JPH01165977A - Inserting and removing apparatus - Google Patents

Abstract

PURPOSE:To shorten an operating time required for insertion and removal of a plurality of articles without causing any impairment by a simple construction wherein an operation of feeding substrates by a feeding stage is combined with a reciprocating operation of a holding block in the direction intersecting the feeding direction. CONSTITUTION:A feeding stage 2 wherein a plurality of sockets into which terminals of articles 9 such as semiconductor devices are inserted and from which they are removed are arranged and which conducts an operation of feeding substrates, and a holding block 11 which can be displaced freely in the direction intersecting the feeding direction of said feeding stage and wherein a plurality of holding grooves 11a holding the articles 9 movably in the feeding direction of the feeding stage 2 in a state wherein the terminals are made to project onto the feeding stage 2 side are formed, are provided. By combining the operation of feeding the substrates by the feeding stage 2 with the reciprocating operation of the holding block 11 in the direction intersecting the feeding direction, the fitting and removal of the articles 9 in and from the substrates can be executed. It is only needed to set the articles 9 in a plurality of holding grooves 11a provided in the holding block 11, as stated above, and it is unnecessary to provide a number of movable mechanisms and the like for holding the articles 9.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an insertion/extraction technique, and is particularly applicable to attachment/detachment of a semiconductor device to/from a burn-in board during the ashing process in the manufacture of semiconductor devices. Concerning effective techniques.

[Conventional technology].

For example, in the manufacture of semiconductor devices, so-called aging is performed in which all products are actually operated for a predetermined period of time before shipping or upon receipt, in order to stabilize the quality of the products, such as their operating characteristics. There is.

That is, by inserting a semiconductor device into each of a plurality of sockets provided on a predetermined board and connecting it to a desk etc. via this board, it is operated while applying test signals, etc., and the operating characteristics etc. are determined to be the predetermined. It is used to determine whether the standards have been met or not.

By the way, as a method for simultaneously inserting and removing a plurality of semiconductor devices into and out of a socket, for example, a part of the package of each semiconductor device is held detachably by vacuum suction, or is held by a predetermined gripping mechanism. It is possible that

Note that aging of semiconductor devices and the like are described in "Electronic Materials J, November 1986 issue, special edition, pages 243 to 248, published by Kogyo Research Association Co., Ltd., November 10, 1986.

[Problem that the invention seeks to solve]

However, for example, a zigzag in-line package type semiconductor device is mounted with leads protruding in the width direction from one side of the package so that the width direction is perpendicular to the mounting surface, that is, the insertion surface of the socket. etc., it is difficult to stably hold a large number of semiconductor devices by vacuum suction because the suction surface is parallel to the insertion direction.
On the other hand, the method using a gripping mechanism has the problem that a movable mechanism must be provided for each individual semiconductor device, making the structure complicated.

For this reason, for example, it may be possible to do this manually by an operator, but this requires a long time, increases the number of man-hours in the testing and sorting process, and causes the lead to be easily deformed when inserted into the socket. The inventor has discovered that there is.

The purpose of the present invention is to have a simple structure, no damage,
An object of the present invention is to provide an insertion/extraction technique capable of shortening the working time required for inserting and extracting a plurality of articles.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means for solving problems]

A brief overview of typical inventions disclosed in this application is as follows.

In other words, it is an insertion/extraction technique for an article having terminals protruding from a package, and includes a feed base that feeds a board on which a plurality of sockets into which the terminals of the article are inserted/removed are arranged, and a feeding direction of the feed base. and a holding block formed with a plurality of holding grooves for holding the article movably in the feeding direction of the feed stand with the terminal protruding toward the feed stand, The article is inserted into or removed from the substrate by combining the substrate feeding operation by the feeding table and the reciprocating movement of the holding block in a direction crossing the feeding direction.

[Effect]

According to the above-mentioned means, it is only necessary to accommodate the articles in each of the plurality of holding grooves provided in the holding block, and there is no need to provide a large number of movable mechanisms for the purpose of gripping individual articles, for example. Therefore, the structure is simplified, and since manual work is not involved in the series of operations, the working time required for inserting and removing a plurality of articles can be shortened without causing damage to the articles.

〔Example〕

An insertion/extraction device according to an embodiment of the present invention includes a first casing for performing an insertion operation and a second casing for performing an extraction operation.

First, the configuration of the first casing will be explained.

FIG. 1 is a perspective view of the first casing, and FIG. 2 is a plan view thereof.

A feed table 2 is provided on the upper surface of the first housing 1.

As shown in the cross-sectional view of FIG.
It is supported via a plurality of movable rollers 4, and is slidably moved in the direction of the rail 3 by a drive mechanism (not shown).

A plurality of positioning pins 2a are provided protrudingly on the feed base 2, and a locking piece 2b that is movable in the width direction is provided on the periphery, and a plurality of sockets 7) 5a are provided. Burn-in boards 5 (test boards) regularly arranged in a grid with predetermined pinches are placed with the arrangement direction of the sockets 7) 5a perpendicular to the feeding direction.

Note that FIG. 1 shows a state in which the burn-in board 5 is not attached.

A pair of support pieces 6 are disposed on the upper surface of the first casing 1 at positions sandwiching the movement path of the feed table 2. One end of a tilting table 7 provided at the center is pivotally supported.

A magazine guide 7a and a magazine guide 7b, each having a plurality of grooves carved at a predetermined pitch, are fixed on the upper surface of the tilting table 7 at a predetermined interval in the moving direction of the feed table 2, and a plurality of magazines 8 is removably placed in a posture parallel to the moving direction of the feed base 2.

Inside this magazine 8, for example, a package 9a
A plurality of zigzag-in-line package type semiconductor devices 9 are housed in a row, each having a plurality of zigzag in-line package type semiconductor devices 9 in which a plurality of glued boards 9b are alternately protruded from one side in different parallel planes.

As shown in FIG. 5, a driving cylinder 7C with a vertical axis is locked on the lower surface of the tilting table 7, and the tilting table 7 can be tilted at a desired angle using the support piece 6 as a fulcrum. is configured to be

On the upper surface of the tilting table 7, a portal frame 10 is fixed to the end on the feed table 2 side, which is pivotally supported by the support piece 6.

A holding block 11 is provided inside the portal frame 10 in a direction transverse to the moving direction of the feed base 2, and a plurality of guide shafts 1 are slidably penetrated in the upper side of the portal frame 10 in the vertical direction.
It is made vertically movable via 0a.

Further, a drive cylinder 10b supported by the portal frame 10 is locked to the holding bronck 11, and is configured to be displaced in the vertical direction.

At the bottom of the holding block 11, there are shown in FIGS.
), a plurality of holding grooves 11a penetrating in the moving direction of the feed table 2, that is, in the axial direction of the magazine 8 in which a plurality of semiconductor devices 9 are housed, are arranged in the width direction of the feed table 2 for burn-in. - The plurality of sockets 7) on the board 5 are formed with almost the same arrangement pitch as the arrangement pitch of the plurality of magazines 8 on the tilting table 7.

The width of the holding block 11 is approximately equal to the width of the package 9a of the semiconductor device 9, and each holding groove 11a is formed slightly larger than the outline of the package 9a of the semiconductor device 9. Inside one holding groove 11a, - semiconductor devices 9 are individually held so as to be movable in the feeding direction of the feed table 2 with the leads 9b protruding toward the feed table 2. .

That is, when the holding block 11 is raised to the height of the plurality of magazines 8 placed on the tilting table 7, the open end of each magazine 8 is aligned with each of the holding grooves 11a,
By tilting the tilting table 7 in this state, the individual holding grooves 1 of the holding block 11 can be viewed from inside the plurality of magazines 8.
The semiconductor device 9 is moved to 1a.

Furthermore, a stopper 12 is provided on the portal frame 10 at a position facing the magazine 8 via a holding block 11 that has been raised to the height of the magazine 8, so that when the tilting table 7 is tilted, The semiconductor device 9 moving from the magazine 8 to the holding groove 11a of the holding block 11 is in the holding groove 1.1a.
It is prevented from falling off.

On the other hand, the perspective view of the second casing 101 that performs the removal work is shown in the sixth figure.
FIG. 7 is a plan view thereof, and FIGS. 8 and 9 are partial sectional views thereof.

The structure of the second casing 101 is almost the same as that of the first casing 1 except for the parts to be described later, so 100 is added to the reference numeral of each corresponding member and the numbers are added to avoid duplication. Explanation will be omitted.

That is, in the second housing 101, a fixed base 14 equipped with magazine guides 14a and 14b is supported at a predetermined height on the upper surface of the second housing 1°1 by a plurality of support pieces 13. There is.

Furthermore, instead of the stopper 12, a plurality of holding grooves 1 of the holding block 111 that has been pulled up to the height of the magazine 8 are provided.
A plurality of suppressing mechanisms 15 are provided corresponding to the holding grooves 11a, and the semiconductor devices 9 that are removed from the burn-in port 5 and held in the respective holding grooves 111a are It is configured to be pushed out toward the inside of each empty magazine 8 placed on the fixed base 14.

Additionally, a magazine guide 14 is provided on the outer end side of the fixed base 14.
A and 14b are provided with stoppers 14c for closing the outer ends of a plurality of magazines 8, and the semiconductor device moves inside the magazines 8 sequentially toward the outer ends by the operation of the pressing mechanism 15. 9 is prevented from falling off from the end of the magazine 8.

The operation of this embodiment will be explained below.

First, the insertion work in the first casing will be explained.

First, the magazine guides 7a and 7b of the tilting table 7 have
A plurality of magazines 8 in which a plurality of semiconductor devices 9 are housed in a line in a predetermined posture are set inside, and a feed table 2
The burn-in board 5 is placed in a predetermined posture.

Next, by displacing the feed table 2 by a predetermined distance below the tilting table 7, one row in the width direction of the plurality of sockets 5a of the burn-in board 5 is placed directly under the holding block 11. is positioned.

Furthermore, by extending the drive cylinder 7c with the holding block 11 pulled out, the tilting table 7 is tilted by a predetermined angle so that the outer end side of the tilting table 7 is upward, and a plurality of magazines The leading one of the semiconductor devices 9 housed in each of the semiconductor devices 8 moves by its own weight to each of the plurality of holding grooves 11a of the holding block 11, comes into contact with the stopper 12, and stops.

Thereafter, the tilting table 7 and the holding block 11 supported by the tilting table 7 via the portal frame 10 are made horizontal.

Next, by operating the drive cylinder 10b of the portal frame 10, the holding block 11 is lowered by a predetermined distance,
The leads 9b of each of the plurality of semiconductor devices 9 protruding from the holding groove 11a are inserted into each of the corresponding plurality of sockets 5a of the burn-in board 5.

In this state, by further moving the feed table 2 a predetermined distance below the tilting table 7, the plurality of semiconductor devices 9 with the leads 9b inserted into the plurality of sockets) 5a are moved into the holding grooves of the holding block 11. The sockets 11a are pulled out in the width direction and moved to the lower side of the tilting table 7, and the next row of the plurality of sockets 5a is positioned directly below the holding block 11.

Thereafter, the holding block 11 is raised to the height of the magazine 8, and the next semiconductor device 9 is moved from the inside of the magazine 8 to the holding groove 11a by the above-mentioned tilting operation of the tilting table 7.

By repeating the above operations sequentially, burn-in
The plurality of semiconductor devices 9 stored in the magazine 8 are automatically inserted into the plurality of sockets 5a provided in the boat 5.

Then, the burn-in board 5 in which the semiconductor devices 9 are attached to each of the plurality of sockets 5a via the lead 9b is carried out to an aging section (not shown), and the plurality of semiconductor devices 9 attached to the burn-in board 5 are carried out to an aging section (not shown). A predetermined operation test or the like is performed by applying a predetermined operation signal or the like to the semiconductor device 9 .

On the other hand, a plurality of semiconductor devices 9 that have undergone predetermined operation tests, etc.
The removal operation of the semiconductor device 9 from the burn-in boat 5 in which the semiconductor device 9 is mounted is performed in the second casing 101 in the following procedure.

First, the burn-in board 5 with a tested semiconductor device 9 attached to each of a plurality of sockets 5a is set on the feed table 102, and a plurality of empty magazines 8 are placed on the fixed table 14. Seso) to be done.

Next, the holding block 111 is attached to the pan cage 9 of the semiconductor device 9 attached to the socket 5a of the burn-in board 5.
While lowered to a height of a, move the feed table 102 a predetermined distance to the holding flock 111 side, and perform the burn/burn process.
Multiple sockets arranged in a grid on the inboard 5) 5
The packages 9a of the plurality of semiconductor devices 9 mounted in a line in a direction intersecting the feeding direction of a are accommodated in each of the holding grooves 111a of the holding block 111.

In this state, by raising the holding block 111, the leads 9b of the semiconductor device 9 with the package 9a held in the holding groove 111a are pulled out from the socket 5a, and are brought to the height of the magazine 8 inside the gate frame 110. Rise.

Furthermore, by operating the pressing mechanism 15 so as to protrude into the inside of each holding groove 111a of the holding block 111, the semiconductor device 9 housed in each of the holding grooves 111a is moved into the inside of the empty macazine 8. Moving.

Next, the holding block 111 is lowered again to the height of the sockets 5a of the burn-in board 5, and by repeating the above series of operations, the plurality of sockets of the burn-in board 5 are removed. The operation of removing the semiconductor device 9 mounted on the semiconductor device 5a and storing it in the magazine 8 is automatically performed.

Then, the magazine 8 containing a predetermined number of semiconductor devices 9 is transported to the next packing process or the like.

In this way, in this embodiment, the plurality of holding grooves 11a
Holding block 11 (111) where (lla) is formed
The burn-in board 5 is
Since the insertion and extraction of a plurality of semiconductor devices 9 into and out of the socket 5a and the removal and storage of the semiconductor devices 9 into the magazine 8 are automatically performed, for example, complicated mechanisms for gripping individual semiconductor devices 9, etc. are automatically performed. is not necessary, and the structure is simplified.

In addition, the work can be performed reliably and quickly without requiring any manual intervention, and without causing deformation of the leads 9b of the semiconductor device 9 due to operator carelessness, for example, and the work can be performed reliably and quickly. Semiconductor device 9 for 5
The time required for insertion and removal work can be reduced.

In this way, the following effects can be obtained in this embodiment.

(1) Appropriate combination of the raising and lowering operation of the holding block 11 (111) in which a plurality of holding grooves 11a (1, 1, 1a) are formed and the feeding operation of the feed table 2 (102), etc. Burn-in board 5 socket)
Since operations such as insertion and removal of a plurality of semiconductor devices 9 into and out of the magazine 5a, and removal and storage of the semiconductor devices 9 into the magazine 8 are performed automatically, for example, a complicated mechanism for gripping each semiconductor device 9 is not required. Therefore, the structure is simplified, and the work can be performed reliably and quickly without requiring manual intervention and without causing damage to the leads 9b of the semiconductor device 9 due to worker's carelessness. Therefore, the time required for inserting and removing the semiconductor device 9 from the burn-in board 5 can be reduced.

(2) As a result of (1) above, it is possible to increase the number of semiconductor devices 9 inserted into and removed from the burn-in board 5 per unit time, for example, before shipping or receiving the semiconductor devices 9. It is possible to improve the productivity of the manufacturing process.

(3) As a result of (1) above, the occurrence of defects such as deformation of IJ - )' 9 b of the semiconductor device 9 during the inspection process is reduced, and the quality of the semiconductor device 9 is improved.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, the object to be inserted and removed is not limited to a zigzag-in-line pancage type semiconductor device, but may be a general electronic component.

In the above explanation, the invention made by the present inventor was mainly applied to the insertion/extraction work in the inspection process of semiconductor devices, which is the background field of application. It is widely applicable to techniques that require rapid insertion and removal of dental articles.

〔Effect of the invention〕

A brief explanation of the effects obtained by seven representative inventions disclosed in this application is as follows.

That is, it is an insertion/extraction device for an article having terminals protruding from a package, which includes a feed base for feeding a board in which a plurality of sockets into which the terminals of the article are inserted/removed are arranged, and the feed base. is freely displaceable in a direction intersecting the feeding direction of the terminal, and is in a posture in which the terminal protrudes toward the side of the feeding base,
a holding block in which a plurality of holding grooves are formed to hold the article movably in the feeding direction of the feeding table, the feeding operation of the substrate by the feeding table and the holding in a direction intersecting the feeding direction; If the structure is such that the article is inserted into or removed from the substrate by combining the reciprocating motion of the block, it is only necessary to accommodate the article in each of the plurality of holding grooves provided in the holding block, for example. This simplifies the structure, eliminating the need for multiple movable mechanisms for the purpose of gripping individual items, and eliminates manual intervention in the series of operations.
The work time required for inserting and removing multiple articles can be reduced without causing damage to the articles.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of a first casing constituting an insertion/extraction device which is an embodiment of the present invention, Fig. 2 is a plan view thereof, and Figs. 3(a) and (b) are respective views of a holding block. A front view and a side view, FIG. 4 is a sectional view of the first housing, FIG. 5 is a sectional view thereof, and FIG. 6 is a perspective view of the second housing that constitutes the insertion/extraction device of this embodiment. , FIG. 7 is a plan view thereof, FIG. 8 is a sectional view thereof, and FIG. 9 is a sectional view thereof. 1...First case, 101...Second case 2.10
2...Feed base, 2a, 102a...Positioning pin,
2b, 102b...Locking piece, 3゜103...Rail, 4,104...Roller, 5...Burn-in board (substrate), 5a...Socket, 6...Support piece,
7...Tilt table, 7a, 7b...Magazine guide, 8
...Magazine, 9...Semiconductor device (article), 9a.
・Package, 9b ・・Lead, 10,110
...Gate frame, 10a, 110a...Guide shaft, 10
b, 110b...driving cylinder, 11,111...
Holding block, lla, 1lla... holding groove, 12.
...stopper, 13...fixing piece, 14...fixing base,
14a, 14b... Magazine guide, 14C... Stopper, 15... Pressing mechanism.

Claims (1)

[Scope of Claims] 1. An insertion/extraction device for an article having terminals protruding from a package, which feeds a board on which a plurality of sockets into which the terminals of the article are inserted/extracted are arranged. a table, which is freely displaceable in a direction intersecting the feeding direction of the feed table;
a holding block in which a plurality of holding grooves are formed to hold the article movably in the feeding direction of the feed stand with the terminal protruding toward the feed stand; An insertion/extraction device characterized in that the article is inserted into or removed from the substrate by combining a feeding operation of the above and a reciprocating movement of the holding block in a direction crossing the feeding direction. 2. The holding block is supported by a tilting table that positions a plurality of magazines each containing a plurality of articles in a row in each of the holding grooves in the holding block, and by sequentially tilting the tilting table, 2. The insertion/extraction device according to claim 1, wherein an operation for taking out the article from the magazine into the holding groove is performed. 3. The holding block is supported by a fixing base that positions a plurality of magazines each containing a plurality of articles in a line in each of the holding grooves in the holding block, and According to claim 1, the article is stored in the magazine from the holding groove by a pressing mechanism disposed facing each of the plurality of magazines through the holding groove. insertion/extraction device. 4. A patent characterized in that it consists of a first casing for inserting the article into the socket of the board, and a second casing for removing the article from the socket of the board. An insertion/extraction device according to claim 1. 5. The article is a zigzag-in-line package type semiconductor device in which the terminal is protruded from one side of the package in the width direction, and the substrate is a burn-in board for aging the semiconductor device. An insertion/extraction device according to claim 1, characterized in that: