JPH03128987U - - Google Patents
Info
- Publication number
- JPH03128987U JPH03128987U JP3837490U JP3837490U JPH03128987U JP H03128987 U JPH03128987 U JP H03128987U JP 3837490 U JP3837490 U JP 3837490U JP 3837490 U JP3837490 U JP 3837490U JP H03128987 U JPH03128987 U JP H03128987U
- Authority
- JP
- Japan
- Prior art keywords
- foamed
- substrate
- radiator
- surface area
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 239000006260 foam Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の一実施例を示す斜視図、第
２図はこの考案の他の実施例を説明するための斜
視図、第３図は従来の技術を説明するための側面
図、第４図は従来の放熱器に用いられている放熱
フインの構造を説明するための斜視図である。
１……基板、２……放熱フイン、５……発泡ア
ルミニウム板、６……発泡アルミニウムブロツク
。
Fig. 1 is a perspective view showing one embodiment of this invention, Fig. 2 is a perspective view for explaining another embodiment of this invention, Fig. 3 is a side view for explaining the conventional technique, FIG. 4 is a perspective view for explaining the structure of a heat radiation fin used in a conventional heat sink. 1...Substrate, 2...Radiating fin, 5...Aluminum foam plate, 6...Aluminum foam block.
Claims (1)
つて表面積が大きい発泡アルミニウムによつて形
成した放熱フインを設けて成る放熱器。 A radiator comprising heat radiating fins made of foamed aluminum with a foamed structure and a large surface area on one side of a substrate with high thermal conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3837490U JPH0534152Y2 (en) | 1990-04-10 | 1990-04-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3837490U JPH0534152Y2 (en) | 1990-04-10 | 1990-04-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03128987U true JPH03128987U (en) | 1991-12-25 |
| JPH0534152Y2 JPH0534152Y2 (en) | 1993-08-30 |
Family
ID=31546321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3837490U Expired - Lifetime JPH0534152Y2 (en) | 1990-04-10 | 1990-04-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0534152Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013239631A (en) * | 2012-05-16 | 2013-11-28 | Fujitsu Ltd | Circuit board, manufacturing method of circuit board, electronic device, and manufacturing method of electronic device |
| JP2016081978A (en) * | 2014-10-11 | 2016-05-16 | 国立大学法人京都大学 | Heat dissipation structure |
-
1990
- 1990-04-10 JP JP3837490U patent/JPH0534152Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013239631A (en) * | 2012-05-16 | 2013-11-28 | Fujitsu Ltd | Circuit board, manufacturing method of circuit board, electronic device, and manufacturing method of electronic device |
| JP2016081978A (en) * | 2014-10-11 | 2016-05-16 | 国立大学法人京都大学 | Heat dissipation structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0534152Y2 (en) | 1993-08-30 |