JPH01156576U - - Google Patents
Info
- Publication number
- JPH01156576U JPH01156576U JP5301988U JP5301988U JPH01156576U JP H01156576 U JPH01156576 U JP H01156576U JP 5301988 U JP5301988 U JP 5301988U JP 5301988 U JP5301988 U JP 5301988U JP H01156576 U JPH01156576 U JP H01156576U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- metal
- wiring board
- printed wiring
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 2
- 239000012783 reinforcing fiber Substances 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
第１図、第２図はこの考案の一実施例による金
属ベースプリント配線板を示し、第１図は断面図
、第２図は底面図である。また第３図は従来の金
属ベースプリント配線板を示す断面図である。
図において１，４は金属板、２は絶縁層、３は
導体層、５は孔部であり、各図中同一符号は同一
又は相当物を示す。
1 and 2 show a metal base printed wiring board according to an embodiment of this invention, with FIG. 1 being a sectional view and FIG. 2 being a bottom view. Further, FIG. 3 is a sectional view showing a conventional metal-based printed wiring board. In the figures, 1 and 4 are metal plates, 2 is an insulating layer, 3 is a conductor layer, and 5 is a hole, and the same reference numerals in each figure indicate the same or equivalent parts.
Claims (1)
樹脂を含浸した強化繊維からなる絶縁層を介して
接着する導体層とを備えたことを特徴とする金属
ベースプリント配線板。 A metal-based printed wiring board comprising a metal plate provided with a hole and a conductor layer bonded to the metal plate via an insulating layer made of reinforcing fiber impregnated with a synthetic resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5301988U JPH01156576U (en) | 1988-04-20 | 1988-04-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5301988U JPH01156576U (en) | 1988-04-20 | 1988-04-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01156576U true JPH01156576U (en) | 1989-10-27 |
Family
ID=31279017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5301988U Pending JPH01156576U (en) | 1988-04-20 | 1988-04-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01156576U (en) |
-
1988
- 1988-04-20 JP JP5301988U patent/JPH01156576U/ja active Pending
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