JPH01167052U - - Google Patents

Info

Publication number
JPH01167052U
JPH01167052U JP1988063301U JP6330188U JPH01167052U JP H01167052 U JPH01167052 U JP H01167052U JP 1988063301 U JP1988063301 U JP 1988063301U JP 6330188 U JP6330188 U JP 6330188U JP H01167052 U JPH01167052 U JP H01167052U
Authority
JP
Japan
Prior art keywords
ceramic substrate
portions
width
end surface
step portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988063301U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0451485Y2 (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988063301U priority Critical patent/JPH0451485Y2/ja
Publication of JPH01167052U publication Critical patent/JPH01167052U/ja
Application granted granted Critical
Publication of JPH0451485Y2 publication Critical patent/JPH0451485Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
JP1988063301U 1988-05-16 1988-05-16 Expired JPH0451485Y2 (cg-RX-API-DMAC7.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988063301U JPH0451485Y2 (cg-RX-API-DMAC7.html) 1988-05-16 1988-05-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988063301U JPH0451485Y2 (cg-RX-API-DMAC7.html) 1988-05-16 1988-05-16

Publications (2)

Publication Number Publication Date
JPH01167052U true JPH01167052U (cg-RX-API-DMAC7.html) 1989-11-22
JPH0451485Y2 JPH0451485Y2 (cg-RX-API-DMAC7.html) 1992-12-03

Family

ID=31288809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988063301U Expired JPH0451485Y2 (cg-RX-API-DMAC7.html) 1988-05-16 1988-05-16

Country Status (1)

Country Link
JP (1) JPH0451485Y2 (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0268447U (cg-RX-API-DMAC7.html) * 1988-11-11 1990-05-24
JP2012119533A (ja) * 2010-12-01 2012-06-21 Murata Mfg Co Ltd セラミック多層基板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5572064A (en) * 1978-11-25 1980-05-30 Kyocera Corp Ceramic substrate
JPS5750062A (en) * 1980-09-09 1982-03-24 Toshiba Corp Magnetic disk controller

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5572064A (en) * 1978-11-25 1980-05-30 Kyocera Corp Ceramic substrate
JPS5750062A (en) * 1980-09-09 1982-03-24 Toshiba Corp Magnetic disk controller

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0268447U (cg-RX-API-DMAC7.html) * 1988-11-11 1990-05-24
JP2012119533A (ja) * 2010-12-01 2012-06-21 Murata Mfg Co Ltd セラミック多層基板

Also Published As

Publication number Publication date
JPH0451485Y2 (cg-RX-API-DMAC7.html) 1992-12-03

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