JPH01147281A - Substrate heater - Google Patents

Abstract

PURPOSE: To prevent a heater from suffering from failure heating by heating a substrate while measuring actual temperature of a substrate conveyed in a substrate heating apparatus and controlling a heat amount of the heater. CONSTITUTION: When a conveyed substrate is detected with an arrival sensor 5 in a zone A indicated by a substrate heating apparatus 3, substrate conveyance with a conveyor 2 is interrupted for predetermined time, and a non-contact temperature sensor 6 within the region A indicated by the conveyor 2 is acted, and substrate temperature at that time is measured. When heating is insufficient for purposed temperature as a measured result of the substrate temperature, an increase of a heat amount of the heater 4 in the zone A is increased. At the time the purposed substrate temperature is attained, the increase of the heat amount of the heater 4 is interrupted, and thereafter the heater 4 heats the substrate keeping the heat amount unchanged. Further, when an overheated state is reached, heater output is interrupted or decreased. The same operation is performed for later zones, i.e., from a zone B to a zone E.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to a substrate heating device for heating a substrate on which electronic components and the like are mounted.

Conventional technology In general, temperature control in a substrate heating device involves attaching a thermocouple or thermolabel to the same substrate as the production substrate, determining the temperature profile, and assuming that the temperature profile is the substrate temperature in the substrate heating device. The desired temperature profile was obtained by repeatedly setting the output amount. In order to maintain this temperature profile, the ambient temperature inside the substrate heating device is constantly monitored using a thermocouple or the like, and if a change is detected, a temperature control circuit is activated to control the heater output.

Problems to be Solved by the Invention However, in this method, since the temperature of the substrate itself is not measured, it is difficult to prevent defects caused by insufficient heating or overheating.

Also, the amount of heating to the substrate changes over time, resulting in insufficient heating3/\
-7 Or even if it becomes excessive, with the current method there is no way to compensate for the lack of heating amount other than adjusting the temperature profile several times and resetting the heater output amount.

Means for solving the problems and technical means of the present invention for solving the above problems are to provide a substrate arrival sensor at least at one location in the substrate heating device, so that the substrate arrives at a predetermined position. After confirming that this is the case, the temperature of the board is detected by a temperature sensor installed in at least one place in the board heating device, and the heater output or the speed of the conveyor for transporting the board is controlled to control the amount of heat that the board receives and detect defects. It is something to prevent.

For production The effect of this technical means is as follows.

The arrival sensor detects that the board has arrived at the temperature sensor measurement position, and the non-contact temperature sensor is used to measure the board temperature. Based on this measurement result, the heater heat amount and conveyor speed are controlled. As a result, heating defects of the heater can be prevented.

EXAMPLE Hereinafter, an example of the present invention will be described based on the accompanying drawings.

FIG. 1 is a side view of this embodiment. Reference numeral 1 denotes a conveying substrate, which is conveyed by a conveyor 2 from the right hand to the left toward FIG. 1 over a certain period of time.

When a plurality of substrates are transported, they are transported intermittently so that only one substrate exists in each zone indicated by A to E. The interior of the substrate heating device 3 is heated by a heater 4 . At this time, the temperature of the heater 4 is controlled by measuring the ambient temperature within the substrate heating apparatus using a thermocouple (not shown) provided within the substrate heating apparatus. When the conveyed substrate is detected by the arrival sensor 5 in zone A indicated by the substrate heating device 3, the substrate conveyance by the conveyor 2 is stopped for a certain period of time, and the non-contact temperature sensor 6 in zone A indicated by the conveyor 2 is activated. Measure the substrate temperature at that time. As a result of measuring the substrate temperature, if it is found that the heating is insufficient for the target temperature, the amount of heat of the heater 4 of the heater 4 of the sea 6 to the sea 6 is increased. When the target substrate temperature is reached, the heater 4 stops increasing the amount of heat, and thereafter the heater 4 continues to heat the substrate while maintaining this amount of heat. Also, if overheating occurs, the heater output is stopped or reduced. Exactly the same operation as described above is performed in the subsequent zones, ie, zone B to zone E.

Next, other embodiments of the present invention will be described. Transport board 1
is continuously conveyed from the right hand to the left in FIG. Immediately after the transfer substrate is detected by the arrival sensor 6 in zone A, the non-contact temperature sensor 6 starts measuring the temperature of the substrate. If the substrate temperature is insufficient for the target temperature, increase the heater output, and when the target substrate temperature is obtained for the subsequent substrate, the heater output for that zone A is kept constant, or The speed of the conveyor for conveyance is reduced to increase the amount of heat received by the subsequent conveyed substrate, thereby raising the temperature of the substrate. Here, for the substrate that first became insufficiently heated, the following steps 67 and - are performed.

To deal with this problem, temporarily increase the heater output of the zone (Zone B to Zone E). Also, if overheating occurs, whether to stop or reduce the heater output in zone A,
Alternatively, by increasing the conveyor speed and reducing the amount of heat received by the transported substrate, the substrate temperature is lowered to a target temperature. Exactly the same operation as described above is performed in the subsequent zones, ie, zone B to zone E.

It's a trench.No.1 above. In the second embodiment, the substrate is transferred from the right hand to the left in the figure, but it may be carried from the left hand to the right. Further, in FIG. 1, the number of zones is five, but any number may be used. In addition, the number of non-contact temperature sensors and the number of arrival sensors do not have to be the same, and the installation positions of the non-contact temperature sensors and substrate arrival sensors can be at the top, bottom, or side of the substrate conveyor. . In the first and second embodiments, the thing to be transported is limited to the substrate, but it is also possible to transport something other than the substrate.

In addition to the effects of the invention, the present invention measures the actual temperature of the substrate being transferred within the substrate heating device and heats the substrate while controlling the amount of heat from the heater. The number of defects has decreased significantly.

[Brief explanation of the drawing]

FIG. 1 is a side view showing the main parts of a substrate heating device according to an embodiment of the present invention, and FIG. 2 shows the heater, non-contact temperature sensor, transport substrate, conveyor guide, and arrival sensor of the substrate heating device shown in FIG. FIG. 3 is a cross-sectional view of main parts showing an example of a positional relationship. 1... Transfer board, 2... Conveyor, 3
...Substrate heating device, 4 ...Heater, 6
... Arrival sensor, 6... Non-contact temperature sensor. Name of agent: Patent attorney Toshio Nakao and one other person
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Claims (4)

[Claims] (1) A transport unit capable of transporting a board, a board arrival sensor that detects when the board transported by this transport unit has reached a predetermined position, and a board arrival sensor that detects when the board reaches the predetermined position in synchronization with this board arrival sensor. A substrate heating device comprising a temperature sensor that measures the temperature of a substrate, and a heater that heats the substrate in synchronization with the temperature sensor. (2) The substrate heating device according to claim 1, wherein the temperature sensor is configured to be activated by a detection signal from a substrate arrival sensor. (3) Claim 1, wherein the speed and stop time of the transport section are controlled by the substrate temperature sensor signal.
Substrate heating device as described in . (4) The substrate heating device according to claim 1, wherein the heater output amount is controlled by a substrate temperature sensor signal.