JPH01154647U - - Google Patents
Info
- Publication number
- JPH01154647U JPH01154647U JP5267388U JP5267388U JPH01154647U JP H01154647 U JPH01154647 U JP H01154647U JP 5267388 U JP5267388 U JP 5267388U JP 5267388 U JP5267388 U JP 5267388U JP H01154647 U JPH01154647 U JP H01154647U
- Authority
- JP
- Japan
- Prior art keywords
- fins
- substantially cylindrical
- cylindrical heat
- fin group
- heat dissipating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の第１実施例の放熱器の斜視
図で、半導体素子等発熱体の取付け前の状態を示
している。第２図は舌状フインのフイン群を有す
る帯板状放熱器素材の側面図、第３図は第１図
―線に沿う拡大断面図、第４図はこの考案の変
形例を示す放熱器の斜視図、第５図はこの考案の
第２実施例の放熱器の斜視図、第６図この考案の
第３実施例の放熱器の斜視図、第７図はこの考案
の第４実施例の放熱器の斜視図である。
１……放熱基体、２……舌状フイン、３……フ
イン群、４……帯板状放熱器素材、５……平坦部
、６……半導体素子等発熱体。
FIG. 1 is a perspective view of a heat radiator according to a first embodiment of this invention, showing the state before a heating element such as a semiconductor element is attached. Fig. 2 is a side view of a strip-shaped radiator material having a group of tongue-shaped fins, Fig. 3 is an enlarged sectional view taken along the line of Fig. 1, and Fig. 4 is a radiator showing a modification of this invention. 5 is a perspective view of a radiator according to the second embodiment of this invention, FIG. 6 is a perspective view of a radiator according to the third embodiment of this invention, and FIG. 7 is a perspective view of a radiator according to the third embodiment of this invention. FIG. 2 is a perspective view of a heat sink. DESCRIPTION OF SYMBOLS 1... Heat dissipation base, 2... Tongue-shaped fins, 3... Fin group, 4... Band-shaped heat sink material, 5... Flat portion, 6... Heat generating body such as a semiconductor element.
Claims (1)
ン２よりなる少なくとも１つのフイン群３が設け
られ、略筒形の放熱基体１は、削り起こされて形
成せられた上記フイン群３を有する帯板状放熱器
素材４のフイン２のない部分が折り曲げられかつ
素材両端部４ａ，４ａが相互に連結されることに
よりつくられたものであり、略筒形の放熱基体１
のフイン２のない平坦面５に半導体素子等の発熱
体６が取り付けられるようになされている放熱器
。 At least one fin group 3 consisting of a large number of tongue-like fins 2 is provided on the inner surface of the substantially cylindrical heat dissipating base 1, and the substantially cylindrical heat dissipating base 1 is formed by cutting and raising the fin group 3. It is made by bending the part without the fins 2 of a strip-shaped heat radiator material 4 having a shape and connecting both ends 4a, 4a of the material to each other, and forming a substantially cylindrical heat radiating base 1.
A heat radiator in which a heating element 6 such as a semiconductor element is attached to a flat surface 5 without fins 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5267388U JPH01154647U (en) | 1988-04-18 | 1988-04-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5267388U JPH01154647U (en) | 1988-04-18 | 1988-04-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01154647U true JPH01154647U (en) | 1989-10-24 |
Family
ID=31278680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5267388U Pending JPH01154647U (en) | 1988-04-18 | 1988-04-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01154647U (en) |
-
1988
- 1988-04-18 JP JP5267388U patent/JPH01154647U/ja active Pending
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