JPH01157467U - - Google Patents
Info
- Publication number
- JPH01157467U JPH01157467U JP4782888U JP4782888U JPH01157467U JP H01157467 U JPH01157467 U JP H01157467U JP 4782888 U JP4782888 U JP 4782888U JP 4782888 U JP4782888 U JP 4782888U JP H01157467 U JPH01157467 U JP H01157467U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- squeegee
- heating
- pad
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4782888U JPH0720941Y2 (ja) | 1988-04-08 | 1988-04-08 | 半田除去装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4782888U JPH0720941Y2 (ja) | 1988-04-08 | 1988-04-08 | 半田除去装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01157467U true JPH01157467U (cs) | 1989-10-30 |
| JPH0720941Y2 JPH0720941Y2 (ja) | 1995-05-15 |
Family
ID=31274010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4782888U Expired - Lifetime JPH0720941Y2 (ja) | 1988-04-08 | 1988-04-08 | 半田除去装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0720941Y2 (cs) |
-
1988
- 1988-04-08 JP JP4782888U patent/JPH0720941Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0720941Y2 (ja) | 1995-05-15 |