JP2716973B2 - Insertion and removal devices - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an insertion / extraction technique, and more particularly to an insertion / removal technique applied to a work of attaching / detaching a semiconductor device to / from a burn-in board in an aging process in the manufacture of a semiconductor device. Regarding effective technology. [Prior Art] For example, in the manufacture of semiconductor devices, for the purpose of stabilizing the quality such as the operating characteristics of products, all products are actually operated for a predetermined time before shipment or acceptance, for the purpose of so-called Aging may occur. That is, each semiconductor device is inserted into a plurality of sockets provided on a predetermined board, and connected to a tester or the like via the board, thereby operating while applying a test signal or the like, and operating characteristics and the like are set to a predetermined value. This is to determine whether or not the level has been reached. By the way, as a method of simultaneously inserting and removing a plurality of semiconductor devices into and from a socket, for example, a part of a package of each semiconductor device is detachably held by vacuum suction or held by a predetermined gripping mechanism or the like. It is possible. Regarding the aging of semiconductor devices, see “Electronic Materials” published by the Industrial Research Committee, Inc., November 10, 1986.
It is described in a separate volume, November 1986, pages 243-248. [Problems to be Solved by the Invention] However, for example, zigzag mounting is performed such that the width direction is perpendicular to the mounting surface, that is, the insertion surface of the socket, by a lead protruding from one side of the package in the width direction.・ In the case of in-line package type semiconductor devices, it is difficult to stably hold a large number of semiconductor devices by vacuum suction because the suction surface is parallel to the insertion direction. It is necessary to provide a movable mechanism for each of the semiconductor devices, and the structure becomes complicated. For this reason, for example, it is conceivable that the operation is performed manually by an operator. However, the operation requires a long time, which leads to an increase in the number of steps in the test / selection process and a problem that the lead is easily deformed at the time of insertion into the socket. The inventor has found that there is. SUMMARY OF THE INVENTION An object of the present invention is to provide an insertion / removal technique that has a simple structure and can reduce the work time required for inserting and removing a plurality of articles without causing damage. The above and other objects and novel features of the present invention are as follows.
It will be apparent from the description of this specification and the accompanying drawings. [Means for Solving the Problems] The outline of a typical invention among the inventions disclosed in the present application will be briefly described as follows. That is, the insertion device of the present invention is an insertion device that inserts an article formed by projecting terminals into a package into sockets arranged on a substrate, wherein the substrate on which the plurality of sockets are arranged is placed. And a plurality of magazines each accommodating a plurality of the articles in a row in a posture parallel to the moving direction of the feed table, detachably mounted at predetermined intervals, and at a desired angle. A tilting table capable of tilting and returning to a horizontal position, and installed in a manner intersecting with the feed direction of the feed table, capable of vertically moving to the feed table, and mounted on the tilt table in the ascending position. A plurality of holding grooves penetrating in the axial direction with the open end of each magazine are formed, and the holding grooves are machined into a shape conforming to the outer shape of the article so as to hold the article movably in the feed direction of the feed table. And the tilt table is And a holding block to the article is one of the articles moves in the holding groove is accommodated by its own weight stopped in the magazine by obliquely,
After holding the article in each of the holding grooves, the tilting table is returned to a horizontal position, and the feeder is positioned under the holding block in advance, for a socket arranged on the mounted substrate, By lowering the holding block, inserting the held article into the socket, and operating the feed plate in the inserted state, the holding of the article inserted into the holding groove of the holding block is released. It is assumed that. Further, the removal device of the present invention is a removal device which is inserted into sockets arranged on a substrate and removes an article formed by projecting terminals on a package, wherein the substrate on which the plurality of sockets are arranged is removed. A feed base for mounting and performing a feed operation, and a plurality of holding grooves processed into a shape conforming to the outer shape of the article so as to hold the article movably in a feed direction of the feed base; A holding block capable of vertically moving vertically and a plurality of magazines capable of accommodating a plurality of the articles in a row are detachably mounted at predetermined intervals in a posture parallel to the moving direction of the feed base. And a pressing mechanism for moving the article accommodated in the holding groove of the holding block, and in a state where the holding block is lowered to the substrate insertion position, the feed base is operated to feed. , Feed The articles inserted into the sockets arranged on the substrate placed on the holding block are accommodated in the holding grooves of the holding block, the holding block is raised, the accommodated components are removed, and the holding grooves are removed. An opening and an axis of the magazine placed on the fixed base are aligned and positioned, and the article stored in the holding groove of the holding block is pushed out and stored in the magazine by the pressing mechanism. Is what you do. According to the above-described means, it is only necessary to store an article in each of the plurality of holding grooves provided in the holding block, and it is not necessary to provide a large number of movable mechanisms for the purpose of, for example, gripping individual articles. Therefore, the structure is simplified, and since a manual operation does not intervene in a series of operations, the operation time required for inserting and removing a plurality of articles can be reduced without causing damage to the articles. [Embodiment] An insertion and removal device according to an embodiment of the present invention includes a first housing for performing an insertion operation and a second housing for performing an extraction operation. First, the configuration of the first housing constituting the insertion device will be described. FIG. 1 is a perspective view of a first housing, and FIG. 2 is a plan view thereof. A feed base 2 is provided on an upper surface of the first housing 1. As shown in the sectional view of FIG.
A pair of rails 3 arranged in parallel to the axial direction of the first housing 1 is supported via a plurality of rollable rollers 4 and is slidable in the direction of the rails 3 by a drive mechanism (not shown). The thing that moves to. A plurality of positioning pins 2a protrude from the feed base 2, and a locking piece 2b that is movable in the width direction is disposed in a peripheral portion thereof. The burn-in boards 5 (test boards) regularly arranged in a grid at a pitch are placed with the arrangement direction of the sockets 5a perpendicular to the feed direction. FIG. 1 shows a state in which the burn-in board 5 is not mounted. On the upper surface of the first housing 1, a pair of support pieces 6 are arranged at positions sandwiching the movement path of the feed base 2, and the support pieces 6 have a predetermined height on the upper surface of the housing 1. One end of the tilting table 7 provided at the bottom is pivotally supported. On the upper surface of the tilting table 7, a magazine guide 7a and a magazine guide 7b in which a plurality of grooves are engraved at a predetermined pitch are fixed at predetermined intervals in the moving direction of the feed table 2,
A plurality of magazines 8 are configured to be detachably mounted in a posture parallel to the moving direction of the feed base 2. Inside the magazine 8, for example, a package 9a
A plurality of zigzag-in-line package-type semiconductor devices 9 in which a plurality of leads 9b are alternately protruded from different sides into different parallel planes are housed in a line. As shown in FIG. 5, a drive cylinder 7c having a vertical axis is locked on the lower surface of the tilting table 7, and the tilting table 7 tilts at a desired angle with the support piece 6 as a fulcrum. It is configured to be. On the upper surface of the tilting table 7, a portal frame 10 is fixed to an end on the side of the feed table 2 that is supported by the support pieces 6. Inside the portal frame 10, a holding block 11 is provided in a direction transverse to the moving direction of the feed base 2, and a plurality of guide shafts 10a vertically penetrating through the upper side of the portal frame 10 in a freely movable manner. It can move up and down freely. Further, a driving cylinder 10b supported by the portal frame 10 is locked to the holding block 11, so that the driving cylinder 10b is configured to be vertically displaced. As shown in FIGS. 3 (a) and 3 (b), the lower part of the holding block 11 has a plurality of penetrating members which penetrate in the moving direction of the feed table 2, that is, in the axial direction of the magazine 8 in which the plurality of semiconductor devices 9 are stored. Are formed in the width direction of the feed table 2 at substantially the same pitch as the arrangement pitch of the plurality of sockets 5a of the burn-in board 5, that is, at the arrangement pitch of the plurality of magazines 8 on the tilting table 7. Have been. The width dimension of the holding block 11 is substantially equal to the width dimension of the package 9a of the semiconductor device 9, and each holding groove 11a is formed slightly larger than the outline of the package 9a of the semiconductor device 9, Inside one holding groove 11a, one semiconductor device 9 is individually held movably in the feed direction of the feed base 2 with the lead 9b protruding toward the feed base 2 side. That is, in a state where the holding block 11 is pulled up to the height of the plurality of magazines 8 placed on the tilting table 7, the open ends of the individual magazines 8 correspond to the respective holding grooves 11a. By tilting the semiconductor device 7, the semiconductor device 9 is moved from the inside of the plurality of magazines 8 to the individual holding grooves 11 a of the holding block 11. Further, the portal frame 10 is provided with a stopper 12 at a position facing the magazine 8 via the holding block 11 raised to the height of the magazine 8, and when the tilting table 7 is inclined, From the magazine 8 to the holding groove 11a of the holding block 11
The semiconductor device 9 that moves to is prevented from dropping from the holding groove 11a. On the other hand, the perspective view of the second housing 101 for performing the withdrawal operation is shown in FIG.
FIG. 7 is a plan view thereof, and FIGS. 8 and 9 are partial sectional views thereof. The structure of the second housing 101 is substantially the same as that of the first housing 1 except for the portions described later. Description is omitted. That is, in the second housing 101 constituting the removal device, the fixed base 14 having the magazine guides 14a and 14b is supported at a predetermined height on the upper surface of the second housing 101 by the plurality of support pieces 13. Have been. Further, instead of the stopper 12, a plurality of holding grooves 111a of the holding block 111 pulled up to the height of the magazine 8 are provided.
A plurality of pressing mechanisms 15 are provided correspondingly to the semiconductor devices 9 which are removed from the burn-in board 5 and held in the respective holding grooves 111a by the operation described later. Each of the empty magazines 8 placed on the table 14 is configured to be pushed inward. Further, a magazine guide 14a is provided on the outer end side of the fixed base 14.
And a stopper 14c for closing the outer end sides of the plurality of magazines 8 set in the magazines 14b, and the semiconductor device 9 that sequentially moves the inside of the magazine 8 to the outer end side by the operation of the pressing mechanism 15. Is prevented from falling off from the end of the magazine 8. Hereinafter, the operation of the present embodiment will be described. First, the insertion operation in the first housing will be described. First, a plurality of magazines 8 in which a plurality of semiconductor devices 9 are housed in a row in a predetermined posture are set in the magazine guides 7a and 7b of the tilting table 7, and the burn-in The board 5 is placed in a predetermined posture. Next, the feed base 2 is displaced by a predetermined distance to the lower side of the tilting base 7, so that the plurality of sockets 5 a of the burn-in board 5 in the width direction are located immediately below the holding block 11.
The column is positioned. Further, by extending the drive cylinder 7c with the holding block 11 pulled up, the tilting table 7 is tilted by a predetermined angle so that the outer end side of the tilting table 7 faces upward. One of the heads of the semiconductor devices 9 housed therein moves to each of the plurality of holding grooves 11a of the holding block 11 by its own weight, and comes into contact with the stopper 12 and stops. Thereafter, the tilting table 7 and the holding block 11 supported by the tilting table 7 via the gate frame 10 are made horizontal. Next, by operating the drive cylinder 10b of the gate frame 10, the holding block 11 is lowered by a predetermined distance, and each of the leads 9 of the plurality of semiconductor devices 9 protruding from the holding groove 11a.
b is in a state of being inserted into each of the corresponding sockets 5a of the burn-in board 5. In this state, by moving the feed table 2 further below the tilt table 7 by a predetermined distance, the plurality of semiconductor devices 9 in which the leads 9b are inserted into the plurality of sockets 5a are moved to the holding grooves 11a of the holding block 11. , And moves to the lower side of the tilting table 7, and the next row of the plurality of sockets 5 a is positioned directly below the holding block 11. After that, the holding block 11 is raised to the height of the magazine 8, and the next semiconductor device 9 is moved from the inside of the magazine 8 to the holding mechanism 11a by the tilting operation of the tilting table 7 described above. By repeating the above operations sequentially, the operation of inserting the plurality of semiconductor devices 9 stored in the magazine 8 into the plurality of sockets 5a provided on the burn-in board 5 is automatically performed. Then, the burn-in board 5 in which the semiconductor device 9 is mounted on each of the plurality of sockets 5a via the leads 9b,
It is carried out to the aging section (not shown) and the burn-in
A predetermined operation test or the like is performed by applying a predetermined operation signal or the like to the plurality of semiconductor devices 9 mounted on the board 5. On the other hand, the work of removing the semiconductor device 9 from the burn-in board 5 on which the plurality of semiconductor devices 9 that have undergone a predetermined operation test or the like is mounted is performed in the second housing 101 in the following procedure. Will be First, the burn-in board 5 in which the tested semiconductor device 9 is mounted in each of the plurality of sockets 5a is set on the feed base 102, and the plurality of empty magazines 8 are mounted on the fixed base 14. Set. Next, with the holding block 111 lowered to the height of the package 9a of the semiconductor device 9 mounted on the socket 5a of the burn-in board 5, the feed block 102 is moved to the holding block 1.
The package 9a of a plurality of semiconductor devices 9 which are moved to a side of 11 by a predetermined distance and are mounted on the burn-in board 5 in a row in a direction intersecting a feed direction of a plurality of sockets 5a arranged in a grid pattern. Each of the holding grooves 1 of the holding block 111
Housed inside each of 11a. In this state, by raising the holding block 111, the lead 9b of the semiconductor device 9 in which the package 9a is held in the holding groove 111a is removed from the socket 5a, and the gate form 11
It rises to the height of the magazine 8 inside 0. Further, by operating the pressing mechanism 15 so as to protrude into each holding groove 111a of the holding block 111,
The semiconductor devices 9 housed in the respective holding grooves 111a move into the empty magazines 8, respectively. Next, the holding block 111 is lowered to the height of the socket 5a of the burn-in board 5 again, and is mounted on the plurality of sockets 5a of the burn-in board 5 by repeating the above-described series of operations. The operation of removing the semiconductor device 9 and storing it in the magazine 8 is automatically performed. Then, the magazine 8 in which a predetermined number of semiconductor devices 9 are stored is carried out in the next packing step or the like. Thus, in the present embodiment, the plurality of holding grooves 11a
By appropriately combining the elevating operation of the holding block 11 (111) on which the (111a) is formed and the feeding operation of the feed base 2 (102), the socket of the burn-in board 5 is provided.
Since the operations of inserting and removing the plurality of semiconductor devices 9 from and into the magazine 5a and the operations of taking out and storing the semiconductor devices 9 into and from the magazine 8 are automatically performed, for example, a complicated mechanism for gripping the individual semiconductor devices 9 is unnecessary. And the structure is simplified. Further, the work can be performed reliably and promptly without human intervention, for example, without causing the lead 9b of the semiconductor device 9 to be deformed due to carelessness of the worker. Semiconductor device 9 for 5
It is possible to reduce the time required for insertion and withdrawal work. As described above, in the present embodiment, the following effects can be obtained. (1). By appropriately combining the elevating operation of the holding block 11 (111) in which the plurality of holding grooves 11a (111a) are formed and the feeding operation of the feed base 2 (102), the socket 5a of the burn-in board 5 is Plural semiconductor devices 9
Insertion and removal of the semiconductor device 9 and removal and storage of the semiconductor device 9 in and from the magazine 8 are automatically performed. Therefore, for example, a complicated mechanism for gripping each semiconductor device 9 is not required, and the structure is simplified. In addition, the work can be performed reliably and promptly without human intervention in the work, for example, without causing the lead 9b of the semiconductor device 9 to be damaged due to carelessness of the worker. The time required for inserting and removing the semiconductor device 9 from and to the board 5 can be reduced. (2). As a result of the above (1), burn
Semiconductor device 9 inserted / extracted from / in board 5
Of the semiconductor device 9 can be increased.
It is possible to improve the productivity of the aging process before shipping or receiving. (3). As a result of the above (1), the occurrence of defects such as deformation of the leads 9b of the semiconductor device 9 in the inspection process is reduced, and the quality of the semiconductor device 9 is improved. Although the invention made by the inventor has been specifically described based on the embodiment, the present invention is not limited to the embodiment, and it is needless to say that various modifications can be made without departing from the gist of the invention. Nor. For example, articles to be inserted and removed are not limited to a zigzag-in-line package type semiconductor device and may be general electronic components. In the above description, the case where the invention made by the present inventor is applied to the insertion / removal work in the inspection process of the semiconductor device, which is the application field which is the background of the invention, has been described. The present invention can be widely applied to technologies that require quick insertion and removal of articles. [Effects of the Invention] The effects obtained by typical ones of the inventions disclosed in the present application will be briefly described as follows. That is, according to the insertion device and the withdrawal device of the present invention, it is only necessary to store an article in each of the plurality of holding grooves provided in the holding block. The structure is simplified because there is no need to provide a movable mechanism and the like, and since no manual work is involved in the series of operations, the work time required for inserting and removing a plurality of articles without causing damage to the articles is reduced. Can be. Further, since the holding block in the present invention is reciprocated linearly in the projecting direction of the terminal of the article, a load is hardly applied to the terminal in the lateral direction, and the occurrence of terminal bending failure can be suppressed. Furthermore, in the insertion device and the removal device of the present invention, articles used for both the insertion and removal operations are almost common, and the insertion and removal operations can be performed by the same device. Further, since the tilting table returns to the horizontal position from the tilting position in the insertion device and the removal device of the present invention, it is possible to prevent troubles such as catching of the articles when the articles are taken out of the magazine into the holding grooves.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a first housing constituting an insertion device according to an embodiment of the present invention, FIG. 2 is a plan view thereof, FIGS. 3 (a) and (b) ) Is a front view and a side view of the holding block, respectively. FIG. 4 is a cross-sectional view of the first housing, FIG. 5 is a cross-sectional view of the same, and FIG. FIG. 7 is a plan view, FIG. 8 is a sectional view thereof, and FIG. 9 is a sectional view thereof. 1, first housing 101, second housing 2, 102, feed bar, 2a, 102a positioning pin, 2b, 102b locking piece, 3,
103 ... rail, 4,104 ... roller, 5 ... burn-in board (substrate), 5a ... socket, 6 ... support piece, 7
… Tilting table, 7a, 7b… Magazine guide, 8… Magazine, 9… Semiconductor device (article), 9a …… Package, 9b
…… lead, 10,110 …… gate formwork, 10a, 110a …… guide shaft,
10b, 110b …… Drive cylinder, 11,111 …… Holding block,
11a, 111a: Holding groove, 12: Stopper, 13: Fixing piece,
14: fixed base, 14a, 14b: magazine guide, 14c: stopper, 15: pressing mechanism.

Claims (1)

(57) [Claims] An insertion device that inserts an article formed by projecting terminals in a package into sockets arranged on a substrate, and a feed base that performs a feeding operation by placing the substrate on which the plurality of sockets are arranged, A plurality of magazines accommodating a plurality of articles in a row, respectively, are detachably mounted at predetermined intervals in a posture parallel to the moving direction of the feed table, and a tilting table capable of performing tilting and horizontal return operations at a desired angle. And, it is installed to intersect with the feed direction of the feed table, it is possible to vertically move to the feed table, at the ascending position in the axial direction with the opening end of each magazine placed on the tilting table A plurality of penetrating holding grooves are formed, and the holding grooves are processed into a shape conforming to the outer shape of the article so as to hold the article movably in the feed direction of the feed table, and tilt the tilt table. By the said magazine A holding block in which the article in the housing is moved into the holding groove by its own weight and one article is stored and stopped, and after the article is held in each holding groove, the tilting table is returned horizontally. The feeder is positioned below the holding block in advance, for a socket arranged on the placed substrate, the holding block is moved down, the held article is inserted into the socket, An insertion device characterized in that, by operating the feed table in the inserted state, the holding of the article inserted into the holding groove of the holding block is released. 2. The article is a zigzag-in-line package type semiconductor device in which the terminals protrude from one side of the package in the width direction, and the substrate is a burn-in board for aging the semiconductor device. The insertion device according to claim 1, characterized in that: 3. What is claimed is: 1. A removing device for removing an article having terminals protruded from a package inserted into sockets arranged on a substrate, wherein the substrate comprises a plurality of sockets arranged thereon and performs a feeding operation. A table, comprising a plurality of holding grooves processed into a shape adapted to the outer shape of the article so as to hold the article movably in the feed direction of the feed table, and capable of vertically moving the feed table. A holding block, a fixed base for detachably mounting a plurality of magazines capable of accommodating a plurality of the articles in a row at predetermined intervals in a posture parallel to the moving direction of the feed base; and And a pressing mechanism for moving the article housed in the holding groove.In a state where the holding block is lowered to the insertion position of the substrate, the feed table is operated to feed, and the substrate mounted on the feed table is moved. Array The article is inserted into the socket,
The holding block is housed in the holding groove, the holding block is raised, the stored article is removed, and the holding groove is positioned by aligning the axis with the opening of the magazine placed on the fixing base. The removal device, wherein the pressing mechanism pushes out the article stored in the holding groove of the holding block into the magazine and stores the article. 4. The article is a zigzag-in-line package type semiconductor device in which the terminals protrude from one side of the package in the width direction, and the substrate is a burn-in board for aging the semiconductor device. The removal device according to claim 3, characterized in that: