JPH01146532U - - Google Patents
Info
- Publication number
- JPH01146532U JPH01146532U JP1988042626U JP4262688U JPH01146532U JP H01146532 U JPH01146532 U JP H01146532U JP 1988042626 U JP1988042626 U JP 1988042626U JP 4262688 U JP4262688 U JP 4262688U JP H01146532 U JPH01146532 U JP H01146532U
- Authority
- JP
- Japan
- Prior art keywords
- metal wire
- lead frame
- manufacturing device
- diameter shape
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/90—
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- H10W72/0711—
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- H10W72/07141—
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- H10W72/07551—
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- H10W72/50—
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- H10W72/536—
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- H10W72/59—
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- H10W72/932—
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- H10W72/934—
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- H10W72/983—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988042626U JPH01146532U (enExample) | 1988-03-30 | 1988-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988042626U JPH01146532U (enExample) | 1988-03-30 | 1988-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01146532U true JPH01146532U (enExample) | 1989-10-09 |
Family
ID=31269035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988042626U Pending JPH01146532U (enExample) | 1988-03-30 | 1988-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01146532U (enExample) |
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1988
- 1988-03-30 JP JP1988042626U patent/JPH01146532U/ja active Pending