CN110681541A - Glue pouring method and glue pouring equipment for sensor - Google Patents
Glue pouring method and glue pouring equipment for sensor Download PDFInfo
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- CN110681541A CN110681541A CN201910629949.0A CN201910629949A CN110681541A CN 110681541 A CN110681541 A CN 110681541A CN 201910629949 A CN201910629949 A CN 201910629949A CN 110681541 A CN110681541 A CN 110681541A
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- sensor
- preset time
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- closed cavity
- pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0493—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases using vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
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- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a sensor glue filling method for sealing a sensor in a sensor shell, which comprises the steps of placing the sensor in the sensor shell, at least completely filling the sensor shell with glue, placing the sensor shell in a closed cavity, continuously vacuumizing the inside of the closed cavity within a first preset time, destroying the vacuum state in the closed cavity, and completing glue filling. The invention also discloses sensor glue filling equipment for sealing the sensor in the sensor shell. The glue pouring method/glue pouring equipment provided by the invention is used for glue pouring production of the sensor, so that the yield of products can be improved, the production beat is improved, and the production cost is reduced.
Description
Technical Field
The invention relates to the field of automobiles, in particular to a sensor glue pouring method for sealing a sensor in a sensor shell by glue. The invention also relates to sensor glue filling equipment for sealing the sensor in the sensor shell.
Background
The sensor is a detection device which can sense the measured information and convert the sensed information into electric signals or other information in required forms according to a certain rule to output, so as to meet the requirements of information transmission, processing, storage, display, record, control and the like. The sensor features include: miniaturization, digitalization, intellectualization, multifunction, systematization and networking. The method is the first link for realizing automatic detection and automatic control. The sensor is a sensitive element which is easy to wear and usually needs to be additionally provided with a protective shell.
Automobile sensors such as tire pressure sensors and reversing radars are equipped in large quantities and put into the automobile market, and the two-component mixed glue pouring process is mostly adopted in the manufacturing process of the sensors at present. The sensor protected by the glue pouring process has the advantages of good sealing performance, mechanical impact resistance, low production equipment investment and the like. But because of the fluid property of the glue, the defect also exists, bubbles with high viscosity of the glue are difficult to eliminate, the glue is not fully filled due to residual air in the product, the surface of the cured product is uneven, and the bubbles can cause serious influence on the product performance due to mechanical and high-low temperature impact. With the development and optimization of an automatic feeding system, bubbles generated by feeding are solved by vacuumizing and maintaining negative pressure in a glue material cylinder. But the problem of bubbles generated in the glue filling process of sensor production always troubles manufacturers.
In order to solve the technical problem of generating bubbles in the glue filling process, the following method is generally adopted in the industry:
the first is a secondary glue filling process, namely, according to the product structure, part of glue is filled at the bottom of the product, and after the air bubbles are removed by natural leveling, the secondary glue filling is carried out, so that the whole product is filled. The process still has the following defects:
firstly, the failure phenomenon that the channel is blocked and the filling is not full still exists under the influence of part design, glue viscosity and curing time when the bottom is filled by first glue filling;
secondly, standing for a period of time after the first gluing, wherein the production process is discontinuous and the efficiency is influenced;
and thirdly, the adhesive is easily layered on a twice gluing interface under the influence of the characteristics of the glue.
And secondly, the vacuum glue pouring process adopts a vacuum glue pouring machine, after a product enters a vacuum box body, air in the box body is firstly pumped away, the product is quickly poured with glue for many times under an absolute negative pressure environment, and bubbles generated in the process are pumped away, so that the glue pouring is ensured to be bubble-free. The process still has the following defects:
firstly, automation equipment is controlled in a closed loop mode, and the manufacturing cost is high;
secondly, the vacuumizing process needs to wait, and the effective utilization rate of glue filling equipment is low.
Disclosure of Invention
The invention aims to solve the technical problem of providing a sensor glue filling method capable of avoiding bubbles in a sensor shell in a sensor glue filling production process.
The invention aims to solve another technical problem of providing sensor glue filling equipment capable of avoiding bubbles in a sensor shell in a sensor glue filling production process.
In order to solve the technical problem, the invention provides a sensor glue filling method for sealing a sensor in a sensor shell, which comprises the following steps:
s1, placing the sensor in the sensor shell;
s2, performing glue filling, and at least completely filling the sensor shell with glue; that is, the glue reaches at least the level of the glue filling opening of the sensor housing and even exceeds the level of the glue filling opening of the sensor housing. Due to the fact that the viscosity and the surface tension of the glue are large, the state that the glue exceeds the level of a glue filling opening of the sensor shell and does not overflow can be completely achieved. At this time, although the sensor housing is completely filled with the glue, air bubbles that are not removed exist inside the sensor housing. Similarly, air bubbles in the sensor shell cannot automatically emerge from the glue due to the characteristics of high viscosity and high surface tension of the glue.
S3, placing the sensor shell in the closed cavity, and continuously vacuumizing the interior of the closed cavity within a first preset time; at this time, the pressure of the air bubble inside the sensor shell can be understood as standard atmospheric pressure, and the air pressure of the space where the sensor shell is located is smaller than the standard atmospheric pressure, so that a pressure difference is formed. The bubbles may cause the glue to pop out due to the pressure difference. The first preset time is continuously pumped out to ensure that the bubbles have enough time to be discharged out of the glue. Of course, the first predetermined period of time also has a relationship with the pressure difference, and the first predetermined period of time required is relatively smaller for a larger pressure difference.
And S4, breaking the vacuum state in the sealed cavity to finish glue pouring. The shorter the time required for destroying the vacuum state in the closed cavity is, the better the air bubbles emerge, and the pressure in the glue is smaller than the standard atmospheric pressure. In a very short time, the pressure of the closed cavity is increased to be more than or equal to a standard atmospheric pressure, the glue can be sucked into the sensor shell, and air bubbles can be completely eliminated.
And further improving the glue filling method of the sensor, when the step S3 is executed, continuously vacuumizing the inside of the closed cavity within a first preset time period until the preset pressure is reached, stopping vacuumizing operation, and then standing the closed cavity for a second preset time period. After the preset pressure is reached, the closed cavity is allowed to stand so as to fully utilize the pressure difference to ensure that the air bubbles are completely removed.
Further improving the glue filling method for the sensor, when the step S4 is executed, if the pressure of the closed cavity is equal to the preset pressure, the vacuum state in the closed cavity is destroyed, and the glue filling is completed;
if the pressure of the closed cavity is higher than the preset pressure, the process returns to step S3.
And the closed cavity is kept still for a second preset time, and the pressure difference is fully utilized to ensure that the bubbles are completely removed. Because the sealed cavity is adopted, and the space of the sealed cavity which can be realized on a production line is limited, the pressure of the cavity can be accurately measured. In mass production, air bubbles are present in each sensor housing. After all the air bubbles in the closed cavity sensor shell are extracted from the glue, the pressure of the closed cavity can be increased, and the pressure is higher than the preset pressure. And at the moment, vacuumizing the closed cavity again to reach the preset pressure, if no bubble exists, keeping the pressure at the preset pressure, and if the pressure rises, indicating that the bubble still exists. Repeating the above steps ensures that the bubbles are completely removed.
The sensor glue filling method is further improved, and the first preset time is 1-10 seconds.
The glue filling method of the sensor is further improved, and the second preset time is 1-10 seconds.
The sensor glue filling method is further improved, and the vacuum refers to a gas state which is less than a standard atmospheric pressure in a closed cavity.
The sensor glue filling method is further improved, and the step of destroying the vacuum state in the sealed cavity is that the air pressure in the sealed cavity is larger than or equal to a standard atmospheric pressure within the time of less than 10 milliseconds.
The invention provides a sensor glue filling device, which comprises: the device comprises an upper cover mechanism I, a lifting mechanism II, a vacuum generating device III, a product follow-up tool IV and a conveying mechanism V;
the upper cover mechanism I is fixed above the conveying mechanism V;
the lifting mechanism II is arranged on the conveying mechanism V below the upper cover mechanism I and can move upwards to lift the product follow-up tool IV so that the product follow-up tool IV and the upper cover mechanism I form a closed cavity;
the vacuum generating device III is arranged on the side wall of the upper cover mechanism I and can vacuumize or charge air into the closed cavity;
the product following tool IV is arranged on the conveying mechanism V between the upper cover mechanism I and the lifting mechanism II and can reciprocate on the conveying mechanism V to convey the sensor shell to be glue-poured;
and the conveying mechanism V can convey the product follow-up tool IV to the position above the lifting mechanism II.
The sensor glue filling equipment further comprises;
the controller stores equipment working rules in the controller, the equipment working rules control the conveying mechanism V to transport the sensor shell to be glue-poured on the product follow-up tool IV in a reciprocating manner, the lifting mechanism II lifts or descends, and the vacuum generating device III vacuumizes or inflates air;
and the precision pressure sensor is arranged on the upper cover mechanism I or the product follow-up tool IV for measuring the pressure of the closed cavity. The precision pressure sensor is a pressure sensor with the range of 0-110Kpa and the precision of more than or equal to 0.05% FS.
Further sensor encapsulating equipment, equipment operating rule includes:
if a sensor shell to be glue-poured exists on the product follow-up tool IV and the vacuum generating device III does not execute the working procedure in the current round of working, the conveying mechanism V is started to convey the product follow-up tool IV to the position above the lifting mechanism II;
if a sensor shell to be glue-poured exists on the product follow-up tool IV and the vacuum generating device III completes the working procedure in the current round of work, the conveying mechanism V is started to convey the product follow-up tool IV to a next procedure position;
if a product follow-up tool IV exists above the lifting mechanism II and the vacuum generating device III does not execute the working procedure in the current round of working, if the lifting mechanism II lifts, the product follow-up tool IV and the upper cover mechanism I form a closed cavity and last for a third preset time;
if the third preset time length exists in the closed cavity, if the lifting mechanism II descends, the product follow-up tool IV is separated from the upper cover mechanism I;
if the sealed cavity exists, the vacuum generating device III continuously vacuumizes the sealed cavity for a first preset time and then fills air into the sealed cavity;
the first preset time length is less than the third preset time length.
Further sensor encapsulating equipment, equipment operating rule still includes:
if the sealed cavity exists, the vacuum generation device III continuously vacuumizes the sealed cavity within a first preset time period until the pressure reaches a preset pressure, the vacuumizing operation is stopped, and then the sealed cavity is allowed to stand for a second preset time period;
the second preset time length is less than or equal to the first preset time length, and the sum of the first preset time length and the second preset time length is less than or equal to the third preset time length.
Further sensor encapsulating equipment, equipment operating rule still includes: after standing for a second preset time, if the pressure of the closed cavity is equal to the preset pressure, destroying the vacuum state in the closed cavity, and completing glue pouring; if the pressure of the closed cavity is higher than the preset pressure, the vacuum generating device III continuously vacuumizes the closed cavity within the first preset time period again until the preset pressure is reached, the vacuumizing operation is stopped, and then the closed cavity is allowed to stand for a second preset time period.
Further, the sensor glue pouring equipment is characterized in that the first preset time is 1-10 seconds.
Further, according to the sensor glue pouring equipment, the third preset time is 1-20 seconds.
Further, in the sensor glue pouring equipment, the second preset time is 1-10 seconds.
In the sensor glue filling equipment, the vacuum refers to a gas state lower than a standard atmospheric pressure in the closed cavity.
Further, the sensor glue filling equipment fills air into the closed cavity, so that the air pressure in the closed cavity is larger than or equal to a standard atmospheric pressure within the time of less than 10 milliseconds.
Further sensor encapsulating equipment, upper cover mechanism I includes:
a sealing plate 1 fixed in the sealing frame 2;
the sealing frame 2 is fixed on the support 3, and one side wall of the sealing frame is provided with a vacuum generating device III;
and the bracket 3 is fixed on the conveying mechanism V.
Further the sensor encapsulating equipment is characterized in that an air pipeline is arranged in the sealing frame 2, a plurality of air holes are formed in the air, and the air pipeline is connected with a vacuum generating device III.
Further sensor encapsulating equipment, lifting mechanism II includes: the device comprises a cylinder plate 1, a positioning plate 2, a support 3, a connecting block 4, a positioning pin 5, a positioning diamond pin 6, a stop block 7, a linear bearing 8, a sliding column 9 and a cylinder 10;
the cylinder 10 and the linear bearing 8 are fixed on the cylinder plate 1, the positioning plate 2 is connected with the top of the sliding column 9, the sliding column 9 is sleeved in the linear bearing 8, the fixed connecting block 4 is connected with the top of the cylinder 10, the fixed positioning plate 2 is connected with the top of the connecting block 4, and the positioning plate 2 is provided with at least one positioning pin 5 and at least one support 3.
The sensor glue pouring equipment is further provided with at least two sliding columns 9, and the sliding columns 9 are arranged around the cylinder 10. The two sliding columns 9 and the positioning plate 2 can form a horizontal part, so that the product following tool IV keeps horizontal in the up-and-down movement process.
Further sensor encapsulating equipment, the sliding column 9 bottom is equipped with dog 7.
The invention has at least the following technical effects:
1. the glue filling method/glue filling equipment is adopted for glue filling production of the sensor, the bubbles can be completely removed through pressure difference and reasonable bubble removing time, and the defect rate of the bubbles is reduced from 15% to 0;
2. compared with the automatic vacuum glue pouring equipment, the glue pouring equipment has the advantages that the time for the glue pouring equipment to be in a vacuum state is shorter, the result is simpler, each glue pouring equipment is saved by more than 35 ten thousand yuan, and the effective utilization rate of the equipment is improved by 40 percent;
3. compared with secondary glue filling, the production line production beat can be reduced to 6 seconds from 9 seconds through reasonable optimization, and the glue filling production efficiency is improved by 50%.
Drawings
The invention will be described in further detail with reference to the following detailed description and accompanying drawings:
fig. 1 is a schematic view of the overall structure of the glue pouring device of the invention.
Fig. 2 is a schematic structural view of a possible embodiment of the cover mechanism.
Figure 3 is a schematic diagram of a possible embodiment of the lifting mechanism.
Description of the reference numerals
Upper cover mechanism I
Lifting mechanism II
Vacuum generating device III
Product follow-up tool IV
Conveying mechanism V
Cylinder plate 1
Positioning plate 2
Support 3
Connecting block 4
Positioning pin 5
Positioning diamond pin 6
Stop 7
Linear bearing 8
Sliding column 9
A cylinder 10.
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and technical effects of the present invention will be fully apparent to those skilled in the art from the disclosure in the specification. The invention is capable of other embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the general spirit of the invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict.
The invention provides a first embodiment of a sensor glue filling method for sealing a sensor in a sensor shell, which comprises the following steps:
s1, placing the sensor in the sensor shell;
s2, performing glue filling, and at least completely filling the sensor shell with glue; that is, the glue reaches at least the level of the glue filling opening of the sensor housing and even exceeds the level of the glue filling opening of the sensor housing. Due to the fact that the viscosity and the surface tension of the glue are large, the state that the glue exceeds the level of a glue filling opening of the sensor shell and does not overflow can be completely achieved. At this time, although the sensor housing is completely filled with the glue, air bubbles that are not removed exist inside the sensor housing. Similarly, air bubbles in the sensor shell cannot automatically emerge from the glue due to the characteristics of high viscosity and high surface tension of the glue.
S3, placing the sensor shell in the closed cavity, and continuously vacuumizing the interior of the closed cavity within a first preset time; at this time, the pressure of the air bubble inside the sensor shell can be understood as standard atmospheric pressure, and the air pressure of the space where the sensor shell is located is smaller than the standard atmospheric pressure, so that a pressure difference is formed. The bubbles may cause the glue to pop out due to the pressure difference. The first predetermined duration is to ensure that the bubbles have sufficient time to escape the glue. Of course, the first predetermined period of time also has a relationship with the pressure difference, and the first predetermined period of time required is relatively smaller for a larger pressure difference.
And S4, breaking the vacuum state in the sealed cavity to finish glue pouring. The shorter the time required for destroying the vacuum state in the closed cavity is, the better the air bubbles emerge, and the pressure in the glue is smaller than the standard atmospheric pressure. In a very short time, the pressure of the closed cavity is increased to be more than or equal to a standard atmospheric pressure, the glue can be sucked into the sensor shell, and air bubbles can be completely eliminated.
The invention provides a second embodiment of a sensor glue filling method for sealing a sensor in a sensor shell, which comprises the following steps:
s1, placing the sensor in the sensor shell;
s2, performing glue filling, and at least completely filling the sensor shell with glue;
s3, placing the sensor shell in the sealed cavity, continuously vacuumizing the sealed cavity within a first preset time period until a preset pressure is reached, stopping vacuumizing operation, and then allowing the sealed cavity to stand for a second preset time period. After the preset pressure is reached, the closed cavity is kept still, so that the pressure difference is fully utilized to ensure that the bubbles are completely removed; the preset pressure range is 0.1-0.7 standard atmosphere.
S4, if the pressure of the closed cavity is equal to the preset pressure, the vacuum state in the closed cavity is destroyed, and glue pouring is completed;
if the pressure of the closed cavity is higher than the preset pressure, the process returns to step S3.
And the closed cavity is kept still for a second preset time, and the pressure difference is fully utilized to ensure that the bubbles are completely removed. Because the sealed cavity is adopted, and the space of the sealed cavity which can be realized on a production line is limited, the pressure of the cavity can be accurately measured. In mass production, air bubbles are present in each sensor housing. After all the air bubbles in the closed cavity sensor shell are extracted from the glue, the pressure of the closed cavity can be increased, and the pressure is higher than the preset pressure. And at the moment, vacuumizing the closed cavity again to reach the preset pressure, if no bubble exists, keeping the pressure at the preset pressure, and if the pressure rises, indicating that the bubble still exists. Repeating the above steps ensures that the bubbles are completely removed.
The invention provides a third embodiment of a sensor glue filling method for sealing a sensor in a sensor shell, which is further improved on the second embodiment:
the first preset time is 2 seconds, and the second preset time is 2 seconds.
In any of the first to third embodiments of the above-mentioned glue filling method for a sensor, the vacuum refers to a gas state in a sealed cavity that is less than a standard atmospheric pressure.
The vacuum state in the sealed cavity is broken, namely the air pressure in the sealed cavity is enabled to be more than or equal to a standard atmospheric pressure in a time of less than 10 milliseconds.
As shown in fig. 1, the present invention provides a first embodiment of a glue filling apparatus for a sensor, including: the device comprises an upper cover mechanism I, a lifting mechanism II, a vacuum generating device III, a product follow-up tool IV and a conveying mechanism V;
the upper cover mechanism I is fixed above the conveying mechanism V;
the lifting mechanism II is arranged on the conveying mechanism V below the upper cover mechanism I and can move upwards to lift the product follow-up tool IV so that the product follow-up tool IV and the upper cover mechanism I form a closed cavity;
the vacuum generating device III is arranged on the side wall of the upper cover mechanism I and can vacuumize or charge air into the closed cavity;
the product following tool IV is arranged on the conveying mechanism V between the upper cover mechanism I and the lifting mechanism II and can reciprocate on the conveying mechanism V to convey the sensor shell to be glue-poured;
and the conveying mechanism V can convey the product follow-up tool IV to the position above the lifting mechanism II.
The invention provides a second embodiment of a glue filling device for a sensor, comprising; the device comprises an upper cover mechanism I, a lifting mechanism II, a vacuum generating device III, a product following tool IV, a conveying mechanism V, a controller (not shown in the figure) and a precise pressure sensor (not shown in the figure);
the upper cover mechanism I is fixed above the conveying mechanism V;
the lifting mechanism II is arranged on the conveying mechanism V below the upper cover mechanism I and can move upwards to lift the product follow-up tool IV so that the product follow-up tool IV and the upper cover mechanism I form a closed cavity;
the vacuum generating device III is arranged on the side wall of the upper cover mechanism I and can vacuumize or charge air into the closed cavity;
the product following tool IV is arranged on the conveying mechanism V between the upper cover mechanism I and the lifting mechanism II and can reciprocate on the conveying mechanism V to convey the sensor shell to be glue-poured;
and the conveying mechanism V can convey the product follow-up tool IV to the position above the lifting mechanism II.
The controller stores equipment working rules in the controller, the equipment working rules control the conveying mechanism V to transport the sensor shell to be glue-poured on the product follow-up tool IV in a reciprocating manner, the lifting mechanism II lifts or descends, and the vacuum generating device III vacuumizes or inflates air;
and the precision pressure sensor is arranged on the upper cover mechanism I or the product follow-up tool IV for measuring the pressure of the closed cavity. The precision pressure sensor is a pressure sensor (or 0.01Kpa) with the range of 0-110Kpa and the precision of more than or equal to 0.05% FS.
The invention provides a third embodiment of sensor glue filling equipment, which adopts the equipment of the first embodiment or the second embodiment of the sensor glue filling equipment to execute the following working rules:
if a sensor shell to be glue-poured exists on the product follow-up tool IV and the vacuum generating device III does not execute the working procedure in the current round of working, the conveying mechanism V is started to convey the product follow-up tool IV to the position above the lifting mechanism II;
the vacuum generating device III does not execute the working procedure in the work of the round, and the vacuum generating device III does not perform the vacuumizing and/or inflating actions in one complete production process.
If a sensor shell to be glue-poured exists on the product follow-up tool IV and the vacuum generating device III completes the working procedure in the current round of work, the conveying mechanism V is started to convey the product follow-up tool IV to a next procedure position;
the vacuum generating device III completes the working procedure in the work of the round, and the vacuum generating device III completes the actions of vacuumizing and inflating in one complete production process.
If a product follow-up tool IV exists above the lifting mechanism II and the vacuum generating device III does not execute the working procedure in the current round of working, if the lifting mechanism II lifts, the product follow-up tool IV and the upper cover mechanism I form a closed cavity and last for a third preset time;
if the third preset time length exists in the closed cavity, if the lifting mechanism II descends, the product follow-up tool IV is separated from the upper cover mechanism I;
if the sealed cavity exists, the vacuum generating device III continuously vacuumizes the sealed cavity for a first preset time and then fills air into the sealed cavity;
the first preset time length is less than the third preset time length.
The invention provides a fourth embodiment of sensor glue filling equipment, which is further improved and implemented by adopting the third embodiment of the sensor glue filling equipment according to the following working rules:
if a sensor shell to be glue-poured exists on the product follow-up tool IV and the vacuum generating device III does not execute the working procedure in the current round of working, the conveying mechanism V is started to convey the product follow-up tool IV to the position above the lifting mechanism II;
the vacuum generating device III does not execute the working procedure in the work of the round, and the vacuum generating device III does not perform the vacuumizing and/or inflating actions in one complete production process.
If a sensor shell to be glue-poured exists on the product follow-up tool IV and the vacuum generating device III completes the working procedure in the current round of work, the conveying mechanism V is started to convey the product follow-up tool IV to a next procedure position;
the vacuum generating device III completes the working procedure in the work of the round, and in a complete production process, the vacuum generating device III completes at least one vacuumizing action and inflating action. And the existence time of the closed cavity can be judged, namely the duration time of the closed cavity reaches a third preset time, and the conveying mechanism V is started to convey the product follow-up tool IV to a next process position.
If a product follow-up tool IV exists above the lifting mechanism II and the vacuum generating device III does not execute the working procedure in the current round of working, if the lifting mechanism II lifts, the product follow-up tool IV and the upper cover mechanism I form a closed cavity and last for a third preset time;
if the third preset time length exists in the closed cavity, if the lifting mechanism II descends, the product follow-up tool IV is separated from the upper cover mechanism I;
if the sealed cavity exists, the vacuum generating device III continuously vacuumizes the sealed cavity for a first preset time and then fills air into the sealed cavity;
if the sealed cavity exists, the vacuum generation device III continuously vacuumizes the sealed cavity within a first preset time period until the pressure reaches a preset pressure, the vacuumizing operation is stopped, and then the sealed cavity is allowed to stand for a second preset time period;
the technical means for judging whether the closed cavity exists are various, and the feasible implementation modes are as follows:
1. through timing judgment, namely the equipment starts timing from the self-starting, the closed cavity exists in a certain set time;
2. a sensor, such as a position sensor, is arranged on the upper cover mechanism I and/or the product following tool IV, and a closed cavity is formed when the upper cover mechanism I and/or the product following tool IV reach a specified position.
The second preset time length is less than or equal to the first preset time length, and the sum of the first preset time length and the second preset time length is less than or equal to the third preset time length.
For example, the first preset time period is 3 seconds, the second preset time period is 3 seconds, and the third preset time period is 6 seconds.
Or the first preset time is 2 seconds, the second preset time is 2 seconds, and the third preset time is 5 seconds.
The invention provides a fifth embodiment of a sensor glue filling device, which is adopted to further improve and increase the working rule on the basis of the fourth embodiment of the sensor glue filling device:
after standing for a second preset time, if the pressure of the closed cavity is equal to the preset pressure, destroying the vacuum state in the closed cavity, and completing glue pouring; if the pressure of the closed cavity is higher than the preset pressure, the vacuum generating device III continuously vacuumizes the closed cavity within the first preset time period again until the preset pressure is reached, the vacuumizing operation is stopped, and then the closed cavity is allowed to stand for a second preset time period.
For example, the preset pressure is 0.5 atm (1 atm is about 101.325kPa), and the vacuum generator III stops the vacuum pumping after the vacuum pumping reaches 0.5 atm for 2 seconds. And (3) keeping the closed cavity still for 2 seconds, stopping vacuumizing after the pressure of the closed cavity is measured to be 0.52 standard atmospheric pressure by the precision pressure sensor, keeping the closed cavity still for 2 seconds after the vacuum generating device III is vacuumized again for 2 seconds to reach 0.5 standard atmospheric pressure, and judging that the air bubbles in all the sensor shells are completely removed to finish glue pouring when the pressure of the closed cavity is measured to be 0.5 standard atmospheric pressure by the precision pressure sensor.
As shown in fig. 2, the present invention provides a possible embodiment of a cover mechanism I, including:
a sealing plate 1 fixed in the sealing frame 2;
the sealing frame 2 is fixed on the support 3, and one side wall of the sealing frame is provided with a vacuum generating device III;
and the bracket 3 is fixed on the conveying mechanism V.
Wherein, be equipped with the air pipeline in the sealed frame 2, this air pipeline connects vacuum generator III, and this air pipeline is equipped with a plurality of gas pockets around sealed frame 2 a week.
As shown in fig. 3, a possible embodiment of the lifting mechanism II provided by the present invention includes: the device comprises a cylinder plate 1, a positioning plate 2, a support 3, a connecting block 4, a positioning pin 5, a positioning diamond pin 6, a stop block 7, a linear bearing 8, a sliding column 9 and a cylinder 10;
fixed cylinder 10 and linear bearing 8 on the cylinder board 1, locating plate 2 is connected at 9 tops of slide post, and slide post 9 embolias linear bearing 8 in, fixed connection piece 4 is connected at 10 tops of cylinder, and fixed location plate 2 is connected at 4 tops of connecting block, is equipped with 1 round locating pin 5 and 1 location diamond pin 6 on the locating plate 2 and is used for fixing a position the pallet, and 1 support 3 is used for the jacking pallet.
At least two sliding columns 9 are provided, said sliding columns 9 being arranged around a cylinder 10. The two sliding columns 9 and the positioning plate 2 can form a horizontal part, so that the product following tool IV keeps horizontal in the up-and-down movement process. The bottom of the sliding column 9 is provided with a stop 7.
The present invention has been described in detail with reference to the specific embodiments and examples, but these are not intended to limit the present invention. Many variations and modifications may be made by one of ordinary skill in the art without departing from the principles of the present invention, which should also be considered as within the scope of the present invention.
Claims (22)
1. A glue pouring method for a sensor is used for sealing the sensor in a sensor shell, and is characterized by comprising the following steps:
s1, placing the sensor in the sensor shell;
s2, performing glue filling, and at least completely filling the sensor shell with glue;
s3, placing the sensor shell in the closed cavity, and continuously vacuumizing the interior of the closed cavity within a first preset time;
and S4, breaking the vacuum state in the sealed cavity to finish glue pouring.
2. The glue filling method for the sensor according to claim 1, characterized in that: and when the step S3 is executed, continuously vacuumizing the inside of the closed cavity within the first preset time period until the preset pressure is reached, stopping vacuumizing operation, and then standing the closed cavity for a second preset time period.
3. The glue filling method for the sensor according to claim 2, characterized in that: when step S4 is executed, if the pressure of the sealed cavity is equal to the preset pressure, the vacuum state inside the sealed cavity is destroyed, and the glue filling is completed;
if the pressure of the closed cavity is higher than the preset pressure, the process returns to step S3.
4. The glue filling method for the sensor according to claim 1, characterized in that: the first preset time is 1-10 seconds.
5. The glue filling method for the sensor according to claim 2, characterized in that: the second preset time is 1-10 seconds.
6. The glue filling method for the sensor according to claim 1, characterized in that: the vacuum refers to a gas state less than a standard atmospheric pressure within a closed cavity.
7. The glue filling method for the sensor according to claim 1, characterized in that: the vacuum state in the sealed cavity is broken, namely the air pressure in the sealed cavity is enabled to be more than or equal to a standard atmospheric pressure in a time of less than 10 milliseconds.
8. The utility model provides a sensor encapsulating equipment which characterized in that includes: the device comprises an upper cover mechanism (I), a lifting mechanism (II), a vacuum generating device (III), a product follow-up tool (IV) and a conveying mechanism (V);
the upper cover mechanism (I) is fixed above the conveying mechanism (V);
the lifting mechanism (II) is arranged on the conveying mechanism (V) below the upper cover mechanism (I) and can move upwards to lift the product follow-up tool (IV) so that the product follow-up tool (IV) and the upper cover mechanism (I) form a closed cavity;
the vacuum generating device (III) is arranged on the side wall of the upper cover mechanism (I) and can vacuumize or fill air into the closed cavity;
the product following tool (IV) is arranged on the conveying mechanism (V) between the upper cover mechanism (I) and the lifting mechanism (II), and can move on the conveying mechanism (V) in a reciprocating manner to convey the sensor shell to be glue-poured;
and the conveying mechanism (V) can convey the product follow-up tool (IV) to the position above the lifting mechanism (II).
9. The sensor potting apparatus of claim 8, further comprising;
the controller stores equipment working rules in the controller, the equipment working rules control the conveying mechanism (V) to transport the shell of the sensor to be glue-poured on the product following tool (IV) in a reciprocating manner, the lifting mechanism (II) lifts or descends, and the vacuum generating device (III) vacuumizes or inflates air;
and the precision pressure sensor is arranged on the upper cover mechanism (I) or the product follow-up tool (IV) for measuring the pressure of the closed cavity.
10. The sensor potting apparatus of claim 9, the apparatus operating rules comprising:
if a sensor shell to be glue-poured exists on the product follow-up tool (IV) and the vacuum generating device (III) does not execute the working procedure in the current round of working, the conveying mechanism (V) is started to convey the product follow-up tool (IV) to the position above the lifting mechanism (II);
if a sensor shell to be glue-poured exists on the product follow-up tool (IV) and the vacuum generating device (III) completes the working procedure in the current round of work, the conveying mechanism (V) is started to convey the product follow-up tool (IV) to a next procedure position;
if a product follow-up tool (IV) exists above the lifting mechanism (II) and the vacuum generating device (III) does not execute the working program in the current round of working, if the lifting mechanism (II) lifts, the product follow-up tool (IV) and the upper cover mechanism (I) form a closed cavity and last for a third preset time;
if the third preset time length exists in the closed cavity, separating the product follow-up tool (IV) from the upper cover mechanism (I) if the lifting mechanism (II) descends;
if the sealed cavity exists, the vacuum generating device (III) continuously vacuumizes the sealed cavity for a first preset time and then fills air into the sealed cavity;
the first preset time length is less than the third preset time length.
11. The sensor potting apparatus of claim 10, the apparatus operating rules further comprising:
if the sealed cavity exists, continuously vacuumizing the sealed cavity by the vacuum generating device (III) within a first preset time period until the sealed cavity reaches a preset pressure, stopping vacuumizing operation, and then standing the sealed cavity for a second preset time period;
the second preset time length is less than or equal to the first preset time length, and the sum of the first preset time length and the second preset time length is less than or equal to the third preset time length.
12. The sensor potting apparatus of claim 11, the apparatus operating rules further comprising: after standing for a second preset time, if the pressure of the closed cavity is equal to the preset pressure, destroying the vacuum state in the closed cavity, and completing glue pouring; if the pressure of the closed cavity is higher than the preset pressure, the vacuum generating device (III) continuously vacuumizes the closed cavity within the first preset time period again until the preset pressure is reached, the vacuumizing operation is stopped, and then the closed cavity is allowed to stand for a second preset time period.
13. The sensor potting apparatus of claim 10, wherein: the first preset time is 1-10 seconds.
14. The sensor potting apparatus of claim 10, wherein: the third preset time is 1-20 seconds.
15. The sensor potting apparatus of claim 11, wherein: the second preset time is 1-10 seconds.
16. The sensor potting apparatus of claim 10, wherein: the vacuum refers to a gas state below a standard atmospheric pressure within a closed cavity.
17. The sensor potting apparatus of claim 10, wherein: and the air is filled into the closed cavity, so that the air pressure in the closed cavity is greater than or equal to a standard atmospheric pressure within the time of less than 10 milliseconds.
18. Sensor glue-pouring device according to claim 8, characterised in that the upper cover means (I) comprise:
a sealing plate (1) fixed in the sealing frame (2);
the sealing frame (2) is fixed on the support (3), and one side wall of the sealing frame is provided with a vacuum generating device (III);
a bracket (3) which is fixed on the conveying mechanism (V).
19. The sensor potting apparatus of claim 18, wherein: an air pipeline is arranged in the sealing frame (2), a plurality of air holes are arranged on the air, and the air pipeline is connected with a vacuum generating device (III).
20. The sensor glue-pouring device according to claim 8, characterized in that the lifting mechanism (II) comprises: the device comprises a cylinder plate (1), a positioning plate (2), a support (3), a connecting block (4), a positioning pin (5), a positioning diamond pin (6), a stop block (7), a linear bearing (8), a sliding column (9) and a cylinder (10);
fixed cylinder (10) and linear bearing (8) on cylinder board (1), locating plate (2) is connected at sliding column (9) top, and during sliding column (9) emboliaed linear bearing (8), fixed connection piece (4) are connected at cylinder (10) top, and fixed location board (2) are connected at connecting piece (4) top, are equipped with at least one locating pin (5), at least one location diamond pin (6) and at least one support (3) on locating plate (2).
21. The sensor potting apparatus of claim 20, wherein: at least two sliding columns (9) are provided, said sliding columns (9) being arranged around the cylinder (10).
22. The sensor potting apparatus of claim 20, wherein: the bottom of the sliding column (9) is provided with a stop block (7).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910629949.0A CN110681541A (en) | 2019-07-12 | 2019-07-12 | Glue pouring method and glue pouring equipment for sensor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910629949.0A CN110681541A (en) | 2019-07-12 | 2019-07-12 | Glue pouring method and glue pouring equipment for sensor |
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| CN110681541A true CN110681541A (en) | 2020-01-14 |
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| CN201910629949.0A Pending CN110681541A (en) | 2019-07-12 | 2019-07-12 | Glue pouring method and glue pouring equipment for sensor |
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| CN114700228A (en) * | 2022-05-31 | 2022-07-05 | 深圳市诺盛豪自动化有限公司 | PLC program vacuum-pumping control device for bi-component glue pouring |
| CN115555221A (en) * | 2022-09-29 | 2023-01-03 | 中车长春轨道客车股份有限公司 | Transverse acceleration sensor for motor train unit and glue filling method thereof |
| CN116037427A (en) * | 2022-11-09 | 2023-05-02 | 北京航天试验技术研究所 | Low-temperature glue filling method for temperature sensor packaging |
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| Publication number | Priority date | Publication date | Assignee | Title |
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