JPH01160304A - Terminal stripper for insulated wire - Google Patents
Terminal stripper for insulated wireInfo
- Publication number
- JPH01160304A JPH01160304A JP62319201A JP31920187A JPH01160304A JP H01160304 A JPH01160304 A JP H01160304A JP 62319201 A JP62319201 A JP 62319201A JP 31920187 A JP31920187 A JP 31920187A JP H01160304 A JPH01160304 A JP H01160304A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- wire
- abrasive grains
- stripped
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006061 abrasive grain Substances 0.000 claims abstract description 16
- 238000003780 insertion Methods 0.000 claims abstract description 8
- 230000037431 insertion Effects 0.000 claims abstract description 8
- 238000005498 polishing Methods 0.000 claims description 7
- 239000007921 spray Substances 0.000 claims 4
- 239000004020 conductor Substances 0.000 abstract description 10
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 238000009413 insulation Methods 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 2
- 238000005422 blasting Methods 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- -1 formal Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- SFKTYEXKZXBQRQ-UHFFFAOYSA-J thorium(4+);tetrahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[Th+4] SFKTYEXKZXBQRQ-UHFFFAOYSA-J 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B24/00—Use of organic materials as active ingredients for mortars, concrete or artificial stone, e.g. plasticisers
- C04B24/24—Macromolecular compounds
- C04B24/26—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C04B24/2641—Polyacrylates; Polymethacrylates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2103/00—Function or property of ingredients for mortars, concrete or artificial stone
- C04B2103/30—Water reducers, plasticisers, air-entrainers, flow improvers
- C04B2103/302—Water reducers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2103/00—Function or property of ingredients for mortars, concrete or artificial stone
- C04B2103/30—Water reducers, plasticisers, air-entrainers, flow improvers
- C04B2103/308—Slump-loss preventing agents
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、エナメル線等の端末絶縁層を効率よく剥離す
るための端末剥離装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an end stripping device for efficiently stripping a terminal insulating layer of an enameled wire or the like.
[従来の技術と問題点]
絶縁電線を機器等に接続して使用するには、端末絶縁層
をf:lI離して導体を露出し、これを電気的に接続し
てやる必要がある。[Prior Art and Problems] In order to use an insulated wire by connecting it to a device or the like, it is necessary to separate the terminal insulating layer by f:lI to expose the conductor and connect it electrically.
使用される電線がビニル被覆線の如きものであれば、絶
縁層の端末剥離は容易であり、機械的に簡単に剥離でき
る。しかし、エナメル線やこれをコイルに巻いたコイル
巻体の端末を剥離する場合には必ずしも容易−とはいえ
ず、その−1r11離方法も絶縁皮膜の種類や導体の断
面形状などにより種々異なる手段が用いられ、皮膜の密
着性が強固であることとも相俟って意外に面倒な手数を
必要とする。If the electric wire used is a vinyl-covered wire, it is easy to peel off the end of the insulating layer, and it can be easily peeled off mechanically. However, it is not always easy to peel off the end of an enameled wire or a coil wound from a coiled wire, and there are various ways to do so depending on the type of insulation coating, the cross-sectional shape of the conductor, etc. Coupled with the strong adhesion of the film, it requires a surprisingly troublesome process.
ポリウレタンエナメル線は直接半田付けを行なえる唯一
のエナメル線であるが、半(11付げによらない接続で
は有機溶剤系剥離剤を必要とする。Polyurethane enamelled wire is the only enamelled wire that can be directly soldered, but connections that do not involve half-bonding require an organic solvent-based stripping agent.
ポリエステル、ホルマール、ポリエステルイミド系のエ
ナメル線には酸あるいはアルカリ系の剥離剤が使用され
る。しかしながら、ポリアミドイミド系やポリイミド系
の耐熱エナメル線の皮膜は上記剥離剤によっては剥離で
きない。このため、50〜90℃の水酸化ナトリウム水
溶液や400〜450℃程度のアルカリ混合(N−,1
0H1K OH等)溶融バスを用いて剥離したり、面倒
な手作業による研磨剥離を行なったりしていた。しかし
、水酸化すトリウム水溶液やアルカリ溶融バスによる剥
離では、加熱時にアルカリの微粒子が飛散したり、端末
皮膜との反応ガスにより溶融アルカリ液が飛び散ったり
し、この飛沫がコイルやリード部の絶縁皮膜上に付着す
ると、長期間の使用中に皮膜への経時的な腐食が進行し
、絶縁性能の低下あるいはコイルの層間短絡などの原因
となる危険性がある。Acid or alkaline stripping agents are used for polyester, formal, and polyesterimide enamelled wires. However, the film of a heat-resistant enameled wire made of polyamide-imide or polyimide cannot be removed by the above-mentioned release agent. For this reason, sodium hydroxide aqueous solution at 50 to 90°C or alkali mixture (N-, 1
0H1K OH, etc.), or a tedious manual polishing process. However, when stripping with a thorium hydroxide aqueous solution or an alkaline melting bath, alkaline fine particles are scattered during heating, and molten alkaline liquid is scattered due to reaction gas with the terminal film, and these droplets are deposited on the insulation film of the coil and lead parts. If it adheres to the surface, corrosion of the film will progress over time during long-term use, leading to a risk of deterioration of insulation performance or short circuit between layers of the coil.
」ユ記のような事態を避けるために、やすりやサンドペ
ーパーあるいはカッターなどを用いて機械的に研削ない
し切削除去する装置もないわけではないが、実用上能率
が悪く導体の削り過ぎの発生などもみられ決して適切な
手段とはいえない。In order to avoid a situation like the one mentioned above, there are some devices that use files, sandpaper, cutters, etc. to mechanically grind or remove the material, but in practice it is inefficient and may cause over-shaving of the conductor. This is by no means an appropriate method.
[発明の目的]
本発明は、上記したような従来技術の問題点を解消し、
化学的方法によらずして皮膜剥離を完全迅速に行なうこ
とができ、しかも導体の削り過ぎや断面積の細りといっ
た問題も最少限に止め得る新規な絶縁電線の端末剥離装
置を提供しようとするものである。[Object of the invention] The present invention solves the problems of the prior art as described above, and
An object of the present invention is to provide a novel device for stripping the terminals of insulated wires, which can completely and quickly strip the film without using chemical methods, and can also minimize problems such as overshaving of the conductor and thinning of the cross-sectional area. It is something.
[発明の概要]
すなわち、本発明の要旨とするところは、砥粒を内蔵し
た吹付は研磨槽を用窓し、該研磨槽に電線の端末を挿入
突出させる挿入孔と当該端末に向って前記砥粒を吹付け
る吹付はノズルとを設置したことにあり、剥離すべき電
線端末を前記挿入孔より挿入してやるだけで、吹付は砥
粒が絶縁皮膜を完全に除去し去り得るようにし、しかも
エアによる吹付けを用いたことで導体への削り過ぎを剋
少眼に止め得るように配慮されるものである。[Summary of the Invention] That is, the gist of the present invention is that the spraying device containing abrasive grains is formed by using a polishing tank, an insertion hole for inserting and protruding the end of the electric wire into the polishing tank, and a The purpose of spraying the abrasive grains is to install a nozzle, and by simply inserting the end of the wire to be stripped through the insertion hole, the abrasive grains can completely remove the insulating film. By using the spraying method, consideration was given to minimizing excessive cutting of the conductor.
[実施例] 以下に、本発明について実施例に基いて説明する。[Example] The present invention will be explained below based on examples.
第1図は、本発明に係る端末剥離装置の実施例の−を示
す説明断面図である。FIG. 1 is an explanatory sectional view showing - of an embodiment of the end peeling device according to the present invention.
1は研磨槽であり、内面ライニング2が施された密封型
容器により構成される。研磨槽1内には当該槽内に内蔵
された砥粒10をエア5により噴出せしめるノズル3が
あり、ノズル3はエアパイ1部3aと前記砥粒の吸入l
183bにより構成されている。一方、前記ノズル3に
より砥粒10が噴出される前方には電線20の端末21
を挿入可能になる挿入孔4aを有するシールド板4があ
り、該シールド板4は例えばゴム等よりなり、電線20
の必要な端末長さ分のみをM!11内に突出させて池を
完全にシールドできるように構成される。Reference numeral 1 denotes a polishing tank, which is constituted by a sealed container provided with an inner lining 2. In the polishing tank 1, there is a nozzle 3 that blows out the abrasive grains 10 contained in the tank with air 5, and the nozzle 3 has an air pipe 1 part 3a and a suction l
183b. On the other hand, the end 21 of the electric wire 20 is located in front of the nozzle 3 where the abrasive grains 10 are ejected.
There is a shield plate 4 having an insertion hole 4a into which an electric wire 20 can be inserted.
Only the required terminal length is M! 11 so that the pond can be completely shielded.
上記のように構成される本発明に係る端末剥離装置によ
り絶縁電線20の端末を剥離するには、電線20のt1
1離分だけの端末長を前記シールド板4の挿入孔4aよ
り槽1内に挿入突出せしめる。In order to strip the terminal of the insulated wire 20 using the terminal stripping device according to the present invention configured as described above, t1 of the wire 20 is removed.
The terminal length of one separation is inserted and projected into the tank 1 through the insertion hole 4a of the shield plate 4.
ついで、エアパイプ3aよりエア5を図中矢印のように
送り込む一方、当該エア5の送り込みにより内部が負圧
となった吸入iY43 bを介して砥粒10を図中矢印
のように吸入し、エア5と砥粒10の混合流10−をノ
ズル3より図中矢印のように噴射して前記突出せしめた
端末21に向って吹き付ける。これによりいわばサンド
ブラスト効果によって端末21の皮膜が剥離され、導体
が露出される。Next, air 5 is fed from the air pipe 3a as shown by the arrow in the figure, and abrasive grains 10 are sucked in as shown by the arrow in the figure through the suction iY43b whose internal pressure has become negative due to the feeding of the air 5. A mixed flow 10- of abrasive grains 5 and abrasive grains 10 is injected from the nozzle 3 as shown by the arrow in the figure, and is sprayed toward the protruding end 21. As a result, the film on the terminal 21 is peeled off by a so-called sandblasting effect, and the conductor is exposed.
このサンドブラスト効果は、砥粒10の材で1、形状さ
らには吹き付けるエア5の圧力、ノズル3の形状等々に
より適当なものに加減することは容易であり、それによ
り皮膜のみを選択的に剥離させ、導体にはほとんど余分
な研削を与えることなく完全な皮膜の剥離を施すことが
できる。しかもその剥離は、砥粒をもってする純然たる
機械的剥離であり、前記従来例における化学的剥離に付
随したような面倒な諸問題は完全に解消されるものであ
る。This sandblasting effect can be easily adjusted to an appropriate value depending on the material of the abrasive grains 10, the shape, the pressure of the air 5 being blown, the shape of the nozzle 3, etc., and thereby only the coating can be selectively removed. , the conductor can be completely stripped of its coating with little additional grinding. Furthermore, the peeling is purely mechanical peeling using abrasive grains, and the troublesome problems associated with the chemical peeling in the prior art examples are completely eliminated.
なお、第1図のようにノズル3が1個の場合には、全周
剥離のためには電線20を回転さぜるなど適宜な処置が
必要であるが、第2図に示すように対のノズル3.3−
を相対向した位置に設置してやれば、前記回転を与えず
どもほぼ全面にわたる皮膜の剥離が可能となる上、剥離
に要する時間を半減させることができ、高い効率をもっ
て剥離を行ない得るというメリットがある。このノズル
の設置数は2個に限らずさらに複数個を電線端末の周囲
に配置してもよく、それにより一層の効率アップと剥離
面の品質の向上を図ることができる。Note that when there is only one nozzle 3 as shown in Fig. 1, appropriate measures such as rotating the electric wire 20 are required to remove the entire circumference, but as shown in Fig. 2, appropriate measures are required. Nozzle 3.3-
If they are installed in opposite positions, it is possible to peel off the film over almost the entire surface without applying the rotation, and the time required for peeling can be halved, which has the advantage of being able to perform the peeling with high efficiency. . The number of nozzles installed is not limited to two, and a plurality of nozzles may be placed around the wire terminal, thereby further increasing efficiency and improving the quality of the peeled surface.
本発明装置による剥離後には、導体の外表面に微細な凹
凸が生ずるが、このような凹凸はとくに端末を半田付け
する際のぬれ性の増大に資するものであり、接続部の信
頼性の向上を図り得るという付加的長所をも期待、する
ことができる。After peeling using the device of the present invention, minute irregularities are formed on the outer surface of the conductor, but these irregularities particularly contribute to increasing the wettability when soldering the terminal, improving the reliability of the connection part. The additional advantage of being able to achieve this can also be expected.
[発明の効果]
以上の通り、本発明に係る剥離装置によれば、酸やアル
カリの使用がないから、そのための従来の不具合が一掃
される上、手作業による以外適当な手段のなかった電線
たとえば平角エナメル線の端末部の剥離をも可能ならし
め、総体的にillll開時間縮およびg、II離面の
品質を向上し得る意義は大きい。[Effects of the Invention] As described above, according to the stripping device according to the present invention, since there is no use of acid or alkali, the conventional problems related to this are eliminated, and the stripping device according to the present invention can remove electric wires for which there was no other suitable method other than manual work. For example, it is of great significance that it is possible to peel off the end portion of a rectangular enamelled wire, thereby reducing the illll opening time and improving the quality of the g and II peeling surfaces overall.
第1図は、本発明に係る具体的装置により電線端末の剥
離作業を行なっている様子を示す説明断面図、第2図は
別な実施例を示す説明断面図である。
1:研磨槽、
3:ノズル、
4:シールド板、
4a:端末挿入孔、
5:エア、
10:砥粒、
20:絶縁電線、
21:端末。
代理人 弁理士 佐 藤 不二雄FIG. 1 is an explanatory sectional view showing how a wire end is stripped by a specific device according to the present invention, and FIG. 2 is an explanatory sectional view showing another embodiment. 1: polishing tank, 3: nozzle, 4: shield plate, 4a: terminal insertion hole, 5: air, 10: abrasive grain, 20: insulated wire, 21: terminal. Agent Patent Attorney Fujio Sato
Claims (2)
された電線端末挿入のためのシールド挿入孔と、当該シ
ールド挿入孔より挿入突出された電線端末に向って前記
砥粒を吹付ける吹付けノズルとを有してなる絶縁電線の
端末剥離装置。(1) A spray polishing tank containing abrasive grains, a shield insertion hole formed in the polishing tank for inserting the wire end, and the abrasive grains directed toward the wire end inserted and protruding from the shield insertion hole. A terminal stripping device for an insulated wire, comprising a spray nozzle.
るよう対に設置されてなる特許請求の範囲第1項記載の
端末剥離装置。(2) The end stripping device according to claim 1, wherein the spray nozzles are installed in pairs so that spray can be sprayed from opposite positions.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62319201A JPH01160304A (en) | 1987-12-17 | 1987-12-17 | Terminal stripper for insulated wire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62319201A JPH01160304A (en) | 1987-12-17 | 1987-12-17 | Terminal stripper for insulated wire |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01160304A true JPH01160304A (en) | 1989-06-23 |
Family
ID=18107540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62319201A Pending JPH01160304A (en) | 1987-12-17 | 1987-12-17 | Terminal stripper for insulated wire |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01160304A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013093158A1 (en) | 2011-12-19 | 2013-06-27 | Fundación Prodintec | Device for scouring cables |
WO2020152962A1 (en) * | 2019-01-23 | 2020-07-30 | パナソニックIpマネジメント株式会社 | Terminal and joining method for terminal |
-
1987
- 1987-12-17 JP JP62319201A patent/JPH01160304A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013093158A1 (en) | 2011-12-19 | 2013-06-27 | Fundación Prodintec | Device for scouring cables |
EP2797188A1 (en) * | 2011-12-19 | 2014-10-29 | Fundación Prodintec | Device for scouring cables |
EP2797188A4 (en) * | 2011-12-19 | 2015-04-08 | Fundación Prodintec | Device for scouring cables |
WO2020152962A1 (en) * | 2019-01-23 | 2020-07-30 | パナソニックIpマネジメント株式会社 | Terminal and joining method for terminal |
JPWO2020152962A1 (en) * | 2019-01-23 | 2021-09-09 | パナソニックIpマネジメント株式会社 | Terminal and terminal joining method |
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