JP2023125817A - Method for manufacturing laminated ceramic electronic component - Google Patents

Abstract

To provide a method for manufacturing a laminated ceramic electronic component which is excellent in electric characteristics.SOLUTION: A method for manufacturing a laminated ceramic electronic component includes cutting a mother laminate including a resin binder where a dielectric ceramic layer and an internal electrode layer are alternately laminated, preparing a laminate 13, and polishing and cleaning a cut surface 9 of the laminate 13 using a jet flow 23 of a blast material. The blast material is frozen particles of a blast liquid having no compatibility with the resin binder.SELECTED DRAWING: Figure 5

Description

The present disclosure relates to a method of manufacturing a laminated ceramic electronic component.

In recent years, as electronic devices have become smaller and more sophisticated, there has been a demand for smaller electronic components installed in electronic devices. Multilayer ceramic capacitors, which are an example of multilayer ceramic electronic components, are mainly products with a side length of 1 mm or less, but there is a demand for further miniaturization and larger capacity.

In order to make a multilayer ceramic capacitor smaller and larger in capacity, it is effective to make the side margins around the internal electrode layers thinner. In order to make the side margins thinner, the mother laminate, which is made up of dielectric layers and internal electrode layers stacked alternately, is cut to create a laminate with internal electrode layers exposed on the side surfaces. There is a method of forming a protective layer which will become a side margin portion afterward. In such a method, in order to suppress short circuits between internal electrode layers with different polarities, before forming a protective layer, remove foreign matter such as cutting debris that is generated when cutting the base laminate and adhere to the side surfaces of the laminate. needs to be removed. Patent Document 1 discloses a method for manufacturing a multilayer ceramic capacitor, which includes a step of removing foreign matter adhering to the side surface of a laminate.

JP2017-120880A

Conventional methods for manufacturing laminated ceramic electronic components sometimes fail to efficiently and with high quality remove foreign matter adhering to the side surfaces of the laminated body, resulting in deterioration of the electrical characteristics of the laminated ceramic electronic components.

A method for manufacturing a laminated ceramic electronic component according to the present disclosure includes cutting a mother laminate containing a resin binder in which dielectric ceramic layers and internal electrode layers are alternately laminated to produce a laminate;
The cut surfaces of the laminate are polished and cleaned using a jet stream of a blasting material that is frozen particles of a blasting liquid that is incompatible with the resin binder.

According to the method for manufacturing a laminated ceramic electronic component of the present disclosure, foreign matter adhering to the cut surface of a laminate can be removed efficiently and with high quality, so a laminated ceramic electronic component with excellent electrical properties can be manufactured. .

FIG. 2 is a perspective view showing a multilayer ceramic capacitor. FIG. 2 is a perspective view showing the element body components of the multilayer ceramic capacitor shown in FIG. 1. FIG. 3 is a perspective view showing an element body precursor that is a precursor of the element body component of FIG. 2. FIG. FIG. 4 is an enlarged cross-sectional view showing an enlarged side surface of the element body precursor of FIG. 3; FIG. 4 is a perspective view showing how the side surface of the element body precursor shown in FIG. 3 is polished and cleaned. FIG. 4 is a perspective view showing how the side surface of the element body precursor shown in FIG. 3 is polished and cleaned. FIG. 3 is an enlarged cross-sectional view showing how the side surface of the element body precursor is polished and cleaned. FIG. 3 is a plan view showing how the side surface of the element body precursor is polished and cleaned. FIG. 3 is an enlarged cross-sectional view showing the element body precursor after polishing and cleaning. FIG. 2 is a perspective view showing a ceramic green sheet printed with conductive paste. FIG. 2 is a perspective view showing a stacked state of ceramic green sheets printed with conductive paste. FIG. 3 is a perspective view showing a mother laminate. FIG. 3 is a perspective view of a plurality of element body precursors obtained by cutting a mother laminate. FIG. 3 is a perspective view showing the element body precursor rotated so that the side surfaces are positioned in the vertical direction. FIG. 3 is a diagram illustrating a process of attaching a ceramic green sheet serving as a protective layer to the side surface of the element body precursor. FIG. 3 is a diagram illustrating a process of attaching a ceramic green sheet serving as a protective layer to the side surface of the element body precursor. FIG. 3 is a diagram illustrating a process of attaching a ceramic green sheet serving as a protective layer to the side surface of the element body precursor. FIG. 2 is a perspective view showing an element body precursor with a protective layer formed on the side surface. It is a sectional view showing a blast nozzle of a blasting device.

Hereinafter, embodiments of the method for manufacturing a multilayer ceramic electronic component of the present disclosure will be described with reference to the drawings. In the following, a method for manufacturing a multilayer ceramic capacitor, which is an example of a multilayer ceramic electronic component, will be described. However, the method for manufacturing a multilayer ceramic electronic component according to the present disclosure is not limited to the method for manufacturing a multilayer ceramic capacitor; It can also be applied to methods of manufacturing various laminated ceramic electronic components such as thermistor elements, laminated chip coils, and ceramic multilayer substrates. The drawings referred to below are schematic, and the dimensional ratios etc. shown in the drawings are not necessarily accurately illustrated. Further, in some of the drawings, for convenience, an orthogonal coordinate system XYZ is defined, and the positive direction of the Z direction is assumed to be upward, and terms such as upper surface or lower surface are used. The X direction, Y direction, and Z direction are also referred to as a first direction, a second direction, and a third direction, respectively.

1 is a perspective view showing a multilayer ceramic capacitor, FIG. 2 is a perspective view showing an element body part of the multilayer ceramic capacitor shown in FIG. 1, and FIG. 3 is a precursor of the element body part shown in FIG. 2. FIG. 4 is a perspective view showing the element body precursor, and FIG. 4 is an enlarged sectional view showing an enlarged side surface of the element body precursor in FIG. 3. FIG. FIG. 5 is a perspective view showing how the side surface of the element body precursor in FIG. 3 is polished and cleaned, and FIG. 6 is a perspective view showing how the side surface of the element body precursor in FIG. 3 is polished and cleaned. FIG. 7A is an enlarged sectional view showing how the side surface of the element body precursor is polished and cleaned, FIG. 7B is a plan view showing how the side surface of the element body precursor is polished and cleaned, and FIG. 7C is a top view showing how the side surface of the element body precursor is polished and cleaned. FIG. 3 is an enlarged cross-sectional view showing the element body precursor after cleaning. FIG. 8 is a perspective view showing a ceramic green sheet printed with conductive paste, FIG. 9 is a perspective view showing a laminated state of ceramic green sheets printed with conductive paste, and FIG. FIG. 11 is a perspective view of a plurality of element body precursors obtained by cutting the base laminate, and FIG. 12 is a perspective view of a plurality of element body precursors obtained by cutting the base laminate, and FIG. FIG. 2 is a perspective view showing an element body precursor. 13A, 13B, and 13C are diagrams illustrating the process of pasting a ceramic green sheet serving as a protective layer on the side surface of the element body precursor, and FIG. 14 shows the element body precursor with a protective layer formed on the side surface. FIG. FIG. 15 is a sectional view showing the blast nozzle of the blasting device. Although the fired element body part has shrunk due to firing, it has the same structure as the element body part before firing. Therefore, FIG. 2 is a diagram showing both the element body part after firing and the element body part before firing. In FIGS. 8 and 9, the conductive paste serving as the internal electrode layer is hatched for ease of illustration.

A multilayer ceramic capacitor 1 includes, for example, as shown in FIG. 1, an element body part 2 and an external electrode 3. The element body component 2 includes, for example, a laminate 13 and a protective layer 6, as shown in FIG. The laminate 13 is a precursor of the element body component 2, and is also referred to as the element body precursor 13.

For example, as shown in FIG. 3, the laminate 13 is configured by dielectric ceramic layers (hereinafter also referred to as dielectric layers) 4 and internal electrode layers 5 alternately stacked in the third direction (Z direction). There is. The laminate 13 has a substantially rectangular parallelepiped shape. The laminate 13 has a first surface 7A and a second surface 7B that face each other in the third direction. The laminate 13 has a first end face 8A and a second end face 8B that face each other in the first direction (X direction), and a first side face 9A and a second side face 9B that face each other in the second direction (Y direction). ing. Below, the first surface 7A and the second surface 7B may be collectively referred to as the main surface 7, the first end surface 8A and the second end surface 8B may be collectively referred to as the end surface 8, and the first side surface 9A and the second side surface 9B may be collectively referred to as a side surface 9.

The dielectric layer 4 is made of an insulating material. The dielectric layer 4 may be made of a ceramic material such as BaTiO ₃ (barium titanate), CaTiO ₃ (calcium titanate), SrTiO ₃ (strontium titanate), BaZrO ₃ (barium zirconate), or the like. The dielectric layer 4 may have BaTiO ₃ as a main component. In this specification, the term "main component" refers to the component having the highest content (% by mass) in the material, member, etc. of interest.

The thinner the dielectric layer 4 is, the larger the capacitance of the multilayer ceramic capacitor 1 becomes. The thickness of the dielectric layer 4 may be, for example, about 0.5 μm to 10 μm.

The internal electrode layer 5 is made of a conductive material. The internal electrode layer 5 is made of a metal material such as Ni (nickel), Cu (copper), Ag (silver), Sn (tin), Pt (platinum), Pd (palladium), Au (gold), or these metal materials. It may be made of an alloy material containing.

As shown in FIG. 3, the internal electrode layer 5 is exposed on the first side surface 9A and the second side surface 9B. The internal electrode layer 5 has an electrode end portion 51 exposed on the side surface 9, and the electrode end portion 51 extends in a predetermined direction. FIG. 3 shows an example in which the direction in which the electrode end portion 51 extends is the first direction (X direction). Further, the internal electrode layer 5 is exposed at the first end surface 8A or the second end surface 8B depending on the polarity.

As long as the characteristics as a capacitor can be ensured, the thinner the internal electrode layer 5 is, the more internal defects due to internal stress can be suppressed and the reliability of the multilayer ceramic capacitor can be improved. When the multilayer ceramic capacitor 1 is a capacitor with a high number of laminated layers, the thickness of the internal electrode layer 5 may be, for example, about 1.5 μm or less.

External electrode 3 is used for electrical connection with the outside. The external electrode 3 includes a first external electrode 3A and a second external electrode 3B, as shown in FIG. The first external electrode 3A is located on the first end surface 8A and electrically connected to the internal electrode layer 5 exposed on the first end surface 8A. The second external electrode 3B is located on the second end surface 8B and electrically connected to the internal electrode layer 5 exposed on the second end surface 8B. The first external electrode 3A and the second external electrode 3B wrap around the first surface 7A and the second surface 7B. The first external electrode 3A extends over the first side surface 9A and the second side surface 9B, and covers a portion of the protective layer 6 closer to the first end surface 8A. The second external electrode 3B extends over the first side surface 9A and the second side surface 9B, and covers a portion of the protective layer 6 near the second end surface 8B. The first external electrode 3A and the second external electrode 3B are electrically insulated from each other.

The external electrode 3 may be composed of a base layer connected to the element body component 2 and a plating outer layer that facilitates solder mounting. The base layer may be applied and baked on the element body part 2 after firing, or may be applied on the element body part 2 before firing and fired at the same time as the element body part 2. The base layer may be formed by direct plating. Each of the base layer and the outer plating layer may be composed of a single layer or a plurality of layers. The base layer and the outer plating layer may be made of a metal material such as Ni, Cu, Ag, Pd, or Au, or an alloy material containing these metal materials. The base layer and the outer plating layer may have a conductive resin layer as an intermediate layer or outer layer.

On the first side surface 9A and the second side surface 9B, the internal electrode layer 5 of the positive electrode and the internal electrode layer 5 of the negative electrode are adjacent to each other with the dielectric layer 4 in between. The protective layer 6 is located on the first side surface 9A and the second side surface 9B, and electrically insulates the internal electrode layers 5 having different polarities from each other, and physically protects the electrode end portion 51 of the internal electrode layer 5. There is.

The protective layer 6 is made of an insulating material. The protective layer 6 may be composed of a ceramic material, in which case the protective layer 6 may have insulating properties and relatively high mechanical strength. The protective layer 6 may be made of a ceramic material such as BaTiO ₃ , CaTiO ₃ , SrTiO ₃ , BaZrO ₃ or the like. The protective layer 6 may be made of the same ceramic material that makes up the dielectric layer 4. When the protective layer 6 is made of a ceramic material, it becomes possible to fire the laminate 13 and the protective layer 6 at the same time. In FIG. 2, the boundary between the laminate 13 and the protective layer 6 is shown by a two-dot chain line, but the actual boundary does not appear clearly.

The thinner the protective layer 6 is, the smaller and larger the capacity of the multilayer ceramic capacitor 1 can be. The thickness of the protective layer 6 may be, for example, about 5 μm to 40 μm.

The laminate 13 before firing can be produced, for example, as shown in FIGS. 8 to 11, by cutting a base laminate 11 formed by laminating a plurality of ceramic green sheets 10 on which internal electrode layers 5 are printed. . The mother laminate 11 can be cut by pushing, for example, using a cutting blade 28 such as a pushing cutting blade. Lamination of the ceramic green sheets 10 and cutting of the base laminate 11 may be performed on a support sheet. As the support sheet, for example, an adhesive release sheet that can be adhesively and peeled off, such as a weak adhesive sheet or a foamed release sheet, can be used.

FIG. 4 shows a side surface (hereinafter also referred to as a cut surface or a surface to be cleaned) 9 of a laminate 13 obtained by cutting the mother laminate 11. The black circles indicate the metal powder of the internal electrode layer 5 existing within the resin matrix, and the white circles indicate the ceramic powder of the dielectric layer 4 existing within the resin matrix. The resin matrix has the resin binder 16 as a main component, and may also contain a plasticizer, a dispersant, a solvent component, etc. in addition to the resin binder 16.

When cutting the mother laminate 11, the cutting blade 28 enters the mother laminate 11 from the main surface side (the upper side in FIG. 4) of the mother laminate 11. Since the side surface 28a of the cutting blade 28 moves while rubbing the cutting surface 9, the ceramic powder and metal powder exposed on the cutting surface 9 are dragged along with the resin binder 16 in the direction in which the cutting blade 28 moves. . As a result, as shown in FIG. 4, for example, the metal powder constituting the internal electrode layer 5 may move and adhere to the end portion 41 of the dielectric layer 4 exposed on the cut surface 9. On the cut surface 9, the internal electrode layer 5 of the positive electrode and the internal electrode layer 5 of the negative electrode are adjacent to each other with the dielectric layer 4 in between. Therefore, if the protective layer 6 is formed with the metal powder constituting the internal electrode layer 5 adhering to the end portion 41 of the dielectric layer 4, a short circuit between the positive internal electrode layer 5 and the negative internal electrode layer 5 may occur. It may cause deterioration of insulation resistance. Furthermore, when the mother laminate 11 placed on the support sheet is cut by force, the cut surface 9 shows that not only the metal powder constituting the internal electrode layer 5 has moved to the end portion 41 of the dielectric layer 4; It is contaminated with debris from the ceramic green sheet 10, the resin binder contained in the ceramic green sheet 10, and the glue from the support sheet that has adhered to the cutting blade 28 and transferred to the cut surface 9. Metal powder that has moved to the end 41 of the dielectric layer 4 may cause a short circuit or deterioration of insulation resistance, and organic substances such as resin binder and glue may cause voids to form in the element component 2 after firing. , there is a risk of reducing the electrical properties of the product, especially the voltage resistance of the product. Therefore, in order to suppress the deterioration of the electrical characteristics of the multilayer ceramic capacitor to be manufactured (hereinafter also simply referred to as a product), it is necessary to prevent metal powder adhering to the end 41 of the dielectric layer 4 and ceramic adhering to the cut surface 9. It is necessary to remove debris from the green sheet 10, the resin binder contained in the ceramic green sheet 10, the glue from the support sheet, and the like. In the following, metal powder adhering to the end portion 41 of the dielectric layer 4, scraps of the ceramic green sheet 10 adhering to the cut surface 9, resin binder contained in the ceramic green sheet 10, glue of the support sheet, etc. will be removed as foreign matter 19. It is sometimes called.

A possible method for removing the foreign matter 19 is to polish and clean the cut surface 9 using a blast polishing method. However, since the dielectric layer 4 and the internal electrode layer 5 are exposed on the cut surface 9 at narrow intervals of, for example, several μm or less, the conventional blast polishing method is difficult to cut without damaging the cut surface 9. It is difficult to polish and clean surface 9. If the particle size of the blasting material is large, the foreign matter 19 can be removed, but the cut surface 9 may be damaged. When the particle size of the blasting material is small, the risk of damaging the cut surface 9 can be reduced, but there is a possibility that the impact energy of the blasting material against the cut surface 9 will be insufficient and the foreign matter 19 will not be removed. Furthermore, if the laminate 13 is fired with the blasting material still attached to the cut surface 9, the dielectric composition contained in the laminate 13 will react with the components contained in the blasting material and change in quality, resulting in the product being damaged. There is a risk of deterioration of electrical characteristics.

In the method for manufacturing a multilayer ceramic electronic component according to the present disclosure, the cut surface 9 is polished and cleaned using a blast polishing method that uses frozen particles of a blasting liquid as a blasting material, and the foreign matter 19 attached to the cut surface 9 is removed. As the blasting liquid, one that is easy to process after polishing and cleaning and is low cost may be used.

Further, in the manufacturing method of the present disclosure, a jet stream 23 of frozen particles 31 injected from a blast nozzle (hereinafter also simply referred to as a nozzle) 22 of a blasting device is made to collide with the cut surface 9 to polish and clean the cut surface 9. do. At the cut surface 9, a relatively soft dielectric layer 4 and a relatively hard internal electrode layer 5 are exposed in layers. In order to suppress damage to the cut surface 9 due to polishing and cleaning, it is necessary to reduce the size (ie, mass) of the frozen particles 31 that are the blasting material. However, as the mass of the frozen particles 31 decreases, the energy of collision with the cut surface 9 decreases, so if the size of the frozen particles 31 is made too small, the cut surface 9 cannot be efficiently polished and cleaned. Since the collision energy of the frozen particles 31 is proportional to the square of the speed of the frozen particles 31, by increasing the speed of the frozen particles 31, even if the mass of the frozen particles 31 is small, the cutting surface 9 can be cut efficiently. It becomes possible to polish and clean. In this way, by adjusting the size, injection speed, etc. of the frozen particles 31, it becomes possible to remove the foreign matter 19 without damaging the cut surface 9.

Further, in the manufacturing method of the present disclosure, a liquid that is incompatible with the resin binder 16 contained in the laminate 13 is used as the blasting liquid. Thereby, even if the frozen particles 31 are melted due to collision with the cut surface 9, etc., it is possible to reduce the possibility that the blasting liquid will swell or deform the laminate 13. Therefore, the cut surface 9 can be polished and cleaned without deteriorating the characteristics and quality of the laminate 13. As the blasting liquid, even if the components of the blasting liquid remain on the surface or inside of the laminate 13 when the laminate 13 is dried after polishing and cleaning, one that has a small effect on the electrical characteristics of the product is used. It's okay.

The frozen particles 31 of the blasting liquid may have a spherical equivalent diameter (hereinafter also referred to as spherical equivalent diameter) of about 20 μm or less. In this case, polishing and cleaning can be stably performed in which the amount of polishing of the cut surface 9 can be controlled within 10 μm. The frozen particles 31 of the blasting liquid may have an average diameter of approximately 20 μm or less in terms of sphere, and some of the frozen particles 31 may have a diameter of more than 20 μm in terms of sphere.

The frozen particles 31 of the blasting liquid may be ejected from the blasting device at a speed of, for example, 300 m/sec or more. In this case, even when the spherical equivalent diameter of the frozen particles 31 is small (for example, about 20 μm or less), the collision energy against the cut surface 9 can be set to a level that can remove the foreign matter 19.

The nozzle 22 of the blasting device may include a Laval nozzle 22a, as shown in FIG. 15, for example. The Laval nozzle 22a has a tubular shape with a constriction in which the cross-sectional area of the flow path (hereinafter also referred to as the nozzle cross-sectional area) is locally reduced, and the compressed air hose 30 (see FIGS. 5 and 6) is Compressed air 29 sent through is supplied. When compressed air 29 is supplied to the Laval nozzle 22a, the gas velocity becomes the sonic speed (Mach number is 1) at the throat section 22aa where the nozzle cross-sectional area is the smallest, and the gas expands at the downstream stage of the throat section 22aa in the gas flow direction. , the gas velocity reaches supersonic speed. The blasting liquid is introduced into the Laval nozzle 22a via the liquid supply hose 21 upstream of the throat portion 22a in the gas flow direction. The liquid droplets discharged from the liquid supply hose 21 expand and break due to the rapid adiabatic expansion of the gas, and become fine frozen particles 31 containing supercooled liquid droplets, together with the jet flow 23. It is ejected from the blast nozzle 22. In this way, when the nozzle 22 is configured to include the Laval nozzle 22a, the blasting device can be transformed into a simple device that sprays the jet stream 23 of frozen particles 31 of the blasting fluid by simply supplying the compressed air 29 and the blasting fluid. This makes it possible to reduce the burden of manufacturing including running costs. In this specification, the frozen particles 31 refer to solid frozen particles mixed with supercooled fine liquid particles (hereinafter also simply referred to as liquid droplets or water droplets). Supercooled droplets that have not become frozen particles 31 within the Laval nozzle 22a have the property of becoming frozen particles 31 when they collide with the cut surface 9.

The throat portion 22aa of the Laval nozzle 22a may have a diameter of, for example, about 1.5 mm. The exit shape of the Laval nozzle 22 may be, for example, circular with a diameter of about 2 mm to 12 mm, or rectangular with a diameter of about 50 mm x 1 mm.

The size (mass), hardness, etc. of frozen particles 31 can be controlled by adjusting the pressure of compressed air 29 and the amount of blasting liquid supplied to Laval nozzle 22a. When the pressure of the compressed air 29 is high, the spherical equivalent diameter of the frozen particles 31 tends to become small, and when the amount of blasting liquid is large, the spherical equivalent diameter of the frozen particles 31 tends to become large. Moreover, the frozen particles 31 injected from the nozzle 22 begin to combine with each other when their speed decreases during flight. Therefore, as the distance from the exit side tip of the nozzle 22 (hereinafter also referred to as the tip of the nozzle 22) increases, the spherical equivalent diameter of the frozen particles 31 tends to increase. The tip of the nozzle 22 may be the tip on the exit side of the Laval nozzle 22a.

The Laval nozzle 22a can spray frozen particles 31 at a speed of 300 m/sec to 450 m/sec. The inventors believe that if the injection speed of the frozen particles 31 is 300 m/sec to 450 m/sec, even if the spherical equivalent diameter of the frozen particles 31 is small (for example, 1 μm to 20 μm), the cut surface of the laminate 13 It has been found that the product can be polished and cleaned, and the deterioration of the electrical properties of the product can be suppressed. Note that by increasing the distance between the tip of the nozzle 22 and the cutting surface 9, the size (mass) of the frozen particles 31 can be increased, but the flying speed of the frozen particles 31, that is, the collision energy with the cutting surface 9 decreases. Therefore, the polishing cleaning power of the jet stream 23 may be reduced. By setting the distance between the tip of the nozzle 22 and the cut surface 9 to about 5 mm to 20 mm, and setting the spherical equivalent diameter of the frozen particles 31 to about 1 μm to 20 μm, it is possible to efficiently polish and clean the cut surface 9. Become. Further, the pressure of the compressed air 29 supplied to the Laval nozzle 22a may be, for example, 0.3 MPa or higher, and in this case, the cut surface 9 can be efficiently polished and cleaned. Note that the size and speed of the frozen particles 31 injected from the nozzle 22 can be measured using, for example, a phase Doppler anemometry (PDA). The size and speed of the frozen particles 31 may be measured, for example, at a position 10 mm from the tip of the nozzle 22.

FIG. 5 shows how the cut surface 9 of the laminate 13 is polished and cleaned. For example, as shown in FIG. 5, the plurality of laminates 13 obtained by cutting the mother laminate 11 are placed on one of the first side surface 9A and the second side surface 9B (in FIG. 5, the first side surface 9B). They are arranged with the side surface 9A) as the open surface. The other of the first side surface 9A and the second side surface 9B (the second side surface 9B in FIG. 5) of the plurality of laminates 13 is fixed to the first surface 18a of the support sheet 18. As the support sheet 18, an adhesive release sheet that can be adhesively and peeled off, such as a weak adhesive sheet or a foamed release sheet, can be used. The support sheet 18 to which the laminate 13 is attached may be fixed on a pedestal (not shown) using a holding device such as a vacuum suction mechanism or a mechanical clamp.

The blasting liquid may be water, especially pure water. In this case, since the frozen particles serve as the blasting material, the environmental load associated with polishing and cleaning can be reduced. Further, by using water as the blasting liquid, which is easily available and can be used in large quantities at low cost, the manufacturing cost of the product can be reduced. Furthermore, the resin binder 16 contained in the ceramic green sheets 10 and the internal electrode layers 5 that constitute the laminate 13 is generally soluble in an organic solvent, but is not compatible with pure water. Therefore, by using pure water as the blasting liquid, it is possible to reduce the risk that the blasting liquid will swell or deform the laminate 13, and as a result, the laminate 13 can be cut without deteriorating its properties and quality. Surface 9 can be polished and cleaned.

The water introduced into the Laval nozzle 22a collides with the surface to be cleaned 9 in the form of frozen particles or partially supercooled water droplets. Most of the frozen particles or partially supercooled water droplets that collide with the surface to be cleaned 9 become frozen particles, but some of them melt and become water, so water may remain on the surface to be cleaned 9 . The laminate 13 may contain inorganic components that dissolve in water upon prolonged contact with water. If the components contained in the laminate 13 are eluted into water, the properties and quality of the laminate 13 may deteriorate. Therefore, when water is used as the blasting liquid, it is required to reduce the influence of water on the laminate 13. In the manufacturing method of the present disclosure, as described below, the influence of water on the laminate 13 can be reduced by controlling the amount of water supplied to the Laval nozzle 22a.

The amount of water supplied to the Laval nozzle 22a may be 200 cc/min or less with respect to the air amount of 1000 NL/min of the jet stream 23. In other words, the amount of water supplied to the Laval nozzle 22a may be 200 ppm or less in volume ratio with respect to the amount of air in the jet stream 23 under atmospheric pressure and in a standard state of 0°C. In this case, the proportion of frozen particles in the jet flow 23 increases and the proportion of supercooled water droplets decreases, so that the influence of water on the laminate 13 can be reduced.

The amount of water supplied to the Laval nozzle 22a may be 50 ppm or less in volume ratio with respect to the amount of air in the jet stream 23 under atmospheric pressure and in a standard state of 0°C. In this case, since most of the water introduced into the Laval nozzle 22a collides with the surface to be cleaned 9 in the form of frozen particles, the influence of water on the laminate 13 can be effectively reduced. Note that the amount of frozen particles may be 2 ppm or more in volume ratio with respect to the amount of air in the jet stream 23. In this case, the polishing efficiency by the jet flow 23 of frozen particles can be made to a level that can be employed in a mass production process.

The temperature of the water supplied to the Laval nozzle 22a may be 10° C. or lower. In this case, freezing of water within the Laval nozzle 22a can be promoted. As a result, the proportion of frozen particles in the jet flow 23 increases and the proportion of supercooled water droplets decreases, so that the influence of water on the laminate 13 can be reduced. Further, by increasing the proportion of frozen particles in the jet stream 23, the polishing cleaning power of the jet stream 23 can be increased. The water supplied to the Laval nozzle 22a may be cooled using, for example, ice, dry ice, a cooling device, etc. in a water tank that stores water to be supplied to the Laval nozzle 22a or in a water supply channel between the water tank and the Laval nozzle 22a.

The temperature of the water supplied to the Laval nozzle 22a may be near the freezing point. The temperature near the freezing point may be 0°C or higher and 5°C or lower. In this case, freezing of water within the Laval nozzle 22a can be further promoted. As a result, the proportion of frozen particles in the jet flow 23 further increases, and the proportion of supercooled water droplets further decreases, so that the influence of water on the laminate 13 can be effectively reduced. Further, by further increasing the proportion of frozen particles in the jet stream 23, the polishing cleaning power of the jet stream 23 can be effectively enhanced.

The blasting liquid may contain abrasive grains. In this case, since the abrasive grains combine with the frozen particles 31 within the Laval nozzle 22a, the frozen particles 31 with increased abrasive grain density collide with the surface to be cleaned 9. As a result, it becomes possible to remove foreign matter 19 that is difficult to remove. Furthermore, it is also possible to improve the polishing efficiency by the jet flow 23.

The abrasive grains may have a spherical equivalent diameter that is one-tenth or less of the spherical equivalent diameter of the frozen particles 31. The surface 9 to be cleaned of the laminate 13 before firing is relatively soft and easily deformed, but since the spherical equivalent diameter of the abrasive grains is one-tenth or less of the spherical equivalent diameter of the frozen particles 31, it is difficult to clean by abrasive cleaning. Damage, deformation, etc. of the surface 9 to be cleaned can be suppressed. The equivalent spherical diameter of the abrasive grains may be, for example, about 1 μm or less.

The abrasive grains may be fine powder of BaTiO ₃ , which is the main component of the dielectric layer 4 . In this case, even when the laminate 13 is fired with the abrasive residue attached to the cut surface 9, the influence of the abrasive residue on the electrical characteristics of the product can be reduced. The equivalent spherical diameter of the abrasive grains may be smaller than the equivalent spherical diameter of the frozen particles, for example, about 0.1 μm. Since the throat portion 22aa of the Laval nozzle 22a has a diameter of approximately 0.5 mm to 1.5 mm, if the equivalent spherical diameter of the abrasive grains is approximately 0.1 μm, clogging of the Laval nozzle 22a by the abrasive grains can be suppressed. When the blasting liquid contains abrasive grains, the polishing cleaning power of the jet flow 23 can be increased and the time required for polishing and cleaning the cut surface 9 can be shortened, compared to when the blasting liquid does not contain abrasive grains. Note that the abrasive grains may be fine powders of components contained in the dielectric layer 4, and are not limited to fine powders of BaTiO ₃ . The abrasive grains may be, for example, fine powder of MgO, MnO ₂ or the like, and the same effect as in the case where the abrasive grains are BaTiO ₃ fine powder can be obtained. The water containing abrasive grains may be made into a slurry by dispersing the abrasive grains together with a dispersant in pure water. The solid content ratio of water containing abrasive grains may be, for example, about 20% or less.

The blasting liquid may contain cations of easily ionized components such as lithium (Li) ions and potassium (K) ions contained in the laminate 13. In this case, even if some of the frozen particles 31 that collide with the surface to be cleaned 9 melt, it is possible to prevent Li ions, K ions, etc. from eluting into water, thereby suppressing deterioration of the characteristics and quality of the laminate 13. can. The blasting liquid may contain at least one of Li ions and K ions.

The blasting liquid may contain an etching liquid that dissolves the metal constituting the internal electrode layer 5. In this case, when some of the frozen particles 31 that have collided with the surface to be cleaned 9 melt, the metal scattered on the surface to be cleaned 9 is selectively etched by the etching solution contained in the blasting liquid and removed by the jet stream 23. can do. As a result, short circuits or insulation resistance deterioration between the internal electrode layers 5 of different polarities exposed on the side surfaces 9 of the laminate 13 can be effectively suppressed. The etching solution may be any one as long as it dissolves the metal constituting the internal electrode layer 5. The etching solution may be, for example, a water-based liquid mixed with nitric acid and hydrogen peroxide in an amount of 10 to 20% by mass. In this case, it is possible to suppress the etching solution from reacting with the dielectric composition contained in the laminate 13 and affecting the characteristics and quality of the laminate 13 before and during the firing of the laminate 13 .

Polishing and cleaning of the surface to be cleaned 9 may be performed while heating the laminate 13 to a temperature of 150° C. or higher. In this case, even if some of the frozen particles 31 that collide with the surface to be cleaned 9 melt, the water (melted water) immediately evaporates, so polishing cleaning can be performed with the influence of the melted water reduced. . By setting the temperature of the laminate 13 to 150° C. or higher, even if the laminate 13 is cooled by the heat of vaporization when the molten water evaporates, it is possible to evaporate newly generated molten water. Note that the higher the heating temperature, the higher the evaporation rate of melt water, and the less the influence of melt water on the laminate 13. However, if the temperature of the laminate 13 exceeds 180°C, the molten water contained in the laminate 13 There is a possibility that some of the organic substances may start to change in quality and deteriorate the properties and quality of the laminate 13. By setting the heating temperature of the laminate 13 to 180° C. or lower, deterioration of the organic matter contained in the laminate 13 can be suppressed, and deterioration of the properties and quality of the laminate 13 can be suppressed.

Polishing and cleaning of the surface to be cleaned 9 may be performed while cooling the laminate 13 to below freezing point. In this case, since it is possible to suppress the melting of the frozen particles 31 that have collided with the surface to be cleaned 9, the surface to be cleaned 9 can be efficiently polished and cleaned while the influence of melted water is reduced. Note that the polishing cleaning performed by cooling the laminate 13 to below freezing point may be performed in a dry air environment, and in this case, the influence of dew condensation on the laminate 13 can be reduced. Further, after polishing and cleaning, a frozen film that may exist on the surface of the laminate 13 may be evaporated at high speed by, for example, vacuum drying.

The jet stream 23 may be ejected onto the surface to be cleaned 9 from a direction perpendicular to the surface to be cleaned 9, for example, as shown in FIG. In this case, the polishing cleaning power of the jet stream 23 can be maximized. Furthermore, even when no jig is used to hold the laminate 13 in the form of a support sheet, it is possible to prevent the laminate 13 from falling off and scattering from the support sheet 18, thereby reducing product manufacturing costs. be able to.

The jet stream 23 may be ejected onto the surface to be cleaned 9 from a direction inclined with respect to the normal L to the surface to be cleaned 9, for example, as shown in FIGS. 6 and 7A. The jet stream 23 may be injected onto the surface to be cleaned 9 from a direction forming an angle α of less than 90° with the surface to be cleaned 9, for example, as shown in FIG. 7A. Hereinafter, the angle α will also be referred to as the blast incident angle. For example, as shown in FIG. 7B, the jet flow 23 may be jetted onto the surface to be cleaned 9 from a direction intersecting the direction in which the electrode end portion 51 extends when viewed from a direction perpendicular to the surface to be cleaned 9. . The jet flow 23 may be ejected onto the surface to be cleaned 9 from a direction perpendicular to the direction in which the electrode end portion 51 extends when viewed from a direction perpendicular to the surface to be cleaned 9 .

The dielectric layer 4 and the internal electrode layer 5 are exposed on the surface to be cleaned 9, and the dielectric layer 4 and the internal electrode layer 5 have different strengths against polishing cleaning. Since the dielectric layer 4 is softer than the internal electrode layer 5, it is preferentially removed during polishing and cleaning. If only the dielectric layer 4 is removed excessively and the surface to be cleaned 9 becomes uneven, a gap will be formed between the side surface 9 and the protective layer 6 after the element component 2 is fired, and the electrical properties of the product will deteriorate. may decrease. When the blast incident angle α is less than 90°, polishing and cleaning proceeds while the dielectric layer 4 is hidden in the shadow of the internal electrode layer 5, which prevents excessive removal of the dielectric layer 4. can. As a result, a relatively flat polished and cleaned surface is obtained, for example as shown in FIG. 7C. Note that if the blast incident angle α is less than 20°, the polishing efficiency of the surface to be cleaned 9 tends to decrease. Further, when the blast incident angle α exceeds 60°, only the dielectric layer 4 is easily removed. Therefore, the blast incident angle α may be, for example, in a range of 20° or more and 60° or less. In this case, the surface to be cleaned 9 can be efficiently polished, and the removal of only the dielectric layer 4 can be suppressed.

When polishing and cleaning the surface to be cleaned 9, the laminate 13 is placed on the first surface 18a of the support sheet 18 so that the surface to be cleaned 9 becomes an open surface. At this time, the frame 26 may be arranged on the first surface 18a so as to surround the laminate 13. In this case, when the blast incident angle α is less than 90°, the jet stream 23 can prevent the laminate 13 from detaching from the support sheet 18 and scattering.

For example, as shown in FIG. 6, the frame 26 may have a surface 26a opposite to the surface facing the first surface 18a higher in height from the first surface 18a than the surface to be cleaned 9. . In this case, the main surface 7 of the laminate 13 can be protected from the jet flow 23. Further, the frame 26 may be configured as a support jig having a plurality of through holes 26b, each of which surrounds the stacked body 13, as shown in FIG. 6, for example.

Polishing and cleaning may be performed with the element body precursor 13 housed in the through hole 26b of the support jig 26 attached to the first surface 18a of the support sheet 18. In the element body precursor 13, one of the first side surface 9A and the second side surface 9B is an open surface, and the other of the first side surface 9A and the second side surface 9B is the first surface 18a of the support sheet 18. is pasted on. For polishing cleaning, the nozzle 22 is fixed, the support sheet 18 to which the element body precursor 13 and the support jig 26 are attached is placed on an XY movable table (not shown), and the polishing speed is, for example, 10 mm/sec to 100 mm. This may be done while moving at a speed of about 1/2 seconds.

The support jig 26 has a lower surface facing the first surface 18a of the support sheet 18, and an upper surface 26a opposite to the lower surface. The upper surface 26a of the support jig 26 may be higher in height from the first surface 18a than one of the first side surface 9A and the second side surface 9B, which are the open surfaces. In this case, the main surface 7 of the element body precursor 13 can be prevented from being directly exposed to the jet flow 23, so the main surface 7 of the element body precursor 13 can be protected. Note that if the upper surface 26a of the support jig 26 is too high, it becomes difficult for the blast flow to collide with the cut surface 9, so the height of the upper surface 26a may be set as appropriate depending on, for example, the blast incident angle α. The upper surface 26a may be higher in height from the first surface 18a by, for example, about 20 μm than one of the first side surface 9A and the second side surface 9B.

Next, a method for manufacturing the multilayer ceramic capacitor 1 including a polishing and cleaning process using the above blast polishing method will be described.

First, a ceramic powder mixture made by adding additives to barium titanate, which is the material of the dielectric layer 4, is wet-pulverized and mixed in a bead mill, and then a polyvinyl butyral binder, a plasticizer, and an organic solvent are added and mixed. Prepare ceramic slurry.

Next, using the prepared ceramic slurry, a ceramic green sheet 10 is formed on the carrier film. The ceramic green sheet 10 can be formed using a die coater, a doctor blade coater, a gravure coater, or the like. The thickness of the ceramic green sheet 10 may be, for example, 0.5 to 10 μm, and the higher the target capacitance, the thinner the ceramic green sheet 10 becomes.

Next, as shown in FIG. 8, for example, a conductive paste that will become the internal electrode layer 5 is printed on the ceramic green sheet 10 in a strip pattern in multiple rows. The conductive paste can be printed using, for example, gravure printing, screen printing, or the like. The conductive paste may be made of a metal such as Ni, Pd, Cu, Ag, or an alloy containing these metals.

As long as the characteristics as a capacitor can be ensured, the thinner the internal electrode layer 5 is, the more internal defects due to internal stress can be suppressed and the reliability of the multilayer ceramic capacitor can be improved. When the multilayer ceramic capacitor 1 is a capacitor with a high number of laminated layers, the thickness of the internal electrode layer 5 may be, for example, about 1.5 μm or less.

Next, as shown in FIG. 9, for example, the ceramic green sheets 10 on which the internal electrode layers 5 are printed are placed on top of the ceramic green sheets 10 stacked in a predetermined number, while shifting the ceramic green sheets 10 on which the internal electrode layers 5 are printed by half the widthwise dimension of the internal electrode layers 5. A predetermined number of sheets are laminated, and a predetermined number of ceramic green sheets 10 are further laminated. Note that the ceramic green sheets 10 may be stacked on a support sheet (not shown). As the support sheet, an adhesive release sheet that can be adhesively and peeled off, such as a weak adhesive sheet or a foamed release sheet, can be used.

Next, the laminate obtained by laminating the ceramic green sheets 10 is pressed in the lamination direction using a hydrostatic press or the like to produce an integrated mother laminate 11 as shown in FIG. 10, for example. . In FIG. 10 , a virtual dividing line 15 is shown on the surface of the base laminate 11 . The individual stacked bodies separated by the virtual dividing line 15 correspond to the element body precursor 13 in FIG. 3 . The main surface, end surface, and side surface of the mother laminate 11 correspond to the main surface 7, end surface 8, and side surface 9 of the element body precursor 13, respectively, and therefore are given the same reference numerals below. A support sheet used when laminating the ceramic green sheets 10 may be located on the second surface 7B of the mother laminate 11.

Next, the mother laminate 11 is cut along the virtual dividing line 15 to produce a plurality of element body precursors 13 as shown in FIG. 11, for example. The mother laminate 11 can be cut using, for example, push cutting, dicing saw cutting, or the like. For example, as shown in FIG. 11, internal electrode layers 5 are exposed on the side surface 9 of the element body precursor 13, and internal electrode layers 5 are exposed on the end surface 8 with dielectric layers 4 (cut ceramic green sheets 10) interposed therebetween. The stacked internal electrode layers 5 are exposed in polarity.

Next, the element body precursors 13 are placed in a pocket of an alignment jig and aligned so that the side surfaces 9 are in the vertical direction. FIG. 12 shows a state in which the directionally aligned element body precursors 13 are fixed on the support sheet 18 and the alignment jig is removed. In the element body precursor 13, one of the first side surface 9A and the second side surface 9B is an open surface. The directional alignment of the element body precursor 13 may include rotation of the element body precursor 13. The rotation of the element body precursor 13 may be caused by magnetic force or may be caused by mechanical force. The rotation by mechanical force may be, for example, rolling the element body precursor 13 between elastic bodies.

Next, in order to remove foreign matter 19 adhering to the side surface 9 of the element body precursor 13, the side surface 9 is polished and cleaned. Polishing and cleaning of the side surface 9 can be performed using the above-mentioned blast polishing method. Thereby, the foreign matter 19 attached to the side surface 9 of the element body precursor 13 can be removed efficiently and with high quality.

Next, a ceramic green sheet 10 that will become the protective layer 6 is formed on the polished and cleaned side surface 9. 13A, 13B, and 13C show the process of attaching the ceramic green sheet 10 that will become the protective layer 6 to the first side surface 9A of the element body precursor 13.

First, as shown in FIG. 13A, for example, the second side surface 9B of the element body precursor 13 is fixed to the lower surface of the first pedestal 24A via an adhesive and removable support sheet 18. A second pedestal 24B is arranged below the element body precursor 13 fixed to the first pedestal 24, and a protective layer 6 is formed on the upper surface of the second pedestal 24B via a resin film 27. Ceramic green sheets 10 are arranged.

Next, as shown in FIG. 13B, for example, the first pedestal 24 to which the element body precursor 13 is fixed is moved downward, and the ceramic green sheet 10 is pressed onto the first side surface 9A. In order to increase the pressure bonding force of the ceramic green sheet 10 to the first side surface 9A, the ceramic green sheet 10 may be made of an adhesive ceramic green sheet 10, or the ceramic green sheet 10 may be heated when pressure bonded to the first side surface 9A. You may. Alternatively, an adhesive medium material that does not affect the product may be placed between the ceramic green sheet 10 and the first side surface 9A. The ceramic green sheet 10 serving as the protective layer 6 may be a single-layer ceramic green sheet 10. The ceramic green sheet 10 serving as the protective layer 6 may be a multilayer ceramic green sheet 10. The multiple layers of ceramic green sheets 10 may have mutually different components.

Next, as shown in FIG. 13C, for example, with the ceramic green sheet 10 crimped onto the first side surface 9A of the element body precursor 13, the first pedestal 24A on which the element body precursor 13 is fixed is moved upward. move it. Since the portion of the ceramic green sheet 10 that is not in contact with the first side surface 9A remains on the resin sheet 27, the ceramic green sheet 10 that becomes the protective layer 6 can be attached to the first side surface 9A. The ceramic green sheet 10 may have low breaking strength. Hydrostatic pressing may be applied to the element body precursor 13 on which the ceramic green sheet 10 serving as the protective layer 6 is located on the first side surface 9A to firmly adhere the ceramic green sheet 10 to the first side surface 9A.

Ceramic green sheet 10, which will become protective layer 6, can be attached to second side surface 9B in the same manner as the steps shown in FIGS. 13A, 13B, and 13C. FIG. 14 shows an element body precursor 13 in which a ceramic green sheet 10 serving as a protective layer 6 is attached to a first side surface 9A and a second side surface 9B.

13A, 13B, and 13C show an example in which the ceramic green sheet 10, which becomes the protective layer 6, is pasted on one side each on the first side surface 9A and the second side surface 9B. Ceramic green sheet 10, which becomes protective layer 6, may be attached at the same time.

After degreasing the element body precursor 13 in which the ceramic green sheet 10 serving as the protective layer 6 is attached to the first side surface 9A and the second side surface 9B in a nitrogen atmosphere, the element body precursor 13 is fired in a hydrogen or nitrogen mixed atmosphere, An element body part 2 is produced. By forming the external electrode 3 on the element body part 2, the multilayer ceramic capacitor 1 shown in FIG. 1 can be manufactured. The external electrode 3 can be formed, for example, by applying a conductive paste that will become the external electrode 3 to the element body part 2 and baking it. According to the method for manufacturing a multilayer ceramic electronic component of the present disclosure, the foreign matter 19 attached to the cut surface 9 of the element body precursor 13 can be removed efficiently and with high quality, so the multilayer ceramic electronic component 1 has excellent electrical properties. can be manufactured.

Although the embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above-described embodiments, and various changes, improvements, etc. can be made without departing from the gist of the present disclosure. It is possible. It goes without saying that all or part of the above embodiments can be combined as appropriate to the extent that they do not contradict each other.

1 Multilayer ceramic capacitor 2 Element body parts 3 External electrode 3A First external electrode 3B Second external electrode 4 Dielectric layer 41 End portion 5 Internal electrode layer 51 Electrode end portion 6 Protective layer 7 Main surface 7A First surface 7B Second surface 8 End surface 8A First end surface 8B Second end surface 9 Side surface (cut surface, surface to be cleaned)
9A First side surface 9B Second side surface 10 Ceramic green sheet 11 Mother laminate 13 Laminate (element body precursor)
15 Virtual dividing line 16 Resin binder 18 Support sheet 18a First surface 19 Foreign object 21 Liquid supply hose 22 Blast nozzle 22a Laval nozzle 22aa Throat portion 23 Jet stream 24A First pedestal 24B Second pedestal 26 Frame (support jig)
26a Through hole 26a Surface (top surface)
27 Resin sheet 28 Cutting blade 28a Side surface 29 Compressed air 30 Compressed air hose 31 Frozen particles

Claims (14)

Cutting a mother laminate containing a resin binder in which dielectric ceramic layers and internal electrode layers are alternately laminated to produce a laminate;
Manufacturing a laminated ceramic electronic component in which a cut surface of the laminate is polished and cleaned using a jet stream of a blasting material that is frozen particles of a blasting liquid that is incompatible with the resin binder. Method. The frozen particles are frozen particles having a spherical diameter of 20 μm or less by introducing the blasting liquid into a Laval nozzle,
2. The method for manufacturing a laminated ceramic electronic component according to claim 1, wherein the jet stream of the blasting material is ejected from the Laval nozzle at a speed of 300 m/sec or more. 3. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the blasting liquid is water, and the frozen particles are frozen particles containing supercooled water. 4. The method for manufacturing a multilayer ceramic electronic component according to claim 3, wherein the amount of the frozen particles is 2 to 50 ppm by volume relative to the amount of air in the jet flow. The method for manufacturing a multilayer ceramic electronic component according to claim 3 or 4, wherein the temperature of the water introduced into the Laval nozzle is 5° C. or less. The method for manufacturing a multilayer ceramic electronic component according to any one of claims 1 to 5, wherein the blasting liquid contains abrasive grains having a diameter of 1 μm or less in terms of spheres. 7. The method for manufacturing a laminated ceramic electronic component according to claim 6, wherein the abrasive grains are powder of a ceramic material included in the laminated body. The method for manufacturing a multilayer ceramic electronic component according to any one of claims 1 to 5, wherein the blasting liquid contains at least one of lithium ions and potassium ions. The method for manufacturing a multilayer ceramic electronic component according to any one of claims 1 to 5, wherein the blasting liquid includes an etching liquid that dissolves metal contained in the internal electrode layer. The method for manufacturing a laminated ceramic electronic component according to any one of claims 1 to 9, wherein the cut surface is polished and cleaned while heating the laminated body to a temperature of 150° C. or more and 180° C. or less. The method for manufacturing a multilayer ceramic electronic component according to any one of claims 1 to 10, wherein the cut surface is polished and cleaned while the temperature of the multilayer body is below freezing. The internal electrode layer of the cut laminate has an electrode end portion exposed at the cut surface, and the electrode end portion extends in a predetermined direction,
The jet stream impinges on the cut surface from a direction that forms an angle of 20° or more and 60° or less with respect to the cut surface and intersects the predetermined direction when viewed from a direction perpendicular to the cut surface. The method for manufacturing a multilayer ceramic electronic component according to any one of claims 1 to 11. preparing a support sheet having a first surface and a frame;
arranging the laminate on the first surface of the support sheet so that the cut surface becomes an open surface;
The frame body is arranged on the first surface of the support sheet so as to surround the laminate,
13. The method for manufacturing a multilayer ceramic electronic component according to claim 12, wherein the jet flow impinges on the cut surface. The laminated ceramic according to claim 13, wherein a surface of the frame opposite to a surface facing the first surface of the support sheet is higher in height from the first surface than the cut surface. Method of manufacturing electronic components.