JPH03112937U - - Google Patents
Info
- Publication number
- JPH03112937U JPH03112937U JP2173590U JP2173590U JPH03112937U JP H03112937 U JPH03112937 U JP H03112937U JP 2173590 U JP2173590 U JP 2173590U JP 2173590 U JP2173590 U JP 2173590U JP H03112937 U JPH03112937 U JP H03112937U
- Authority
- JP
- Japan
- Prior art keywords
- leads
- heating element
- footprint patterns
- brought
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2173590U JPH03112937U (cs) | 1990-03-02 | 1990-03-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2173590U JPH03112937U (cs) | 1990-03-02 | 1990-03-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03112937U true JPH03112937U (cs) | 1991-11-19 |
Family
ID=31524767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2173590U Pending JPH03112937U (cs) | 1990-03-02 | 1990-03-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03112937U (cs) |
-
1990
- 1990-03-02 JP JP2173590U patent/JPH03112937U/ja active Pending