JPH0529366A - Semiconductor sealer - Google Patents

Abstract

PURPOSE:To improve a resin sealing mold characteristic by accurately measuring the degree of vacuum within a mold of a semiconductor sealer for sealing by filling with a resin. CONSTITUTION:A vacuum gauge 9 for measuring the degree of vacuum within a mold 1 is arranged in the vicinity of a connection with the mold 1 of an evacuating piping 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention stores a semiconductor device in which a semiconductor element is mounted on a lead frame in a molding die, and seals the semiconductor device by filling the resin with a vacuum in the molding die. The present invention relates to a semiconductor sealing device that stops.

[0002]

2. Description of the Related Art FIG. 2 is a schematic diagram showing the structure of a conventional semiconductor device of this type. In the figure, 1 is a mold including an upper mold 1a and a lower mold 1b, 2 is a semiconductor device which is housed in the mold 1 and has a semiconductor element mounted on a lead frame, and 3 is a lower mold. A drive shaft for moving the mold 1b up and down via the guide shaft 4, 5 is a vacuum pump, 6 is a pipe connecting the vacuum pump 5 and the inside of the molding die 1, 7 and 8 are valves connected to the pipe 6, and A filter, 9 is a vacuum gauge arranged near the connecting portion of the pipe 6 with the vacuum pump 5, and 10 is an exhaust port provided in the vacuum pump 5.

Next, the operation of the conventional semiconductor encapsulation device configured as described above will be described. A semiconductor encapsulation device is a device for encapsulating a semiconductor device mounted on a lead frame with resin in the process of commercializing the semiconductor device and molding it. First, the semiconductor device is mounted on the lead frame. The semiconductor device 2 is placed on the lower mold 1b, the drive shaft 3 is driven to raise the lower mold 1b along the guide shaft 4, and the upper mold 1a is clamped together.

Next, a sealing resin is filled from a resin injection port (not shown) into the molding die 1 composed of the two dies 1a and 1b to seal the semiconductor device 2. When the vacuum pump 5 is operated and the valve 7 is opened during such resin filling, the air in the molding die 1 is exhausted through the pipe 6 from the exhaust port 10 together with the air bubbles contained in the resin, and the resin is sealed. Moldability is improved. Further, during this exhaust, fine sealing resin and other dust contained in the air are collected by the filter 8.
Then, the degree of vacuum in this state is measured by the vacuum gauge 9, and the degree of vacuum reaches a predetermined degree of vacuum shown in the standard.

[0005]

Since the conventional semiconductor encapsulation device is constructed as described above, when the air in the molding die 1 is exhausted, the vacuum is relatively quickly reached up to the filter 8, but the filter is The volume of 8 is large, and it takes time until the inside of the mold 1 becomes a vacuum due to the resistance of the pipe 6 and the like.
Even if the vacuum gauge 9 arranged near the vacuum pump 5 sets a predetermined degree of vacuum indicated by the standard, an error occurs with respect to the degree of vacuum in the molding die 1. There is a problem that it is difficult to extract efficiently, and the resin encapsulation moldability after encapsulation deteriorates.

The present invention has been made in order to solve the above-mentioned problems, and by accurately measuring the degree of vacuum in the molding die, the inside of the molding die is maintained at a predetermined vacuum degree or less as specified in the standard. Then, it aims at providing the semiconductor sealing device which can improve the resin sealing moldability after sealing.

[0007]

In a semiconductor encapsulation apparatus according to the present invention, a vacuum gauge for measuring the degree of vacuum in a molding die is arranged in the vicinity of a connection portion of a piping for evacuation with the molding die. It was set up.

[0008]

The vacuum gauge of the semiconductor encapsulation device according to the present invention is
It is arranged in the vicinity of the mold and accurately measures the degree of vacuum in the mold.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic diagram showing the configuration of a semiconductor encapsulation device according to an embodiment of the present invention. In the figure, a mold 1, an upper mold 1a, a lower mold 1b, a semiconductor device 2, a drive shaft 3, a guide shaft 4, a vacuum pump 5, a pipe 6, a valve 7, a filter 8,
The vacuum gauge 9 and the exhaust port 10 are the same as those of the conventional semiconductor sealing device shown in FIG.
It is different in that it is arranged in the vicinity of the connecting portion with the molding die 1.

Next, the operation of the semiconductor encapsulating device according to the embodiment of the present invention constructed as described above will be described. First, similarly to the conventional device, the semiconductor device 2 having the semiconductor element mounted on the lead frame is placed on the lower mold 1b, and the drive shaft 3 is driven to move the lower mold 1b along the guide shaft 4. The mold is lifted and clamped together with the upper mold 1a.

Next, a sealing resin is filled from a resin injection port (not shown) into the molding die 1 composed of the two dies 1a and 1b to seal the semiconductor device 2. When the vacuum pump 5 is operated and the valve 7 is opened during such resin filling, the air in the molding die 1 is exhausted from the exhaust port 10 together with the air bubbles contained in the resin through the pipe 6, and the resin sealing molding is performed. It is possible to improve the sex. Further, during this exhaust, fine sealing resin and other dust contained in the air are collected by the filter 8. The degree of vacuum in the molding die 1 in this state is determined by the piping 6
Since it is accurately measured by the vacuum gauge 9 arranged near the connecting portion with the molding die 1 regardless of the error due to the volume of the filter 8 and the resistance of the pipe 6, it is kept below a predetermined vacuum degree specified by the standard. As a result, the resin sealing mold can be improved.

[0012]

As described above, according to the present invention, since the vacuum gauge for measuring the degree of vacuum in the molding die is arranged in the vicinity of the connecting portion of the piping for evacuation with the molding die, Since the degree of vacuum in the molding die can be accurately measured, the semiconductor encapsulation device capable of maintaining the degree of vacuum in the molding die below a predetermined vacuum degree specified by the standard and improving the resin encapsulation moldability. It becomes possible to provide.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing a configuration of a semiconductor encapsulation device according to an embodiment of the present invention.

FIG. 2 is a schematic diagram showing a configuration of a conventional semiconductor sealing device.

[Explanation of symbols]

 1 Mold 2 Semiconductor Device 6 Piping 9 Vacuum Gauge

Claims (1)

Claim: What is claimed is: 1. A semiconductor device having a semiconductor element mounted on a lead frame is housed in a molding die, and resin is filled into the molding die while vacuuming the inside of the molding die. In the semiconductor encapsulation device in which the semiconductor device is resin-sealed by the above, a vacuum gauge for measuring the degree of vacuum in the molding die is arranged near the connection of the piping for evacuation with the molding die. A semiconductor encapsulation device characterized by being provided.