JPH01162341A - Semiconductor resin-sealed device - Google Patents

Semiconductor resin-sealed device

Info

Publication number
JPH01162341A
JPH01162341A JP62322001A JP32200187A JPH01162341A JP H01162341 A JPH01162341 A JP H01162341A JP 62322001 A JP62322001 A JP 62322001A JP 32200187 A JP32200187 A JP 32200187A JP H01162341 A JPH01162341 A JP H01162341A
Authority
JP
Japan
Prior art keywords
vacuum
degree
mold
reached
plunger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62322001A
Other languages
Japanese (ja)
Inventor
Katsuhiko Yamazaki
勝彦 山崎
Nobutarou Ueno
上野 延太郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62322001A priority Critical patent/JPH01162341A/en
Publication of JPH01162341A publication Critical patent/JPH01162341A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To dispense with a work for confirming a vacuum gauge during a resin sealing process by a method wherein, after the interior of a metal mold is sealed, the interior is evacuated for a constant time and the degree of vacuum reached at that time is compared with a set degree of vacuum to decide whether there is an abnormality or not. CONSTITUTION:When a metal mold is brought into a state that the metal mold is clamped, a clamping detector 4 outputs a signal and a solenoid valve 2 is opened by a vacuum control means 52 to start an evacuation in the metal mold. The degree of vacuum in this metal mold is detected by a vacuum gauge 3 and the measured value is inputted in a decision means A53. The means A 53 decides whether the degree of vacuum reached a setpoint within a previously set constant time and in case the degree of vacuum reached the setpoint, a plunger 1b is driven to pour a sealing resin. In case the degree of vacuum does not reach the setpoint, a display signal is outputted to an alarm display A6 and at the same time, a signal for stopping an operation is outputted to the means 52.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、ic等の半導体を樹脂封止する半導体樹脂
封止装置の改良に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in a semiconductor resin encapsulation device for encapsulating semiconductors such as ICs with resin.

〔従来の技術〕[Conventional technology]

第8図は例えば特開昭61−41134号公報に示され
た従来の半導体樹脂封止装置を示すブロック図である。
FIG. 8 is a block diagram showing a conventional semiconductor resin encapsulation device disclosed in, for example, Japanese Patent Laid-Open No. 61-41134.

図において、(1)は樹脂封止プレス、(1a)は上部
プラテンで上部に樹脂注入用プランジャ(1b)を有し
ている。(1c)は上、下動目在な移動プラテンで上部
プラテン(1a)と下部プラテン(図示せず)間を固定
する複数のガイドバー(図示せず)に上下動自在に遊嵌
されている。(1d)は上金型で上部プラテン(1a)
に固定されている。(1e)は下金型で移動プラテン(
IC)に固定されており一上金m(〕d)−下金m(l
e)共にQ IJタンク図示せず)等の樹脂穏楕を倫え
ている。(2)は真空装置、(2a)は電磁弁、(2b
)はフィルター、(2C)は真空タンクでシ空ポンプ(
2d)の能力をできるたけ小さな容量とする為負荷の変
動平準化を目的として設けられており、′電磁弁(2a
)及びフィルタ(2b)を介して上金型(1d)又は下
金型(1e)に配管接続されている。(3)は真空計で
上金型(1d)又は下金W(le)に配置接続されてい
る。
In the figure, (1) is a resin sealing press, (1a) is an upper platen, and has a resin injection plunger (1b) at the top. (1c) is a movable platen that can move up and down, and is loosely fitted in a plurality of guide bars (not shown) that fix the upper platen (1a) and the lower platen (not shown) so that it can move up and down. . (1d) is the upper mold and the upper platen (1a)
is fixed. (1e) The moving platen (
IC), and the upper gold m (] d) - the lower gold m (l
e) Both are equipped with a resin material such as a Q IJ tank (not shown). (2) is a vacuum device, (2a) is a solenoid valve, (2b
) is a filter, (2C) is a vacuum tank and an empty pump (
The solenoid valve (2d) is provided for the purpose of leveling out load fluctuations in order to minimize the capacity of
) and a filter (2b), and are connected to the upper mold (1d) or the lower mold (1e) by piping. (3) is a vacuum gauge arranged and connected to the upper mold (1d) or the lower mold W (le).

次に動作について説明する。移動プラテン(IC)が上
昇し止金型(1d)−下金型(1e)のanが接する程
になった所で電磁弁(2a)が開放され真空ポンプ(2
d)の働きによっである所定の真空圧力に管理された真
空タンク(2C)側へ金型合せ萌部の空気がひかれ負圧
状態となる。ここで−真空計(3)の真空度を確認し、
所定の真空度に達しておわば一電磁弁(2a)が閉じら
れる。その後プランジャ(1b)によって封止用樹脂(
図示せず)を注入する。この動作を繰返す事によってI
Cの樹脂封止を行なう。
Next, the operation will be explained. When the movable platen (IC) rises to the point where the an of the stopper die (1d) and the lower die (1e) touch, the solenoid valve (2a) is opened and the vacuum pump (2
By the action of d), the air in the mold mating portion is drawn toward the vacuum tank (2C), which is controlled at a predetermined vacuum pressure, resulting in a negative pressure state. Here - check the degree of vacuum of the vacuum gauge (3),
Once a predetermined degree of vacuum is reached, one solenoid valve (2a) is closed. After that, the sealing resin (
(not shown). By repeating this operation, I
Perform resin sealing of C.

〔発明が解決しようと(る問題点] 従来の装置は以上のように構成さねているので一樹脂封
止に適した真空圧力に到達しているか否かをその都度真
空計の真空度を確認しなければならす一作業性に劣るば
かりでなく一配管系に洩れが生じている場合でも真空度
としては平常値を指示することもあり一樹脂封止作業に
おいて信頼性に劣るという問題点があった。
[Problems to be solved by the invention] Since the conventional device is configured as described above, it is necessary to check the vacuum level of the vacuum gauge each time to check whether the vacuum pressure suitable for resin sealing has been reached. Not only does this method have to be checked, but it also has problems such as poor reliability in resin sealing work, as it may indicate a normal vacuum level even if there is a leak in the piping system. there were.

この発明は上記のような問題点を解消する高番こなされ
たもので、樹脂封止作業が容易となると共番こ信頼性の
同上を図ることができる半導体樹脂封止装置を得ること
を目的とする。
This invention has been developed to solve the above-mentioned problems, and aims to provide a semiconductor resin encapsulation device that can facilitate resin encapsulation work and improve reliability. shall be.

〔問題点を解決するための手段] この発明に係る半導体樹脂封止装置は一金型内を真空引
きした後に、プランジャを駆動して樹脂をキャビティ内
に注入する半棉体樹月り封止装置番こおいて一上記金型
内を封止した後−上記金型内を真空引きする真空制御手
段、この真空“制御手段が真空引きを開始した後、定時
間内に設定真空度に到達した時にはプランジャを駆動さ
せると共に到達しない時には異常表示信号を出力する判
断手段を俯えたものである。
[Means for Solving the Problems] The semiconductor resin encapsulation device according to the present invention is a half-wafer mold sealing method in which a plunger is driven to inject resin into a cavity after the inside of a mold is evacuated. After the inside of the mold is sealed, the vacuum control means evacuates the inside of the mold, and after this vacuum control means starts evacuation, the set degree of vacuum is reached within a certain period of time. The figure is a top view of a determining means that drives the plunger when the target reaches the target and outputs an abnormality display signal when the target does not reach the target.

またーこの発明の別の発りjの半導体樹脂封止装置は、
金拒内を真空引きした後に−プランジャを駆動して樹脂
をキャビティ内に注入する半導体樹脂封止装置゛におい
て、上記金型を封止した後−上記金型内を真空引きする
真空制御手段−この真空制動手段が真空引きを開始した
後、第1の定時間内の到達真空度を第1の設定p、空腿
と比較し一異常値と判断した場合には異常表示信号を出
力する第1の判断手段−この第1の判断手段が正常値と
判断した時には第2の定1間内の到達真空度を第2の設
定真空度と比較し一上記第2の設定真空度に到達してい
る時にはプランジャを駆動させ一到達していない時には
異常表示信号を出力する第2の判断手段を倫えたもので
ある。
Furthermore, a semiconductor resin encapsulation device according to another origin of the present invention is
In a semiconductor resin sealing device that injects resin into a cavity by driving a plunger, after the inside of the mold is evacuated, after the mold is sealed, there is a vacuum control means that evacuates the inside of the mold. After the vacuum braking means starts evacuation, the degree of vacuum achieved within the first predetermined time is compared with the first setting p and the empty leg, and if it is determined to be an abnormal value, the first setting outputs an abnormality display signal. 1. Judgment means - When this first judgment means judges that it is a normal value, it compares the achieved vacuum degree within a second fixed period with the second set vacuum degree and reaches the above-mentioned second set vacuum degree. The device is equipped with a second determining means that drives the plunger when the target is reached, and outputs an abnormality display signal when the plunger has not reached the target.

[作用] この発明における半へ体樹脂封止装置は一金型内を封止
した後、定時間真空引きし−その時の到達真空度が設定
真空度と比較され、正常か異常かが判断されるため一真
空計を確認することが必要なくなり、また−装置か正常
(こ動作していることの確認を行なえる。
[Function] After sealing the inside of a mold, the half-body resin sealing device according to the present invention evacuates the inside of the mold for a certain period of time.The vacuum level reached at that time is compared with the set vacuum level to determine whether it is normal or abnormal. This eliminates the need to check the vacuum gauge, and also allows you to confirm that the equipment is operating normally.

またーこの発明の別の発明では一子め到達真空度をa認
した後に、更に一定時間真空引きし一再度到達真孕度を
whしており、真空系統の異常を早期に且つ確実に発見
できる。
In addition, in another invention of this invention, after confirming the vacuum level reached by the first child, the vacuum is further evacuated for a certain period of time and then the achieved trueness level is checked once again, so that abnormalities in the vacuum system can be detected early and reliably. can.

[発明の実施例] 以下この発明の一実施例を第1図ないし第2図番こつい
て説明する。図において−(30)は上金型(1d)と
下金型(1e)との間の真空度が所定値に達した時(こ
信号を出力する真空計−(4)は歪ケージ等により止金
型(1d)と下金型(1e)との型締め時を検出する型
締め検出器、(5)は具空計夏及び型締検出器(4)の
出力に基づき一移動プラテン(IC)、プランジャ(1
b)及び電磁弁(1b)等を駆動制御する制御装置、(
51)は型締め検出器(4)が型締め状態の信号を出力
した時にスタートするタイマA−(521は型締め検出
器(4)の出力信号に基づき電磁弁(2a)を開放し一
上金型(1d)と下金型(1e)内の真空引きを開始さ
せる真空制御手段−(転)は型締め検出器(4)の出力
信号に基づき、真空計(30)の出力信号が定時間内に
設定値に達したか否かを判断する判断手段Aで、定時間
内に設定値番こ達した時にはプランジャ(1b)を駆動
させ一到達しない時(こはアラーム表示A(6)に表示
信号を出力すると共に真空制御手段(52)に動作を停
止させるための信号を出力するものである。
[Embodiment of the Invention] An embodiment of the invention will be described below with reference to FIGS. 1 and 2. In the figure, - (30) indicates when the degree of vacuum between the upper mold (1d) and lower mold (1e) reaches a predetermined value (the vacuum gauge - (4) that outputs this signal is measured by a strain cage, etc.). A mold clamping detector (5) detects when the clamping mold (1d) and the lower mold (1e) are clamped. IC), plunger (1
b), a control device for driving and controlling the solenoid valve (1b), etc.;
51) is a timer A- (521) which starts when the mold clamping detector (4) outputs a mold clamping state signal (521 opens the solenoid valve (2a) based on the output signal of the mold clamping detector (4), The vacuum control means (rotation) that starts evacuation inside the mold (1d) and the lower mold (1e) is based on the output signal of the mold clamping detector (4), and the output signal of the vacuum gauge (30) is determined. Judgment means A determines whether or not the set value has been reached within a certain time. When the set value is reached within a certain time, the plunger (1b) is driven, and when the set value is not reached (this is an alarm display A (6)). It outputs a display signal to the vacuum control means (52) and also outputs a signal for stopping the operation of the vacuum control means (52).

次に動作について説明する。上金型(1d)と下金型(
le)とが型締め状態になると型締め検出器(4)が信
号を出力する。ここで−真空制御手段(521が電磁弁
(2a)を開放するため、第3図のフローチャートのス
テップ(7)のように両金型(1d)(1e)内(こ掴
空が尋人される。−万一この両金型(1d ) (1e
 、)内の真空度は真空計(3)で検出されており一型
締め検出器(4)が型締め信号を出力すると同時に一判
断手段Aω)は真空計(3)の信号をん′時入力し一タ
イマA T511がフローチャート(8)のステップ(
8)のようにセットされる。判断手段時では真空度が設
定値P1に到達したかをステップ(9)で判断しており
一真空度が設定値P1に達するとステップ00)のよう
にプランジャ(1b)を駆動させる。
Next, the operation will be explained. Upper mold (1d) and lower mold (
When the mold is in the mold clamping state, the mold clamping detector (4) outputs a signal. At this point, since the vacuum control means (521) opens the solenoid valve (2a), as shown in step (7) of the flowchart in FIG. - In the unlikely event that both molds (1d) (1e
, ) is detected by the vacuum gauge (3), and at the same time as the mold clamping detector (4) outputs the mold clamping signal, the determining means Aω) detects the signal from the vacuum gauge (3). When input, timer A T511 executes step (8) of flowchart (8).
8) is set as shown below. In the determining means, it is determined in step (9) whether the degree of vacuum has reached the set value P1, and when the degree of vacuum reaches the set value P1, the plunger (1b) is driven as in step 00).

また、第4図の曲線Aにおいて、真空度が設定値P1に
到達していない時には、ステップ圓でタイマA(5)が
セットアツプしたか否か、つまり第4図中Tl内か否か
が判断され、T1以内、例えばT2であればステップ(
9)を繰り返すことになる。ここで−T3で設定値P1
に到達するとステップ(1υ)へ移る。ところで、第4
図の曲線Bの場合は−T4においては設定された真空度
Pitこ定時間Tl内に到達しなかったことになリース
テップaのでアラーム表示A(6)がアラームを表示し
一更(こステップ(13)のように真空制御手段(5り
に装置を停止させるための信号を出力する。従って、作
業者は、ここで−異常状態を検査し一必要な処理を実施
する。
In addition, in curve A of Fig. 4, when the degree of vacuum has not reached the set value P1, it is determined whether or not timer A (5) is set up in the step circle, that is, whether it is within Tl in Fig. 4. If it is within T1, for example T2, step (
9) will be repeated. Here, set value P1 at -T3
When it reaches , it moves to step (1υ). By the way, the fourth
In the case of curve B in the figure, at -T4, the set vacuum level Pit has not been reached within the specified time Tl, and since step a, the alarm display A (6) displays an alarm. As shown in (13), the vacuum control means (5) outputs a signal to stop the apparatus.Therefore, the operator inspects the abnormal state here and carries out necessary processing.

次にこの発明の他の実施例を第5図で説明する。Next, another embodiment of the present invention will be described with reference to FIG.

図において−(財)は型締め検出器(4)の出力信号で
スタートするタイマBで一タイマA (51+よりも長
い時−間に設定されている。(至)は型締め検出器(4
)が型締めされた信号を出力した後、タイマB(財)の
セット時1酋ITs内に真空度が設定値P2に到達した
か否かを判断する判断手段Bで、定時間T5内で設定値
P2に達しない時にはアラーム表示B (56+に表示
信号を出力する。
In the figure, timer B starts with the output signal of the mold clamping detector (4), and is set to a longer time than timer A (51+).
) outputs a mold clamping signal, and when timer B (Incorporated) is set, judgment means B judges whether the degree of vacuum has reached the set value P2 within one ITs, and within a fixed time T5. When the set value P2 is not reached, a display signal is output to alarm display B (56+).

上記のように構成されたものにおいては一第6図のフロ
ーチャートのステップIでタイマB(541がセットさ
れ一更に、ステップ05)で設定真空度P2に到達した
か否かが判断手段B T55)で判断されるとプランジ
ャ(16)が駆動され、到達しない時には、ステップ(
]、lilでタイマBがタイムアツプか否かが判断され
、否の場合にはステップ(151が繰り返さね−タイム
アップしている時にはステップaηでアラーム表示され
る。即ち、第7図の曲線Cは、タイマBのセット時間T
5内のT6においては−ステップ(151で−P2に達
していないと判断されてステップ0ωへと移り一史に、
このステップ(16)ではタイムアツプされていないと
判断され−ステップ05)を繰り返す。T9では15時
間内に真空度がPgに到達しているので一ステップ(I
t]lでプランジャ(1b)が駆動される。
In the configuration as described above, the timer B (541 is set in step I of the flowchart in FIG. 6, and the judgment means B (541) is determined in step 05 as to whether or not the set vacuum level P2 has been reached (T55). If the plunger (16) is determined to be reached, the plunger (16) is driven, and if the plunger (16) is not reached, the step (
], lil determines whether or not timer B is up, and if not, step (151) is not repeated.If time is up, an alarm is displayed at step aη.In other words, curve C in FIG. , timer B set time T
At T6 in 5, it is determined that -P2 has not been reached at 151, and the process moves to step 0ω.
In this step (16), it is determined that the time-up has not occurred, and step 05) is repeated. At T9, the degree of vacuum reached Pg within 15 hours, so one step (I
t]l, the plunger (1b) is driven.

一方、曲線りの場合−T8においても、真空度は設定値
P2に到達しないため−ステップ(161で異常と判断
され−ステップ0ηでアラーム表示画)に表示信号が出
力される。
On the other hand, in the case of a curve - even at T8, the degree of vacuum does not reach the set value P2, so a display signal is output at -step (an abnormality is determined at 161 - an alarm display screen at step 0η).

従って、作業者は一装置のオーバホールなどを実施する
こと番こなる。つまり、装置全体が点検の時期にあるこ
とを判断できることにもなる。
Therefore, it is the operator's turn to overhaul the device. In other words, it can be determined that the entire device is due for inspection.

〔発明の効果〕〔Effect of the invention〕

以上のようにこの発明は、金型内を真空引きした後に−
プランジャを駆動して樹脂をキャビティ内に注入する半
導体樹脂封止装置において一上記金型内を封止した後、
上記金型内を真空引きする真空制御手段、この真空制御
手段が真空引きを開始した後、定時間内に設定真空度に
到達した時にはプランジャを駆動させると共に到達しな
い時には異常表示信号を出力する判断手段を備えたので
、樹脂封止工程中に真空度を確認することが不要となり
−しかも、装置自体が正常に動作していることを常時判
断でき、装置の信頼性が向上する効果がある。
As described above, in this invention, after the inside of the mold is evacuated, -
In a semiconductor resin sealing device that drives a plunger to inject resin into a cavity, after sealing the inside of the mold,
Vacuum control means for evacuating the inside of the mold; after this vacuum control means starts evacuation, the plunger is driven when the set vacuum level is reached within a predetermined time, and when the vacuum level is not reached, an abnormality display signal is output. Since the means is provided, there is no need to check the degree of vacuum during the resin sealing process - and it can be determined at all times that the device itself is operating normally, which has the effect of improving the reliability of the device.

また、この発明の別の発明は一金型内を真空引きした後
に、プランジャを駆動して樹脂をキャビティ内に注入す
る半導体樹脂封止装置において、上記金型を封止した後
−十「1金型内を真空引きする真空制御手段−この真空
制御手段が夏空引きを開始した後、第1の定時間内の到
達真空度を第1の設定真空度と比較し、異常値と判断し
た場合には異常表示信号を出力する第1の判断手段−こ
の第1の判断手段が正常値と判断した時には第2の定時
間内の到達真空度を第2の設定真空度と比較し、上記第
2の設定真空度に到達している時にはプランジャを駆動
させ、到達していない時には異常表示信号を出力する第
2の判断手段を備えたので一真空系統の異常を早期に、
且つ確実に発明でき一信頼性の高い装置を得ることがで
きるばかりでなく、メインテナンス時期を判断でき一装
置の重大な故障を未然に防止できる効果がある。
Another invention of the present invention is a semiconductor resin sealing device that injects resin into a cavity by driving a plunger after evacuating the inside of a mold. Vacuum control means for evacuating the inside of the mold - After this vacuum control means starts summer evacuation, the degree of vacuum achieved within the first fixed time is compared with the first set degree of vacuum, and the value is determined to be an abnormal value. If the first judgment means determines that the value is normal, it compares the degree of vacuum reached within a second fixed time with the second set degree of vacuum, and Equipped with a second judgment means that drives the plunger when the second set vacuum degree has been reached, and outputs an abnormality display signal when the second set vacuum degree has not been reached, so that abnormalities in one vacuum system can be detected early.
Moreover, not only can the invention be reliably achieved and a highly reliable device obtained, but also the time for maintenance can be determined and serious failures of the device can be prevented.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例を示すブロック図、第2図
はこの発明の全体構成を示すブロック図、第3図はその
動作フローチャート−第4図はその特性図、第5図はこ
の発明の他の実施例を示すブロック図−第6図はその動
作フローチャート、第7図はその特性図−第8図は従来
装置のブロック図である。図中−(1b)はプランジャ
、(2a)は電磁弁−(3)は真空計、(4)は型締め
検出器、(5)(ま制御装置、6DはタイマA152は
真空制御手段−(至)は判断手段A、(6)はアラーム
表示A〜(財)はタイマB−(至)は判断手段3[はア
ラーム表示Bである。 なお各図(中目−符号は同−又は相当部分を示す。
Fig. 1 is a block diagram showing an embodiment of the present invention, Fig. 2 is a block diagram showing the overall configuration of the invention, Fig. 3 is its operation flowchart, Fig. 4 is its characteristic diagram, and Fig. 5 is its characteristic diagram. A block diagram showing another embodiment of the invention - FIG. 6 is an operation flowchart thereof, FIG. 7 is a characteristic diagram thereof, and FIG. 8 is a block diagram of a conventional device. In the figure - (1b) is a plunger, (2a) is a solenoid valve, (3) is a vacuum gauge, (4) is a mold clamping detector, (5) is a control device, and 6D is a timer A152 is a vacuum control means - ( (to) is the judgment means A, (6) is the alarm display A to (goods) is the timer B, and (to) is the judgment means 3 [is the alarm display B. Show parts.

Claims (2)

【特許請求の範囲】[Claims] (1)金型内を真空引きした後に、プランジャを駆動し
て樹脂をキャビティ内に注入する半導体樹脂封止装置に
おいて、上記金型内を封止した後、上記金型内を真空引
きする真空制動手段、この真空制御手段か真空引きを開
始した後、定時間内に設定真空度に到達した時にはプラ
ンジャを駆動させると共に到達しない時には異常表示信
号を出力する判断手段を備えた半導体樹脂封止装置。
(1) In a semiconductor resin encapsulation device that evacuates the inside of the mold and then drives a plunger to inject resin into the cavity, the inside of the mold is evacuated after the inside of the mold is sealed. A semiconductor resin encapsulation device comprising a braking means and a determining means for driving a plunger when a set degree of vacuum is reached within a predetermined time after the vacuum control means starts evacuation, and for outputting an abnormality display signal when the degree of vacuum is not reached. .
(2)金型内を真空引きした後に、プランジャを駆動し
て樹脂をキャビティ内に注入する半導体樹脂封止装置に
おいて、上記金型を封止した後、上記金型内を真空引き
する真空制御手段、この真空制御手段が真空引きを開始
した後、第1の定時間内の到達真空度を第1の設定真空
度と比較し、異常値と判断した場合には異常表示信号を
出力する第1の判断手段、この第1の判断手段が正常値
と判断した時には第2の定時間内の到達真空度を第2の
設定真空度と比較し、上記第2の設定真空度に到達して
いる時にはプランジャを駆動させ、到達していない時に
は異常表示信号を出力する第2の判断手段を備えた半導
体樹脂封止装置。
(2) Vacuum control that vacuums the inside of the mold after sealing the mold in a semiconductor resin sealing device that injects resin into the cavity by driving a plunger after the inside of the mold is evacuated. means, after the vacuum control means starts evacuation, the degree of vacuum achieved within a first fixed time is compared with the first set degree of vacuum, and if it is determined that the value is an abnormal value, an abnormality display signal is outputted; When the first determining means determines that the value is normal, it compares the achieved vacuum level within a second fixed time with the second set vacuum level, and determines when the second set vacuum level is reached. A semiconductor resin encapsulation device comprising a second determining means that drives the plunger when the plunger has reached the target and outputs an abnormality display signal when the plunger has not reached the target.
JP62322001A 1987-12-18 1987-12-18 Semiconductor resin-sealed device Pending JPH01162341A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62322001A JPH01162341A (en) 1987-12-18 1987-12-18 Semiconductor resin-sealed device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62322001A JPH01162341A (en) 1987-12-18 1987-12-18 Semiconductor resin-sealed device

Publications (1)

Publication Number Publication Date
JPH01162341A true JPH01162341A (en) 1989-06-26

Family

ID=18138815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62322001A Pending JPH01162341A (en) 1987-12-18 1987-12-18 Semiconductor resin-sealed device

Country Status (1)

Country Link
JP (1) JPH01162341A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010505669A (en) * 2006-10-12 2010-02-25 クラウスマッファイ テヒノロギース ゲゼルシャフト ミット ベシュレンクテル ハフツング Method and apparatus for molding composite material members

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010505669A (en) * 2006-10-12 2010-02-25 クラウスマッファイ テヒノロギース ゲゼルシャフト ミット ベシュレンクテル ハフツング Method and apparatus for molding composite material members

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