JPH01165650U - - Google Patents
Info
- Publication number
- JPH01165650U JPH01165650U JP6262588U JP6262588U JPH01165650U JP H01165650 U JPH01165650 U JP H01165650U JP 6262588 U JP6262588 U JP 6262588U JP 6262588 U JP6262588 U JP 6262588U JP H01165650 U JPH01165650 U JP H01165650U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- wings
- cover
- claws
- opposite end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 3
- 239000000919 ceramic Substances 0.000 claims 1
- 210000000078 claw Anatomy 0.000 claims 1
Description
第１図ａ及びｂはそれぞれ本考案の一実施例の
平面図及び側面図、第２図は従来のＩＣパツケー
ジの一例の側面図である。 １……ＩＣ本体、２……基板、３，３ａ……カ
バー、４……爪、５……羽。
平面図及び側面図、第２図は従来のＩＣパツケー
ジの一例の側面図である。 １……ＩＣ本体、２……基板、３，３ａ……カ
バー、４……爪、５……羽。
Claims (1)
- 上面にＩＣ本体を搭載するセラミツクの基板と
、該基板の前記ＩＣ本体搭載側の上面を覆い両端
に前記基板の対向する端面をはさみ込む爪を設け
前記ＩＣ本体の上部領域に複数の羽を設けるカバ
ーとを有することを特徴とするＩＣパツケージ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6262588U JPH01165650U (ja) | 1988-05-11 | 1988-05-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6262588U JPH01165650U (ja) | 1988-05-11 | 1988-05-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01165650U true JPH01165650U (ja) | 1989-11-20 |
Family
ID=31288218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6262588U Pending JPH01165650U (ja) | 1988-05-11 | 1988-05-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165650U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6881896B2 (en) | 2003-05-20 | 2005-04-19 | Nec Compound Semiconductor, Ltd. | Semiconductor device package |
-
1988
- 1988-05-11 JP JP6262588U patent/JPH01165650U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6881896B2 (en) | 2003-05-20 | 2005-04-19 | Nec Compound Semiconductor, Ltd. | Semiconductor device package |