1992-12-03 |