JPH0116382B2 - - Google Patents

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Publication number
JPH0116382B2
JPH0116382B2 JP55185126A JP18512680A JPH0116382B2 JP H0116382 B2 JPH0116382 B2 JP H0116382B2 JP 55185126 A JP55185126 A JP 55185126A JP 18512680 A JP18512680 A JP 18512680A JP H0116382 B2 JPH0116382 B2 JP H0116382B2
Authority
JP
Japan
Prior art keywords
humidity
thermistor
temperature
sensitive element
sensing element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55185126A
Other languages
Japanese (ja)
Other versions
JPS57110950A (en
Inventor
Shigeki Uno
Mitsuo Harada
Masaki Katsura
Hideaki Hiraki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP55185126A priority Critical patent/JPS57110950A/en
Publication of JPS57110950A publication Critical patent/JPS57110950A/en
Publication of JPH0116382B2 publication Critical patent/JPH0116382B2/ja
Granted legal-status Critical Current

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/12Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
    • G01N27/121Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid for determining moisture content, e.g. humidity, of the fluid

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
  • Non-Adjustable Resistors (AREA)

Description

【発明の詳細な説明】 本発明は、湿度測定時において、感湿素体の温
度も同時に測定できる構造の感湿素子に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a humidity sensing element having a structure that can simultaneously measure the temperature of a humidity sensing element when measuring humidity.

湿度を測定するために、MnWO4、MgCrO4
TiO2などの金属酸化物の焼結体であつて、周辺
雰囲気の湿度変化に対応して自らの電気抵抗を変
化する性質を有する感湿素体に、その電気抵抗測
定用の電極を添着した構造の感湿素子が用いられ
ている。
To measure humidity, MnWO4 , MgCrO4 and
An electrode for measuring electrical resistance is attached to a moisture-sensitive element, which is a sintered body of metal oxide such as TiO 2 and has the property of changing its electrical resistance in response to changes in the humidity of the surrounding atmosphere. A moisture-sensitive element with a structure is used.

この感湿素子は、ある温度におけるある湿度雰
囲気に置かれて用いられる。このとき、上記の焼
結体(感湿素体という)の電気抵抗を測定し、そ
の値を、予め作成してあるその温度における既知
湿度と電気抵抗値との関係図から周辺雰囲気の湿
度を換算するものである。
This humidity sensing element is used by being placed in a certain humidity atmosphere at a certain temperature. At this time, the electrical resistance of the above-mentioned sintered body (referred to as a humidity-sensitive element) is measured, and the value is calculated from the relationship diagram between the known humidity at that temperature and the electrical resistance value, which has been created in advance. It is to be converted.

このように、感湿素子においては、該感湿素体
の電気抵抗の変化が重要な意味を有するが、この
電気抵抗はその温度によつても変化する。すなわ
ち、感湿素体は温度依存性を有している。
As described above, in a humidity sensing element, a change in the electrical resistance of the humidity sensing element body has an important meaning, but this electrical resistance also changes depending on the temperature. That is, the humidity sensitive element has temperature dependence.

そのため、ある温度及び湿度の雰囲気中に感湿
素子が置かれ、かつ感湿素子自体の温度が雰囲気
温度と異なる場合には、感湿素子の電気抵抗から
読み取られる湿度の値は、感湿素子自体の温度に
おける値であつて、雰囲気の湿度を正確に表示す
るものではない。
Therefore, if a humidity sensing element is placed in an atmosphere with a certain temperature and humidity, and the temperature of the humidity sensing element itself is different from the ambient temperature, the humidity value read from the electrical resistance of the humidity sensing element will be The value is based on the temperature itself, and does not accurately indicate the humidity of the atmosphere.

とりわけ、雰囲気が動いている場合(例えば、
大気流)には、感湿素子の表面から蒸発する水が
感湿素子から奪う蒸発熱は無視し得ず、その結
果、感湿素子自体の温度が雰囲気温度よりも低下
することがある。例えば、風速約10m/secのと
き、感湿素子の温度は周辺大気流の温度よりも約
2℃程低下し、それは、感湿素子からの読み取り
湿度の値と周辺気流の真の湿度の値との間で、相
対湿度にして2〜3%の誤差をうみ出すことにも
なる。
Especially if the atmosphere is moving (e.g.
In the atmospheric flow), the heat of evaporation taken away from the humidity sensing element by water evaporating from the surface of the humidity sensing element cannot be ignored, and as a result, the temperature of the humidity sensing element itself may fall below the ambient temperature. For example, when the wind speed is approximately 10 m/sec, the temperature of the humidity sensing element is approximately 2°C lower than the temperature of the surrounding airflow, which is the difference between the humidity value read from the humidity sensing element and the true humidity value of the surrounding airflow. This results in an error of 2 to 3% in relative humidity.

このようなことから、感湿素子で湿度を測定す
る場合、正確な湿度を測定するためには、感湿素
子自体の温度を正確に知ることが必要である。
For this reason, when measuring humidity with a humidity sensing element, in order to accurately measure humidity, it is necessary to accurately know the temperature of the humidity sensing element itself.

このために、感湿素体の両面に電極を付設し、
該電極を介して1MHz以上の高周波電流を印加す
ることにより該感湿素体の誘電率を測定し、その
値から該感湿素体の温度を知るという方法が提案
されている。しかしながら、この方法は、極めて
繁雑な測定回路を必要とするのみならず、温度測
定の精度も充分ではないという欠点があつた。
For this purpose, electrodes are attached to both sides of the moisture-sensitive element.
A method has been proposed in which the dielectric constant of the moisture sensitive element is measured by applying a high frequency current of 1 MHz or more through the electrode, and the temperature of the moisture sensitive element is determined from the measured value. However, this method not only requires an extremely complicated measuring circuit, but also has the disadvantage that the accuracy of temperature measurement is not sufficient.

本発明は、上記のような問題点を解消する感湿
素子の提供を目的とするものである。
An object of the present invention is to provide a moisture-sensitive element that solves the above-mentioned problems.

すなわち、本発明の感湿素子は、基板と、該基
板上に厚膜法で形成された厚みが1〜30μmのサ
ーミスタと、該サーミスタ上に同じく厚膜法で形
成された感湿素体との一体的積層体であつて、該
サーミスタが一方の電極を兼ねる構造であること
を特徴とする。
That is, the humidity-sensitive element of the present invention includes a substrate, a thermistor having a thickness of 1 to 30 μm formed on the substrate by the thick-film method, and a moisture-sensitive element body also formed on the thermistor by the thick-film method. The integrated laminate is characterized in that the thermistor also serves as one of the electrodes.

本発明の感湿素子は、サーミスタが温度検出素
子、感湿素体が湿度検出素子を構成しており、両
者が一体的に積層されているため、感湿素体の温
度は密着するサーミスタによつて測定することが
できる。
In the humidity sensing element of the present invention, the thermistor constitutes the temperature detection element, and the humidity sensing element constitutes the humidity detection element, and since both are integrally laminated, the temperature of the humidity sensing element is determined by the thermistor that is in close contact with it. It can be measured accordingly.

本発明の感湿素子を作成するに当つては、まず
基板の上にサーミスタ層が形成される。基板とし
ては、例えばアルミナ焼結板、ステアタイト焼結
板のような耐熱・絶縁性のセラミツク板をあげる
ことができるが、通常は耐熱性にすぐれるアルミ
ナ焼結板が好んで用いられる。
In producing the moisture sensitive element of the present invention, first a thermistor layer is formed on a substrate. As the substrate, heat-resistant and insulating ceramic plates such as an alumina sintered plate and a steatite sintered plate can be used, but an alumina sintered plate having excellent heat resistance is usually used preferably.

サーミスタ層は、半導体デバイスの製作技術に
おいて汎用されている厚膜法を適用して形成され
る。即ち、上記基板上に、サーミスタの原料粉末
を適宜なバンダーと混練して成る厚膜ペースト
を、例えば、スクリーン印刷法、塗布法などによ
つて所定パターンに印刷又は塗布した後、これを
適宜な温度で焼付ける。
The thermistor layer is formed by applying a thick film method that is commonly used in semiconductor device manufacturing technology. That is, a thick film paste made by kneading raw material powder for the thermistor with a suitable bander is printed or applied on the substrate in a predetermined pattern by, for example, screen printing or coating, and then this is coated in an appropriate manner. Bake at temperature.

このとき、用いるサーミスタとしては、いわゆ
るサーミスタ特有の電気抵抗の温度依存性を有す
るものであれば、何を用いてもよい。また、形成
されるサーミスタの層厚は、特別限定されない
が、通常1〜30μmの範囲内にあることが好まし
い。
At this time, any thermistor may be used as long as it has the temperature dependence of electrical resistance peculiar to a thermistor. Further, the layer thickness of the thermistor to be formed is not particularly limited, but it is usually preferably within the range of 1 to 30 μm.

このサーミスタの上には、感湿素体の原料粉末
を適宜なバインダーと混練して成る厚膜ペースト
を、上記と同様の方法で印刷又は塗布した後、焼
付けて感湿素体の厚膜が形成される。
On top of this thermistor, a thick film paste made by kneading the raw material powder of the moisture sensitive element with an appropriate binder is printed or applied in the same manner as above, and then baked to form a thick film of the moisture sensitive element. It is formed.

感湿素体としては、感湿特性を有するものであ
れば何を用いてもよい。また、その厚みは通常1
〜30μの範囲内にあることが好ましい。
As the moisture-sensitive element, any material may be used as long as it has moisture-sensitive properties. Also, its thickness is usually 1
It is preferably within the range of ~30μ.

このようにして、基板、サーミスタ、感湿素体
はこの順序で積層されて一体的構造体を形成す
る。該構造体には、サーミスタ、感湿素体の電気
抵抗を測定するためのリード線が、それぞれ付設
されて本発明の感湿素子が構成される。
In this manner, the substrate, thermistor, and moisture sensitive element are laminated in this order to form an integral structure. A thermistor and lead wires for measuring the electrical resistance of the humidity sensing element are respectively attached to the structure to constitute the humidity sensing element of the present invention.

サーミスタへのリード線の付設は、基板上への
サーミスタ層の形成に先だつて、該基板上の所定
位置に、例えば白金ペーストを焼付け、それに白
金線を焼付けた後、この上から上記のようにして
サーミスタ層を形成するのが好ましい。
To attach lead wires to the thermistor, before forming the thermistor layer on the substrate, for example, bake platinum paste at a predetermined position on the substrate, bake a platinum wire thereon, and then apply the method described above on top of the platinum paste. It is preferable to form the thermistor layer using the same method.

また、感湿素体へのリード線の付設は、感湿素
体の表面に例えば、金ペーストを適宜なパターン
でスクリーン印刷し、これを焼付けた後、ここに
金リード線を熱圧着して容易に行なうことができ
る。
In addition, to attach lead wires to the humidity-sensitive element, for example, screen print gold paste in an appropriate pattern on the surface of the humidity-sensitive element, bake this, and then heat-press the gold lead wires here. It can be done easily.

本発明の感湿素子を用いて湿度測定する場合に
は、サーミスタは上部に積層する感湿素体の温度
に相当する電気抵抗を示し、それは、該サーミス
タに付設されたリード線からの電気信号として検
出される。また、感湿素体のその温度における電
気抵抗値は、該感湿素体の表面に付設したリード
線とサーミスタに付設されたリード線を抵抗測定
回路に接続することによつて測定される。このと
き、測定される電気抵抗値は、感湿素体の抵抗と
サーミスタの抵抗の重畳したものとなるが、感湿
素体の抵抗はサーミスタの抵抗に比べて概ね20倍
以上と大きいため、通常の湿度測定の条件下で
は、サーミスタの抵抗を無視しても大きな誤差を
生じる虞れはない。
When measuring humidity using the humidity sensing element of the present invention, the thermistor exhibits an electrical resistance corresponding to the temperature of the humidity sensing element layered on top, and this is due to the electric signal from the lead wire attached to the thermistor. Detected as . Further, the electrical resistance value of the humidity sensitive element at that temperature is measured by connecting a lead wire attached to the surface of the humidity sensitive element and a lead wire attached to the thermistor to a resistance measuring circuit. At this time, the electrical resistance value measured is the superposition of the resistance of the humidity-sensitive element and the resistance of the thermistor, but since the resistance of the humidity-sensitive element is approximately 20 times larger than the resistance of the thermistor, Under normal humidity measurement conditions, the resistance of the thermistor can be ignored without causing a large error.

このように、本発明の感湿素子においては、サ
ーミスタは温度検出素子であるとともに、感湿素
体の一方の電極をも兼ねるものである。
As described above, in the humidity sensing element of the present invention, the thermistor serves not only as a temperature sensing element but also as one electrode of the humidity sensing element.

本発明の感湿素子で湿度は次のようにして測定
される。まず、該感湿素子の構成部材であるサー
ミスタの温度−抵抗特性関係図並びに感湿素子自
体の各温度における湿度−抵抗特性関係図を予め
作成しておく。そのうえで、ある雰囲気に該感湿
素子を置き、このときのサーミスタの電気抵抗を
測定する。この測定値と上記温度−抵抗特性関係
図から、該サーミスタ、即ちその上に積層する感
湿素体の温度を知る。感湿素体から測定された電
気抵抗値は、前記温度における該感湿素体の湿度
−抵抗特性関係図と照合されて、湿度が読みとら
れる。
Humidity is measured using the humidity sensing element of the present invention as follows. First, a temperature-resistance characteristic relationship diagram of the thermistor, which is a component of the humidity-sensitive element, and a humidity-resistance characteristic relationship diagram at each temperature of the humidity-sensing element itself are created in advance. Then, the humidity sensing element is placed in a certain atmosphere, and the electrical resistance of the thermistor at this time is measured. From this measured value and the above-mentioned temperature-resistance characteristic relationship diagram, the temperature of the thermistor, that is, the humidity sensitive element layered thereon, is known. The electrical resistance value measured from the humidity sensitive element is compared with the humidity-resistance characteristic relationship diagram of the humidity sensitive element at the temperature, and the humidity is read.

本発明の感湿素子は、以上のように構成される
ので、湿度を電気抵抗値に読み直す感湿素体自体
の温度を同時に測定することができるので、湿度
の測定精度を高めることができるとともに、全体
の形状を非常にコンパクトにすることができると
いう利点を有している。
Since the humidity sensing element of the present invention is configured as described above, it is possible to simultaneously measure the temperature of the humidity sensing element itself, which rereads the humidity as an electrical resistance value, thereby increasing the accuracy of humidity measurement. , it has the advantage that the overall shape can be made very compact.

以下、本発明を実施例に基づいて説明する。 Hereinafter, the present invention will be explained based on examples.

実施例 (1) 感湿素体の調製 酸化亜鉛、酸化クロム、酸化チタンの粉末
を、それぞれモル比で50%、40%、10%秤量
し、これらを湿式ポツトミルで充分に混合し
た。ついで、この混合粉末を120℃で充分に乾
燥した後、空気中で1200℃、2時間加熱処理し
て焼結体とし、該焼結体をライカイ機で充分に
粉砕して粒径0.5〜3.0μmの感湿素体の微粉と
した。
Example (1) Preparation of moisture-sensitive element Powders of zinc oxide, chromium oxide, and titanium oxide were weighed in molar ratios of 50%, 40%, and 10%, respectively, and thoroughly mixed in a wet pot mill. Next, this mixed powder was sufficiently dried at 120°C, and then heat-treated in air at 1200°C for 2 hours to form a sintered body.The sintered body was thoroughly pulverized with a Raikai machine to obtain a particle size of 0.5 to 3.0. It was made into a fine powder of a moisture-sensitive material of μm.

(2) サーミスタの調製 酸化コバルト、酸化ニツケルの粉末をモル比
で85%、15%秤量し、これらを湿式ポツトミル
で充分混合した。ついで、この混合粉末を120
℃で充分に乾燥した後、空気中で1250℃、4時
間加熱処理して焼結体とし、該焼結体をライカ
イ機で充分に粉砕して粒径0.5〜3.0μmのサー
ミスタの微粉とした。
(2) Preparation of thermistor Cobalt oxide and nickel oxide powders were weighed at a molar ratio of 85% and 15%, and thoroughly mixed in a wet pot mill. Next, add this mixed powder to 120
After sufficiently drying at °C, heat treatment was performed in air at 1250 °C for 4 hours to form a sintered body, and the sintered body was thoroughly ground in a Raikai machine to obtain fine thermistor powder with a particle size of 0.5 to 3.0 μm. .

(3) 感湿素子の作成 まず、調製された感湿素体の微粉に、該微粉
に対して5重量%のホウケイ酸ガラスの粉末
(約1.0μmの粒径)を加えて充分に混合した後、
該混合粉末に溶剤としてテレピネオールを適量
添加してペースト状になるまで充分混練し、感
湿素体用厚膜ペーストを調製した。
(3) Creation of moisture-sensitive element First, 5% by weight of borosilicate glass powder (particle size of approximately 1.0 μm) was added to the fine powder of the prepared moisture-sensitive element and mixed thoroughly. rear,
A suitable amount of terpineol as a solvent was added to the mixed powder and thoroughly kneaded until it became a paste, thereby preparing a thick film paste for a moisture sensitive element.

また、調製された前記サーミスタの微粉に、
該微粉に対し8重量%のホウケイ酸ガラスの粉
末(約1.0μmの粒径)を加えて充分に混合した
後、該混合粉末に溶剤としてテレピネオールを
適量添加してペースト状になるまで充分混練し
サーミスタ用厚膜ペーストを調製した。
In addition, the fine powder of the thermistor prepared above,
After adding 8% by weight of borosilicate glass powder (particle size of about 1.0 μm) to the fine powder and mixing thoroughly, add an appropriate amount of terpineol as a solvent to the mixed powder and knead thoroughly until it becomes paste-like. A thick film paste for thermistor was prepared.

そのうえで、たて5mm横4mm厚さ0.5mmのア
ルミナ焼結板を基板として用意した。該基板の
片面の両端に、長さ4mm幅1mmの帯状に白金ペ
ーストを1対塗布し、それぞれの塗布白金ペー
ストには白金リード線を添着した後、全体を
1000℃で焼付けた。
Then, an alumina sintered plate measuring 5 mm in length, 4 mm in width, and 0.5 mm in thickness was prepared as a substrate. A pair of platinum paste was applied in the form of a strip of 4 mm in length and 1 mm in width on both ends of one side of the board, and after attaching a platinum lead wire to each coated platinum paste, the whole was
Baked at 1000℃.

この上に前記のサーミスタ用厚膜ペーストを
たて4.5mm横3.5mmの広さに亘つてスクリーン印
刷し、これを800℃で焼付けた。得られたサー
ミスタの層の厚みは約10μmであつた。
On top of this, the thick film paste for thermistor was screen printed over an area of 4.5 mm wide and 3.5 mm wide, and baked at 800°C. The thickness of the obtained thermistor layer was approximately 10 μm.

ついで、この上に、前記の感湿素体用厚膜ペ
ーストをたて4.5mm横3.5mmの広さに亘つてスク
リーン印刷し、同じく800℃で焼付けた。得ら
れた感湿素体の層の厚みは約10μmであつた。
Then, the thick film paste for the moisture-sensitive element described above was screen printed over an area of 4.5 mm vertically and 3.5 mm horizontally, and baked at 800°C. The thickness of the layer of the obtained moisture-sensitive element was approximately 10 μm.

その後、感湿素体の表面に、金ペーストを櫛
型パターンにスクリーン印刷して750℃で焼付
けた後、ここに常法により金リード線を熱圧着
して本発明の感湿素子を作成した。
Thereafter, gold paste was screen-printed in a comb-shaped pattern on the surface of the humidity-sensitive element and baked at 750°C, followed by thermocompression bonding of gold lead wires using a conventional method to create the humidity-sensitive element of the present invention. .

(4) 感湿特性の測定 感湿特性の測定に先立つて、まず前記感湿素
子のサーミスタの温度−抵抗特性を求めた。
(4) Measurement of humidity-sensitive characteristics Prior to measuring the humidity-sensitive characteristics, the temperature-resistance characteristics of the thermistor of the humidity-sensitive element were first determined.

基板に付設された1対の白金リード線をサー
ミスタ抵抗測定回路に接続した後、素子全体を
各種温度の雰囲気に一定時間放置して熱的平衡
に達した時点で、該サーミスタの電気抵抗を測
定した。その結果を第1図に示した。なお、こ
のとき、雰囲気の温度はクロメル・アルメル熱
電対を用いて直接測定した。
After connecting a pair of platinum lead wires attached to the board to the thermistor resistance measurement circuit, the entire element is left in an atmosphere at various temperatures for a certain period of time, and when thermal equilibrium is reached, the electrical resistance of the thermistor is measured. did. The results are shown in Figure 1. At this time, the temperature of the atmosphere was directly measured using a chromel-alumel thermocouple.

ついで、感湿素体表面に付設された金リード
線と前記白金リード線の1本を感湿素体抵抗測
定回路に接続し、全体を風速0.5m/secの25℃
気流中に置いた。このとき、雰囲気の温度はク
ロメル・アルメル熱電対を用いて直接測定し
た。
Next, the gold lead wire attached to the surface of the humidity sensing element and one of the platinum lead wires were connected to the humidity sensing element resistance measuring circuit, and the whole was heated at 25°C with a wind speed of 0.5 m/sec.
placed in an air stream. At this time, the temperature of the atmosphere was directly measured using a chromel-alumel thermocouple.

しかしながら、サーミスタの電気抵抗は102
Ωであつた。これは、前記のサーミスタ温度−
抵抗特性(第1図)によれば24.5℃に相当する
ものであつた。
However, the electrical resistance of the thermistor is 102
It was Ω. This is the thermistor temperature -
According to the resistance characteristics (Figure 1), it was equivalent to 24.5°C.

気流温度を25℃に保つて相対湿度を変化さ
せ、そのときの感湿素体の電気抵抗を測定し、
第2図に示した感湿特性を得た。したがつて、
この感湿特性は、感湿素体の温度が24.5℃のも
のである。
The airflow temperature was maintained at 25℃, the relative humidity was varied, and the electrical resistance of the humidity-sensitive element was measured at that time.
The moisture sensitivity characteristics shown in FIG. 2 were obtained. Therefore,
This humidity-sensitive characteristic is based on a temperature of the humidity-sensitive element of 24.5°C.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本発明の感湿素子内サーミスタの温
度−抵抗特性、第2図は、本発明感湿素子内感湿
素体の温度24.5℃における感湿特性を示す図であ
る。
FIG. 1 is a diagram showing the temperature-resistance characteristics of the thermistor within the humidity sensing element of the present invention, and FIG. 2 is a diagram showing the humidity sensitivity characteristics of the humidity sensing element body within the humidity sensing element of the present invention at a temperature of 24.5°C.

Claims (1)

【特許請求の範囲】 1 基板と、該基板上に厚膜法で形成された厚み
が1〜30μmのサーミスタと、該サーミスタ上に
厚膜法で形成された感湿素体との一体的積層体で
あつて、該サーミスタが一方の電極を兼ねる構造
の感湿素子。 2 該基板が、絶縁性セラミツク板である特許請
求の範囲第1項記載の感湿素子。 3 該絶縁性セラミツク板が、アルミナ焼結板若
しくはステアタイト焼結板である特許請求の範囲
第2項記載の感湿素子。
[Scope of Claims] 1. An integral lamination of a substrate, a thermistor with a thickness of 1 to 30 μm formed on the substrate by a thick film method, and a moisture-sensitive element body formed on the thermistor by a thick film method. A moisture sensing element having a structure in which the thermistor also serves as one electrode. 2. The moisture sensitive element according to claim 1, wherein the substrate is an insulating ceramic plate. 3. The moisture-sensitive element according to claim 2, wherein the insulating ceramic plate is a sintered alumina plate or a sintered steatite plate.
JP55185126A 1980-12-27 1980-12-27 Moisture sensing element Granted JPS57110950A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55185126A JPS57110950A (en) 1980-12-27 1980-12-27 Moisture sensing element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55185126A JPS57110950A (en) 1980-12-27 1980-12-27 Moisture sensing element

Publications (2)

Publication Number Publication Date
JPS57110950A JPS57110950A (en) 1982-07-10
JPH0116382B2 true JPH0116382B2 (en) 1989-03-24

Family

ID=16165316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55185126A Granted JPS57110950A (en) 1980-12-27 1980-12-27 Moisture sensing element

Country Status (1)

Country Link
JP (1) JPS57110950A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54102147A (en) * 1978-01-30 1979-08-11 Matsushita Electric Ind Co Ltd Temperature and humidity sensor
JPS54102146A (en) * 1978-01-30 1979-08-11 Matsushita Electric Ind Co Ltd Temperature and humidity sensor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54102147A (en) * 1978-01-30 1979-08-11 Matsushita Electric Ind Co Ltd Temperature and humidity sensor
JPS54102146A (en) * 1978-01-30 1979-08-11 Matsushita Electric Ind Co Ltd Temperature and humidity sensor

Also Published As

Publication number Publication date
JPS57110950A (en) 1982-07-10

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