JPH01157435U - - Google Patents

Info

Publication number
JPH01157435U
JPH01157435U JP1988047461U JP4746188U JPH01157435U JP H01157435 U JPH01157435 U JP H01157435U JP 1988047461 U JP1988047461 U JP 1988047461U JP 4746188 U JP4746188 U JP 4746188U JP H01157435 U JPH01157435 U JP H01157435U
Authority
JP
Japan
Prior art keywords
resin layer
lead frame
infrared rays
fixes
seals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988047461U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988047461U priority Critical patent/JPH01157435U/ja
Publication of JPH01157435U publication Critical patent/JPH01157435U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1988047461U 1988-04-07 1988-04-07 Pending JPH01157435U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988047461U JPH01157435U (enExample) 1988-04-07 1988-04-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988047461U JPH01157435U (enExample) 1988-04-07 1988-04-07

Publications (1)

Publication Number Publication Date
JPH01157435U true JPH01157435U (enExample) 1989-10-30

Family

ID=31273669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988047461U Pending JPH01157435U (enExample) 1988-04-07 1988-04-07

Country Status (1)

Country Link
JP (1) JPH01157435U (enExample)

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