JPH01163013A - Insert molding method - Google Patents

Abstract

PURPOSE:To dispose required numbers of pins at a time, shorten the process and enhance the accuracy of pin positions by sucking a pin sucked to an upper hole of a lower surface of a top force to a corresponding lower hole by means of the suction of a bottom force and then filling a resin molding material in said molding die to form a base. CONSTITUTION:A top force 4 of a molding die 3 is disposed on the upper side of pins 2 oriented by an orienting jig 1, and an upper hole 5 is vacuumized by a vacuum pump connected with an open end of a suction channel 10 to suck the pins 2 to clean holes 5 by the vacuumizing force. After that, the top force 4 is placed on the upper side of a bottom force 6, and the vacuum pump is switched over to the bottom force 6 to remove the pins 2 from the upper holes 5 of the top force 4 in which pressure is normalized, while the lower ends of the pins 2 are sucked to lower holes 7 of the bottom force 6 by the suction of the bottom force 6. Then, a flat section on which the upper holes 5 of the top force 4 are not formed is disposed to the upper side of the bottom force 6 to form a cavity, and a base 8 is formed by filling a resin molding material in the molding die 3. The pins 2 are inserted into the base 8.

Description

[Detailed description of the invention] 【Technical field】

The present invention relates to a multi-pin insert molding method.

[Background technology]

Conventionally, multiple pins are placed one by one in a molding die, and the pins are embedded in the substrate by filling the resin molding material and forming the substrate. It was difficult to place it in a predetermined position, and the pin position accuracy was low (for example, the reliability was low as an electronic component such as a PGA).

[Purpose of the invention] The present invention was made in view of the above circumstances, and its purpose is to enable the necessary number of pins to be placed at once, to shorten the process time, and to achieve high pin positioning accuracy. The object of the present invention is to provide an insert molding method. [Invention disclosure]

In the insert molding method of the present invention, a plurality of pins 2 are placed between an upper mold 4 and an F mold 5 of a molding die 3 having a vacuum function using an alignment jig 1.
The pins 2 are aligned according to the hole pitch, and then the aligned pins 2
The upper mold 4 is placed above, and the upper end of the pin 2 is attracted to the upper hole 5 of the lower 11 of the upper mold 4 by suction, and then the upper mold 4 is placed above the lower mold 6, and Pin 2 from upper mold 4
The lower ends of the pins 2 are adsorbed into the lower holes 7 of the lower mold 6 by the suction action of the lower mold 6, and then the resin molding material is filled into the molding mold 3 to form the substrate 8. It is characterized by inserting the pin 2 into the hole 8, and this oval configuration achieves the above object. That is, the upper mold 4 is placed above the aligned pins 2 and the upper ends of the pins 2 are attracted to the upper holes 5 on the lower surface of the upper mold 4 by suction action, and then the upper mold 4 is placed above the lower mold 6. At the same time, the pin 2 is attached and detached from the upper mold 4, and the lower end of the pin 2 is attracted to the lower hole 7 of the lower mold 6 by the suction action of the lower mold 6, and then the resin molding material is filled into the molding mold 3. Since the pin 2 is inserted into the board 8 by forming the board 8 by
The required number of pins 2 can be arranged at one time, which shortens the process.Moreover, the position of the pin 2 is determined by the prepared hole 7, and the positional accuracy of the pin 2 is increased. Hereinafter, the present invention will be described based on embodiments shown in the accompanying drawings. The alignment jig 1 has a plurality of pin grooves 9 arranged in parallel that match the hole pitch of the upper die 4 and lower die 6 of the molding die 3, and the alignment jig 1 allows the pins 2 supplied from the parts feeder to be aligned.
are aligned by the pin grooves 9, and the pins 2 are aligned so as to match the hole pitch of the molding die 3 (see FIG. 1). Upper holes 5 and lower holes 7 are perforated at a predetermined pitch on the lower surface of the upper mold 4 and the upper surface of the lower mold 6 of the molding die 3, respectively, and these upper holes 5 and lower holes 7 are formed between the upper mold 4 and the lower mold 6. They are communicated by a suction groove 10 formed in the lower die 6 and having one end open on the outer periphery. The upper die 4 of the molding die 3 is placed above the pins 2 aligned by the alignment jig 1, and the upper hole 5 is evacuated by, for example, a vacuum pump (not shown) connected to the open end of the suction groove 10. The pin 2 is removed and the reduced pressure causes the pin 2 to be attracted to the upper hole 5 (see figure tA2). In this case, if the pin 2 is not attracted to all the upper holes 5,
Since the suction action of the upper die 4 is not sufficiently exerted, it is possible to detect a failure in the attachment of the pin 2. After this, the upper mold 4 is placed above the lower mold 6, the vacuum pump is switched to the lower mold 6, the pin 2 is removed from the upper hole 5 of the upper mold 4 which has been returned to normal pressure, and the pin 2 is removed from the upper hole 5 of the upper mold 6, which is returned to normal pressure. The lower end of the pin 2 is attracted to the lower hole 7 of the lower die 6 by suction (see FIG. 3). Next, the flat part of the upper mold 4 where the upper hole 5 is not formed is placed above the lower mold 6 to form a cavity, and in this state, the molding die 3 is filled with resin molding material to form the substrate 8. Then, as shown in FIG. 5, a molded product is manufactured in which the pin 2 is inserted into the substrate 8. According to the present invention, the upper end portion of the pin 2 sucked into the pilot hole 7 of the lower die 6 is connected to an electronic component using, for example, a lead of 7 frames, and then filled with resin molding material. A pin grid array is thereby manufactured.

【Effect of the invention】

In the present invention, the upper mold is placed above the aligned pins, and the upper ends of the pins are attracted to the upper holes on the lower surface of the upper mold by a suction action, and then the upper mold is placed above the lower mold. At the same time, the pin is removed from the upper mold, and the lower end of the pin is attracted to the lower hole of the lower mold by the suction action of the lower mold.Then, the resin molding material is filled into the molding mold to form the substrate. Since the pins are inserted in the hole, the required number of pins can be placed at one time, which shortens the process.Moreover, the position of the pin is determined by the prepared hole, and the pin position accuracy is increased.

[Brief explanation of the drawing]

FIGS. 1, 2, 3, and 4 are perspective views and sectional views showing each step of an embodiment of the present invention, and FIG. 5 is a sectional view showing a molded product manufactured by the same method. 1 is an alignment jig, 2 is a pin, 3 is a molding die, 4 is an upper die, 5 is an upper hole, 6 is a lower die, 7 is a lower hole, and 8 is a substrate. Agent Patent Attorney Ishi 1) Ai Figure 7, Figure 2, Figure 5

Claims (1)

[Claims] (1) Using an alignment jig, align multiple pins according to the hole pitch of the upper and lower molds of a molding die with vacuum function, then place the upper mold above the aligned pins to create a suction effect. The pin is attracted to the upper hole on the lower surface of the upper mold, and then the upper mold is placed above the lower mold, and the pin is detached from the upper mold, and the pin is attracted to the lower hole by the suction action of the lower mold, and then An insert molding method characterized by inserting pins into a substrate by filling a molding die with a resin molding material to form a base material.