JPH02106845U - - Google Patents
Info
- Publication number
- JPH02106845U JPH02106845U JP1989014699U JP1469989U JPH02106845U JP H02106845 U JPH02106845 U JP H02106845U JP 1989014699 U JP1989014699 U JP 1989014699U JP 1469989 U JP1469989 U JP 1469989U JP H02106845 U JPH02106845 U JP H02106845U
- Authority
- JP
- Japan
- Prior art keywords
- view
- showing
- sectional
- lead
- plan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989014699U JPH02106845U (enExample) | 1989-02-10 | 1989-02-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989014699U JPH02106845U (enExample) | 1989-02-10 | 1989-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106845U true JPH02106845U (enExample) | 1990-08-24 |
Family
ID=31226135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989014699U Pending JPH02106845U (enExample) | 1989-02-10 | 1989-02-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106845U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12564114B2 (en) | 2021-04-22 | 2026-02-24 | Fuji Electric Co., Ltd. | Semiconductor apparatus and method of manufacturing semiconductor apparatus |
-
1989
- 1989-02-10 JP JP1989014699U patent/JPH02106845U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12564114B2 (en) | 2021-04-22 | 2026-02-24 | Fuji Electric Co., Ltd. | Semiconductor apparatus and method of manufacturing semiconductor apparatus |