JPH0365244U - - Google Patents
Info
- Publication number
- JPH0365244U JPH0365244U JP1989126746U JP12674689U JPH0365244U JP H0365244 U JPH0365244 U JP H0365244U JP 1989126746 U JP1989126746 U JP 1989126746U JP 12674689 U JP12674689 U JP 12674689U JP H0365244 U JPH0365244 U JP H0365244U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- semiconductor
- insulating film
- metal wire
- thin metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989126746U JPH0365244U (enExample) | 1989-10-30 | 1989-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989126746U JPH0365244U (enExample) | 1989-10-30 | 1989-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0365244U true JPH0365244U (enExample) | 1991-06-25 |
Family
ID=31674541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989126746U Pending JPH0365244U (enExample) | 1989-10-30 | 1989-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0365244U (enExample) |
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1989
- 1989-10-30 JP JP1989126746U patent/JPH0365244U/ja active Pending