JPH01145890A - Manufacture of printed wiring substrate - Google Patents

Abstract

PURPOSE:To remove an imaging process of manual work by negative alignment, to eliminate a step or printing in vacuum a photosensitive film, to form manufacturing steps of a printed wiring substrate in a line and to manufacture in a mass production by conducting a step of imaging a platelike body by a printing step. CONSTITUTION:In the manufacture of a printed wiring substrate, conductor passages are first suitably disposed, an original drawing is manufactured, and the drawing is drafted. Then, a drilling work is conducted on a platelike body 1, and a hole 4 is opened. Then, a copper-plated layer 6 is formed. Then, a photosensitive film 8 or the film 8 and a carrier film 9 are formed on the surface of the copper, an image is processed on the body 2 by a printing step, such as an offset printing, thereby forming a printing layer 10. Then, after the image is processed by offset printing on the body 2, the film 8, the film 9 and the layer 10 on the body 1 are exposed at surface positions. Thereafter, a developing step is conducted, a polishing step is then performed, a predetermined correcting step, a solder-plating step, an exfoliating step, an end plating step, a rear face printing step, an outer diameter cutting step, an outer diameter finishing step, a finish polishing step, and a final inspecting step are conducted, thereby manufacturing a printed circuit.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing printed wiring boards, and in particular, image processing is performed by a printing process, eliminating manual image processing by negative alignment, and The present invention relates to a method for manufacturing printed wiring boards that eliminates the vacuum contact baking process, enables mass production, and reduces costs.

[Conventional technology]

Printed circuit boards are printed with printed circuits using techniques such as graphic art, and printed circuit boards are used for radios, television stations, telephone system units, wiring on the back of automobile dash boards, electronic equipment in aircraft, and computers. It is used in electronic equipment such as improved control equipment. The printed wiring board contributes to space saving and miniaturization.

[Problem that the invention seeks to solve]

By the way, in the conventional method of manufacturing a printed wiring board, when performing an image processing step, negative alignment of photographs is performed.

For this reason, during the production process of printed wiring boards, large variations occur in the positional relationships of conductor patterns, holes, outer diameters, etc., resulting in poor workability and economical disadvantages.

In addition, in the exposure process that is the post-process of the above-mentioned photographic negative alignment process, a vacuum contact printing device is required to suction and bring the negative film into close contact with the plate-shaped object. There are disadvantages in that changes occur, mass production is disadvantageous, and production speed is slow.

[Purpose of the invention]

SUMMARY OF THE INVENTION In order to eliminate the above-mentioned disadvantages, an object of the present invention is to perform the image processing process of a plate-shaped body through a printing process in a manufacturing method for manufacturing a printed circuit on a printed wiring board, thereby eliminating the manual work of negative alignment. A printed wiring board that can eliminate image processing and the vacuum contact baking process of photosensitive film, making it possible to integrate the printed wiring board manufacturing process into a line, making mass production possible and reducing costs. The goal is to realize the manufacturing method.

[Means for solving problems]

In order to achieve this object, the present invention prepares an original drawing by appropriately arranging conductor paths, performs a photoresist treatment on the plate-like body directly or after conducting hole-making process according to this original drawing, and then applies a photoresist film treatment to the plate-like body. It is characterized in that the image processing step to be applied is performed by a printing step, and the plate-shaped body after the image processing is subjected to a predetermined post-process to manufacture a printed circuit on a printed wiring board.

[Effect]

According to the above-mentioned invention, when performing image processing on a plate-shaped body during the process of manufacturing a printed circuit on a printed wiring board, the image processing on this plate-shaped body is performed in the printing process, and manual processing by negative alignment is performed. In addition to eliminating image processing, it also eliminates the vacuum contact printing process for negative film, making it possible to integrate the printed wiring board manufacturing process into a line, making mass production possible and reducing costs.

〔Example〕

Embodiments of the present invention will be described in detail below based on the drawings.

Figure 1.2 shows an embodiment of the invention. 1st
In the figure, 2 is a plate-shaped body made of a copper-clad laminate. This plate-shaped body 2 is subjected to various processes described later to manufacture a printed wiring board (not shown).

The manufacturing process of the printed wiring board will be explained with reference to FIGS. 1 and 2.

■Drawing process (see 100 in Fig. 2): An original drawing is produced by appropriately arranging conductor paths, and this original drawing is drawn using a drawing plotter or an automatic drawing machine.

■ Drilling process (see 102 in Figure 2)...
...According to the original drawing, for example, use a numerically controlled drilling machine (
As shown in Fig. 1(b),
A drilling operation is performed on the plate-shaped body 2 to form a hole 4. Then, as desired, a sensitizer treatment or electroless copper plating is performed to form a copper plating layer 6 (see (c) in FIG. 1).

■ Image processing process (see 104 in Figure 2)...
...Next, a photosensitive film 8 or a photosensitive film 8 and a carrier film 9 are formed on the copper surface, and instead of the manual work of aligning the negatives of photographs, that is, the work of attaching the negative film to the plate-shaped object. Image processing is performed on the plate-shaped body 2 by a printing process, for example offset printing, to form a printed layer IO (see (d) in FIG. 1). In addition, in the printing process, silk screen printing can also be performed instead of offset printing. Here, to explain silk screen printing in detail, silk screen printing is called midrography or fabrication culture.

This silk screen printing involves forming mesh-like screens of various shapes using materials such as nylon, polyester, stainless steel, or phosphor bronze.The desired image is transferred onto this screen, and ink is applied to the image area. It is transferred onto the plate-like body through the mesh.

■ Exposure process (see 106 in Fig. 2) After image processing is performed on the plate-shaped body 2 by offset printing, the photosensitive film 8 on the plate-shaped body 2, the carrier film 9, Then, the surface portion of the printing layer 10 is exposed. In other words, the plate-shaped photosensitive film 8 and the carrier film 9
Then, the surface portion of the printing layer 10 is irradiated with ultraviolet rays having a wavelength of about 387 m for a certain period of time, for example, about 10 seconds.

■ Predetermined post-process (see 108 in Figure 2)...
...For example, after the exposure step (106), which is the previous step, a developing step (110) is performed, a polishing step (112) is performed, and then a predetermined correction step (114) or solder plating step (116) is performed.
), peeling process (118), terminal plating process (120)
), back side printing process (122), outer diameter cutting process (12)
4), outer diameter finishing process (126), final polishing process (128)
) or a final inspection step (130) to manufacture printed circuits.

As a result, image processing can be performed by offset printing instead of negative alignment in the image processing step (104), eliminating negative alignment, improving workability and quality of manufactured printed wiring boards. This increases reliability, conversely reduces the occurrence of defective products, and reduces costs, which is economically advantageous.

In addition, by eliminating image processing for negative alignment work, it is possible to eliminate the vacuum contact printing process using a vacuum contact printing device that attaches the negative film to the plate-shaped object by suction, and to streamline the printed wiring board manufacturing process. This makes it possible to perform mass production, increase production speed, and improve work efficiency, which is advantageous in practice.

Furthermore, by performing image processing by offset printing, positional deviations during post-process image processing and printing work can be reduced, and printing work can be performed satisfactorily.

Note that this invention is not limited to the above-mentioned embodiments (
, various applications and modifications are possible.

For example, in the above-described embodiments, the process of manufacturing a double-sided printed wiring board has been described, but when manufacturing a single-layer or multilayer printed wiring board, the present invention can be used instead of manual photo negative alignment work. It is also possible to perform image processing by printing.

〔Effect of the invention〕

As explained in detail above, according to the present invention, in the manufacturing method for manufacturing a printed circuit on a printed wiring board, the image processing step of the plate-shaped body is performed by offset printing, thereby eliminating the image processing of the negative alignment operation. It is possible,
The dimensional reliability of manufactured printed wiring boards is increased,
The occurrence of defective products can be reduced. In addition, by eliminating the image processing required for negative alignment, it is possible to eliminate the vacuum printing process using a vacuum printing device that suction-sticks the negative film to the plate-shaped object, and it is possible to streamline the manufacturing process of printed wiring boards. Therefore, mass production is possible, costs can be reduced, and work efficiency can be improved.

[Brief explanation of the drawing]

Figure 1.2 shows an embodiment of the invention, and (a) in Figure 1.
is a schematic cross-sectional view of a plate-like body made of copper-clad laminate;
(b) is a schematic cross-sectional view of a state in which a hole is drilled in a plate-shaped body by a drilling process, (C) of FIG. 1 is a schematic cross-sectional view of a state in which a copper plating layer is formed by electroless method, and ( d) is a schematic cross-sectional view of a state in which a printed layer is formed on a plate-shaped body by offset printing in an image processing step, and FIG. 2 is a flowchart of a manufacturing process of a printed wiring board. In the figure, 2 is a plate-like body made of a copper-clad laminate, 4 is a hole, 6 is a copper plating layer, 8 is a photosensitive film, 9 is a carrier film, and 10 is a printing layer. Patent applicant Akebono Sangyo Co., Ltd. Agent
Patent Attorney Yoshimi Nishi Figure 2

Claims (1)

[Claims] An original drawing is produced by arranging the conductor paths appropriately, and according to this original drawing, a photoresist film is applied either directly on the plate-like object or after the conduction process is made by drilling holes.Then, the image processing process applied to the plate-like object is performed by a printing process, and the image is printed. 1. A method for manufacturing a printed wiring board, which comprises manufacturing a printed circuit on the printed wiring board by subjecting the processed plate-like body to a predetermined post-process.