JPH01162236U - - Google Patents
Info
- Publication number
- JPH01162236U JPH01162236U JP1988055487U JP5548788U JPH01162236U JP H01162236 U JPH01162236 U JP H01162236U JP 1988055487 U JP1988055487 U JP 1988055487U JP 5548788 U JP5548788 U JP 5548788U JP H01162236 U JPH01162236 U JP H01162236U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- semiconductor component
- semiconductor
- metallized layer
- conductive pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W70/682—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988055487U JPH01162236U (enExample) | 1988-04-25 | 1988-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988055487U JPH01162236U (enExample) | 1988-04-25 | 1988-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01162236U true JPH01162236U (enExample) | 1989-11-10 |
Family
ID=31281389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988055487U Pending JPH01162236U (enExample) | 1988-04-25 | 1988-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01162236U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003023843A1 (fr) * | 2001-09-05 | 2003-03-20 | Renesas Thechnology Corp. | Dispositif a semi-conducteur, son procede de fabrication et dispositif de communication radio |
-
1988
- 1988-04-25 JP JP1988055487U patent/JPH01162236U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003023843A1 (fr) * | 2001-09-05 | 2003-03-20 | Renesas Thechnology Corp. | Dispositif a semi-conducteur, son procede de fabrication et dispositif de communication radio |