JPH01165243U - - Google Patents
Info
- Publication number
- JPH01165243U JPH01165243U JP6124088U JP6124088U JPH01165243U JP H01165243 U JPH01165243 U JP H01165243U JP 6124088 U JP6124088 U JP 6124088U JP 6124088 U JP6124088 U JP 6124088U JP H01165243 U JPH01165243 U JP H01165243U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- thermal head
- face
- resistor
- thermal conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図及び第２図はそれぞれ本考案による端面
型サーマルヘツドの一実施例の要部を示す部分断
面図及び部分平面図、第３図は本考案の一実施例
の説明に使用する部分平面図、第４図及び第５図
はそれぞれ従来の端面型サーマルヘツドの一例の
要部を示す部分断面図及び部分平面図である。
１０……下側基板、１１……抵抗体層、１２…
…発熱抵抗体、１３，１４……電極層、１５……
金属層（高熱伝導率部材層）、１６……保護膜層
、１７……接着剤層、１８……上側基板。
1 and 2 are a partial sectional view and a partial plan view, respectively, showing essential parts of an embodiment of an end-face type thermal head according to the present invention, and FIG. 3 is a partial plane view used to explain an embodiment of the present invention. 4 and 5 are a partial sectional view and a partial plan view, respectively, showing essential parts of an example of a conventional end-face type thermal head. 10...Lower substrate, 11...Resistor layer, 12...
...Heating resistor, 13, 14... Electrode layer, 15...
Metal layer (high thermal conductivity member layer), 16... protective film layer, 17... adhesive layer, 18... upper substrate.
Claims (1)
基板の上記一端部側の端面に沿つて記録媒体を摺
動させて印字を行うように成された端面型サーマ
ルヘツドにおいて、 上記基板上方の上記端面側に、上記発熱抵抗体
に接触する高熱伝導率部材層を形成したことを特
徴とする端面型サーマルヘツド。[Claims for Utility Model Registration] An edge type in which a heating resistor is formed on one end of the upper surface of a substrate, and printing is performed by sliding a recording medium along the end surface of the one end of the substrate. An end face type thermal head characterized in that a high thermal conductivity material layer that contacts the heat generating resistor is formed on the end face side above the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6124088U JPH01165243U (en) | 1988-05-10 | 1988-05-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6124088U JPH01165243U (en) | 1988-05-10 | 1988-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01165243U true JPH01165243U (en) | 1989-11-17 |
Family
ID=31286915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6124088U Pending JPH01165243U (en) | 1988-05-10 | 1988-05-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165243U (en) |
-
1988
- 1988-05-10 JP JP6124088U patent/JPH01165243U/ja active Pending
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