JPH01145648A - Photosensitive resin - Google Patents

Abstract

PURPOSE:To obtain superior light transmitting characteristics in the visible region and to prevent the deterioration of the characteristics even in case of use at high temp. and humidity by synthesizing a photosensitive resin having a specified structure. CONSTITUTION:A photosensitive resin represented by formula I is synthesized. In formula I, R<1> is H or methyl, R<2> is phenyl, etc., R<3> is H or methyl, R<4> is hydrocarbon having hydroxyl, R<5> is H or methyl and R<6> is a photosensitive atomic group capable of forming a cross-linked structure on being irradiated with light. The photosensitive resin has superior moisture resistance as well as superior light transmitting characteristics and the characteristics are not deteriorated even in case of use at high temp. and humidity.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The object of the present invention is to provide a photosensitive resin that has good light transmittance in the visible light region and excellent moisture resistance.

[Conventional technology and its problems]

Conventional photosensitive resins have been used as photoresists for manufacturing semiconductor devices such as transistors, ICs, hybrid ICs, and LSIs, etching resists for manufacturing printed circuit boards such as printed wiring boards, and flexible printed wiring boards.
It is widely applied in fields such as printing, plate making, metals, and surface treatment materials for polymeric materials, and is extremely valuable.

There are two types of photosensitive resins: negative photosensitive resins that polymerize or crosslink photosensitive groups when exposed to light and become insoluble in solvents, and positive photosensitive resins that undergo changes to become solvent soluble. They are used appropriately depending on the required properties such as spectral sensitivity, resolution, acid resistance, alkali resistance, etc., and the purpose of use.

-For example, positive-type photosensitive resins include phenol-
Typical examples include resins in which a photosensitive group such as an orthoquinazide group or an orthonaphthoquinazide group is introduced into a novolac resin such as a formaldehyde condensation resin, a cresol-formaldehyde condensation resin, or a p-tert-butylphenol-formaldehyde condensation resin. .

(For example, Special Publication No. 56-46579 U, S, Pat
, 3046120 (1962) Ger, Pat
.

865860 (1953), etc.). This photosensitive resin is indispensable as a photoresist for forming semiconductor devices due to its particularly good resolution and acid resistance.When irradiated with ultraviolet light, the orthoquinoazide group and the orthonaphthoquinoazide group decompose and isomerize, forming an alkaline aqueous solution. Patterns are formed by utilizing the fact that the exposed area becomes soluble and the unexposed area becomes insolubilized by azo coupling with the novolac resin during development.

On the other hand, as a negative photosensitive resin, a diazide compound-polyisoprene cyclized product (for example, U-S, Pat.

2, 852.379 (1958) etc.), cinnamate resins such as polyvinyl cinnamate (e.g. U, S, P
at, 2725372 (1955), etc.) Cinnamylidene resins having benzalua heptophenone moieties in their side chains, (
For example, C, C, Unruh ;j, Appl, Poly
M, Sci., 2358 (1959) etc.], polyallyl methacrylates (e.g. M. Donati, e.g.
t at.

Makromol, Chem, 60.233 (19
63), etc.), acrylic, methacrylic resins, unsaturated polyester resins (G
er, Pat, 1075831 (1961), etc.). These photosensitive resins are widely used in fields such as photoresist, lithographic printing, and intaglio printing when manufacturing printed circuit boards, and active species such as radicals, carbene, and nitrene generated by irradiation with ultraviolet light and other light are Reactions that add to unsaturated bonds and crosslink, reactions that polymerize or oligomerize and crosslink,
It is an excellent photosensitive resin that utilizes chemical reactions such as (2+2) type cycloaddition reaction and crosslinking.

The above-mentioned photosensitive resin may be used by adding a sensitizer or a dye as necessary for sensitization, and an inorganic filler to improve mechanical strength.

As described above, many types of photosensitive resins have been developed and put into practical use. At present, little attention has been paid to the deterioration of light transmittance in the visible range due to use in

For example, the unexposed body of orthonaphthoquinoazide ester of a positive phenol-formaldehyde condensation resin is already colored, but when developing with an alkaline aqueous solution, an azo coupling reaction occurs further, so the azo dye is mixed into the resin. As a result, a resin with good light transmittance in the visible range cannot be obtained.

On the other hand, in negative tones, allyl resins such as allyl polymethacrylate and acrylic methacrylic resins such as double-terminated methacroyl polydimethylsiloxane have relatively good light transmittance in the visible range for both unexposed and exposed materials. However, when these resins are used under high temperature and high humidity conditions, a phenomenon is observed in which their light transmittance gradually deteriorates.

For example, an unexposed body of polyallyl methacrylate is
Form into a thick sheet and heat this sheet at 70°C x 90°C.
When exposed to a high temperature constant temperature of %4 for 24 hours, even if the initial characteristics are excellent with an average transmittance in the visible range of 89%, it deteriorates to 3.2% after exposure to a high temperature constant temperature condition. be. This phenomenon of deterioration of light transmittance in the visible range is almost the same when crosslinking is caused by exposure.

Furthermore, azide-based compounds also exhibit significant absorption in the visible region when exposed to light (light irradiation), and cannot be said to be photosensitive resins with excellent light transmittance.

In particular, when a photosensitive material with poor moisture resistance is used for purposes such as transparent protective coating or marking on metal surfaces and is exposed to high temperature and humidity conditions, the resin in the coating layer and marking layer may lose transparency. This is not preferable as it may cause significant discoloration.

As mentioned above, there are few conventional photosensitive resins that have good light transmittance in the visible range, and even those that have good light transmittance in the visible range often deteriorate when used in hot and humid conditions. There were almost no photosensitive resins that satisfied both of these requirements.

[Means and effects for solving the problems] As a result of intensive studies on the problems of the light transmission characteristics in the visible range and the moisture resistance characteristics of the above-mentioned photosensitive resin, the inventors found that the general formula is CK, n; (J"'-' n-t-m+1=1 RI R3R5-(CH2CH)n-(CLI-CH)m-(CHa
CH)! −+ 1 1 R2C=ORe? (R1 in the formula is a hydrogen atom, a methyl group, P is -C-0-R
group (R is a hydrocarbon group), phenyl group, R3 is a hydrogen atom,
methyl group, R4 is a hydrocarbon group having at least one hydroxyl group, R6 is a hydrogen atom, methyl group, R6 is a photosensitive atomic group capable of forming a crosslinked structure by light irradiation, preferably an allyl group, an acrylic group, or a methacryl group , a hydrocarbon group containing a cinnamyl group, or a vinyl group) is a photosensitive resin that has excellent light transmission properties in the visible range and does not deteriorate in light transmission properties even when used under high temperature and high humidity conditions. Based on these findings, the present invention was completed.

If R6 is a photosensitive group, after coating it on a base material like a general photosensitive resin, attaching a negative mask film or glass negative mask and irradiating it with light such as ultraviolet light,
An unexposed film that can form images and is soluble in ketone solvents such as acetone and methyl ethyl ketone, alcohol solvents such as ethanol and isopropanol, ester solvents such as ethyl acetate, or organic solvents that are a mixture of these. By removing the portion, a pattern can be formed.

The resolution varies depending on the thickness of the photosensitive resin to be coated, but if the resin thickness is in the range of 1 to 100 microns, a resolution of several to several tens of microns can be easily obtained. In this case, R6 is an allyl group or an acrylic group. , methacrylic group, or cinnamyl group, it is sufficient to set the molar fraction of the unit containing the photosensitive group in the range of 1 to 33% 't/te.

In addition, in order to shorten the exposure time and increase sensitivity, a sensitizer or a polyfunctional monomer may be added as long as the initial light transmittance is not impaired. In the case of an atomic group containing a photosensitive group, use a sensitizer such as acetophenone, benzophenone, or benzoin, and in the case of an atomic group containing a cinnamyl group, use biclamide, 2-chloro-4-ditrophenol, etc. Amino, nitro, phenolic compounds, ketone compounds such as benzophenone, etc. may be added in an amount of 0.01 to 1 wt% per 100 parts by weight of the photosensitive resin.

Polyfunctional monomers include ethylene glycol dimethacrylate, trimethylolpropane triacrylate,
Compounds such as trimethylolpropane triacrylate, triallylisocyanurate, trimethacrylic acid, athlate, etc. can be used.

However, the photosensitive resins mentioned above, in which photosensitive groups are introduced into polystyrene-based, polyacrylic ester, and polyacrylic ester-based resins, generally have poor moisture resistance, and the above-mentioned allyl methacrylate resins However, when used under high temperature and high humidity conditions, the light transmittance deteriorates significantly.

In contrast, the photosensitive resin of the present invention has a unit containing R4, that is, a unit containing a hydrocarbon group having a hydroxyl group, and the action of this unit can improve the moisture resistance of the photosensitive resin. It is.

Representative examples of the hydrocarbon group having a hydroxyl group for R4 include atomic groups such as 2-hydroxyethyl group, 3-hydroxypropyl group, and 2-hydroxypropyl group, and the moisture resistance of the photosensitive resin is determined by this R4. By appropriately setting the content rate or molar fraction of the unit containing , a unique effect is achieved in that a photosensitive resin having moisture resistance characteristics suitable for the usage conditions can be obtained.

Here, the moisture resistance property is evaluated by the transmittance after a certain period of time under a certain temperature and humidity.

For example, when used under the condition of 60'CX90% volume, the content of units containing R4 is 15% or more in mole or fraction, that is, if n-hn publication = 1, then 0.1
5Sn<1, and when used under the conditions of 70°α95%4, the content of units containing R4 is 25% in molar fraction.
In other words, if n-hn+1-1, then 0.25S〈x
If set, it is possible to produce a photosensitive resin that can substantially maintain its initial light transmittance properties.

Another method for improving moisture resistance as described above is to add reactive monomers or reactive oligomers having hydroxyl groups in the molecule to conventional photosensitive resins, such as 2-hydroxyethyl acrylate, penquerythritol triacrylate, and epoxy-based resins. A method of adding oligomers is considered. However, in this method, a considerably large amount of additive is required in order to make the resin exhibit sufficient moisture resistance after exposure and crosslinking.As a result, the viscosity of the unexposed resin decreases significantly, and photolithography using a method in which a negative mask is brought into close contact with the resin is required. It is not a perfect method as there are many cases where the law cannot be applied.

Furthermore, the photosensitive resin of the present invention has the advantage that moisture resistance, photosensitivity, mechanical properties, etc. can be individually controlled by appropriately setting the n, m, and I ratios.

That is, as a method for imparting photosensitivity to a particular resin, a method is generally used in which a photosensitive atomic group is introduced into a main chain functional group or a side chain functional group by a method such as substitution or addition. In this case, for example, when an acrylic group is introduced as a photosensitive group into polyglycidyl methacrylate containing an epoxy group in the side chain, a method of reacting polyglycidyl methacrylate with acrylic acid is used. is common (for example, Japanese Unexamined Patent Application Publication No. 1988)
-74594 etc.). In this case, the epoxy ring of polyglycidyl methacrylate is opened by acrylic acid, and a photosensitive resin having a structure in which a ζ hydroxyl group is bonded to the carbon atom at position 2 of the polyglycidyl methacrylate side chain is synthesized. This hydroxyl group can contribute to improving the moisture resistance of the photosensitive resin as in the present invention, but for example, 7
0°) In order to use the resin under the condition of 90% RH, the content of hydroxyl groups must be at least 25 mol%, as explained above, and in this case, the resin must also contain 25 mol% of acrylic photosensitive groups. This will result in That is, in such an example, there is a problem that the moisture resistance and photosensitivity of the resin cannot be individually set and controlled. In this case, it goes without saying that the mechanical properties of the resin cannot be individually set or controlled.

The photosensitive resin of the present invention has a large degree of freedom in selecting the monomer units used as each unit in terms of mechanical properties, such as hardness and flexibility, and can range from a very rigid resin to a very flexible resin. It is possible to design a wide range of material properties, including resins.

The present invention will be specifically explained below with reference to Examples.

〔Example〕

Example 1゜Structural formula%Formula% (However, n=0.7. m-0,10,1=0.20.
A 70:30 (mole ratio) copolymer of methyl meccrylate and 2-hydroxyethyl acrylate (polymerized in methyl ethyl ketone at °C with lauroyl peroxide as a polymerization initiator) was added to a 2-hydroxynityl acrylate unit. was synthesized by reacting 172 equivalents of mecculoyl chloride in pyridine.

This resin was purified twice by dissolving it in methyl ethyl ketone and reprecipitating it from a large excess of methanol. The number average molecular weight of the obtained resin was 4. It was IX1υ5.

As a result of infrared spectroscopic analysis of this resin, it was found that 3200-3
At 500 cm' → characteristic absorption of H group, characteristic absorption of ester group around 1720 an', carbon- around 1640 an'
Characteristic absorption of carbon double bonds was observed.

In order to confirm the resolution of this resin, the resin was dissolved in methyl ethyl ketone, and 0.1 part by weight of 2-hydroxy-2-methyl-l- was added to 100 parts by weight of the resin.
Phenylpropane-1-one was added as a sensitizer, coated on a glass plate, and dried to form a coating film with a thickness of 25 microns. A striped test negative mask with a line width of 20 microns and a line spacing of 20 microns on the coating film (glass thickness 0.5 m)
A chromium vapor deposition mask] was placed in close contact with the mask, and a high-pressure mercury lamp was irradiated for 60 seconds from a height of 20 nm above the mask. After irradiation, the unexposed areas were removed using a mixed solvent of Improper Tool/Acetone-215, and as a result, it was confirmed that a reverse pattern of the negative mask had been formed.

The hardness of the hardened portion was 88 on Shore D hardness.

Next, a coating film of the above resin composition was formed in the same manner on a borosilicate glass plate (thickness 1.0mm) to a thickness K of 500 microns, and a coating film of 1 cm was coated on the entire surface of the coating film from a height of 20an. It was irradiated with a high pressure mercury lamp for 60 seconds. This coating film/borosilicate glass composite exhibited an average transmittance of 9 tons θ% for visible light at a wavelength of 45 (h/700 nm).

This coating film/borosilicate glass composite was heated at 60°C at 90%
After leaving it in a constant temperature and humidity tank for one week, it was taken out and its transmission properties were measured, and it was confirmed that it had an average transmittance of 87.1% for visible light with a wavelength of 450" and 700 nm.

Example 2゜Structural formula % Formula %) 57.5:42.5 (molar ratio) copolymer of n-butyl methacrylate and 2-hydroxyethyl methacrylate (polymerized in methyl ethyl ketone using azobisisobutyronitrile as a polymerization initiator) ) was synthesized by reacting 2.5/42.5 equivalents of cinnamoyl chloride of 2-hydroxyethyl methacrylate units in pyridine.

This resin was purified twice by dissolving it in methyl ethyl ketone and reprecipitating it from a large excess of ethanol. The number average molecular weight of the resulting resin was 1.8×10'.

As a result of infrared spectroscopic analysis of this resin, 3200-3500a
A characteristic absorption of the 10H group is seen at n', and a characteristic absorption of the ester group is seen near 1725an', and in the old nuclear magnetic resonance analysis,
δ6, de, 7 p pm benzene nucleus proton, ゛δ6
．． An absorption peak of protons bonded to carbon-carbon double bonds was observed at 6 ppm.

In order to confirm the resolution of this resin, the resin was dissolved in methyl ethyl ketone, coated on a glass plate, and dried to form a coating film with a thickness of 50 microns.

As in Example 1, the line width was 20 μm and the line spacing was 20 μm on the coating film.
A micron striped test negative mask (a chromium vapor deposition mask with a glass thickness of 0.5+++m) was placed in close contact with the mask, and a 1kW high-pressure mercury lamp was lit three times from a height of 20cm above the mask.
Irradiated for 0 seconds. After irradiation, the unexposed areas were removed using a mixed solvent of methyl ethyl ketone/ethanol-5/1, and as a result, it was confirmed that a reverse pattern of the negative mask had been formed. The hardness of the hardened portion was 65 on Shore A hardness.

Next, a coating film of the above resin composition was formed in the same manner on a borosilicate glass plate (thickness 1.0 mm) to a thickness of 500 microns, and a high pressure of 1 kW was applied from a height of 20 au to the entire surface of the coating film. It was irradiated with a mercury lamp for 60 seconds. The coating/borosilicate glass composite exhibited an average transmission of 87.0% for visible light at wavelengths of 450" and 700 nm.

This coating film/borosilicate glass composite is 70°α90%■
After leaving it in a constant temperature and humidity chamber for one week, it was taken out and its transmission characteristics were measured, and it was confirmed that it had an average transmittance of 845% for visible light with a wavelength of 450''/700 nm.

Example 3゜Structural formula%Formula%(3 (However, n=0.40. m=0.45.1=0.15
．． A 40:60 (molar ratio) copolymer of styrene and 2-hydroxypropyl methacrylate (polymerized in benzene using lauroyl peroxide as a polymerization initiator)
was synthesized by treating a 2-hydroxypropyl methacrylate unit with 1 equivalent of sodium hydride and then reacting it with 15/70 equivalent of allyl bromide in the presence of a tetramethylammonium bromide catalyst.

This resin was purified three times by repeatedly washing it with hydrochloric acidic methanol, dissolving it in methyl ethyl ketone, and reprecipitating it from a large excess of methanol. The number average molecular weight of the resulting resin was 2.2×105.

As a result of infrared spectroscopic analysis of this resin, 3200-3500a
A characteristic absorption of -0)1 group was observed at f', a characteristic absorption of an ester group around 1720 an', and a characteristic absorption of a carbon-carbon double bond around 1600 afl.

In order to confirm the resolution of this resin, the resin was dissolved in methyl ethyl ketone, coated on a glass plate, and dried to form a coating film with a thickness of 25 microns.

As in Example 1, the line width was 20 μm and the line spacing was 20 μm on the coating film.
A micron striped test negative mask (a chromium-deposited mask with a glass thickness of 0.5 mm) was placed in close contact with the mask, and a 1 kW high-pressure mercury lamp was heated at a height of 60 cm from a height of 20 cm above the mask.
Irradiated for seconds. After irradiation, the unexposed areas were removed using a mixed solvent of methyl ethyl ketone/ethanol = 10/1, and as a result, it was confirmed that a reverse pattern of the negative mask had been formed. The hardness of the hardened portion was 44 on Shore D hardness.

Next, a coating film of the above resin composition was formed in the same manner on a borosilicate glass plate (thickness 1.0 mm) to a thickness of 500 microns, and a high pressure of 1 kW was applied from a height of 20 cm to the entire surface of the coating film. It was irradiated with a mercury lamp for 60 seconds. This coating/borosilicate glass composite exhibited an average transmission of 88.0% for visible light at a wavelength of 45 ON700 nm.

This coating film/borosilicate glass composite was heated at 70°C at 90%
After leaving the book in a constant temperature and humidity chamber for one week, it was taken out and its transmission properties were measured, and it was confirmed that it had an average transmittance of 84.1% for visible light with a wavelength of 450''lOOnm.

Borosilicate glass composite at 70°C
), after leaving it in a temperature and humidity chamber for one week, it was taken out and its transmission characteristics were measured, and it was confirmed that it had an average transmittance of 84.1% for visible light with a wavelength of 45 (h-'700 nm). .

Comparative Example 1 A resin having the structural formula (n = 0.7.m-Q, 3 Q, molar ratio) was converted into a 70:30 (molar ratio) copolymer of methyl methacrylate and 2-hydroxyethyl acrylate (Example 1) (Polymerization in the same manner as above) and 2-hydroxyethyl acrylate unit was reacted in 1 equivalent of methacroyl chloride pyridine.

This resin was purified twice by dissolving it in methyl ethyl ketone and reprecipitating it from a large excess of methanol. The number average molecular weight of the obtained resin was 41XIO'.

As a result of infrared spectroscopic analysis of this resin, the characteristic absorption of ester groups was found around 1720 cnr', and the carbon-
Characteristic absorption of carbon double bonds was observed.

In order to confirm the resolution of this resin, the resin was dissolved in methyl ethyl ketone, and 0.1 part by weight of 2-hydroxy-2-methyl-1-phenylpropan-1-one was added as a sensitizer to 100 parts by weight of the resin. The solution was added, applied on a glass plate, and dried to form a coating film with a thickness of 25 microns. Striped test negative mask with a line width of 20 microns and a line spacing of 20 microns on the coating film (glass thickness 0.5 mm)
) chrome-deposited mask) and place it in close contact with the mask.
A 1 kW high-pressure mercury lamp was irradiated for 60 seconds from a height of h.

After irradiation, the unexposed areas were removed using a mixed solvent of isopropanol/acetone-2/5, and as a result, it was confirmed that a reverse pattern of the negative mask had been formed.

The hardness of the hardened portion was Shore D hardness.

Next, a coating film of the above resin composition was formed on a borosilicate glass plate (thickness 1.0 mm) to a thickness of 50.0 mm in the same manner, and a coating film of 20 ann was applied to the entire surface of the coating film. The sample was irradiated with a high-pressure mercury lamp from Sakara Ichinoseki for 60 seconds. The coating/borosilicate glass composite exhibited an average transmission of 95.1% for visible light at wavelengths of 450" and 700 nm.

This coating film/borosilicate glass composite was heated at 60°C at 90%
After leaving it in a temperature and humidity chamber for one week, I took it out and measured its transmission characteristics, and found that its transmittance had deteriorated to an average of 13.8% for visible light with a wavelength of 450" and 700 nm. Ta.

Comparative Example 2 Structural formula (where n=0.7+ rn=0.2Φ%1=0.10
．． 70:30 (molar ratio) copolymer of methyl methacrylate and 2-hydroxyethyl acrylate (polymerized in methyl ethyl ketone using azobisisobutyronitrile as a polymerization initiator) and 2 of 2-hydroxyethyl acrylate units. /3 equivalent of methacroyl chloride was synthesized by reacting in pyridine.

This resin was purified twice by dissolving it in methyl ethyl ketone and reprecipitating it from a large excess of methanol. The number average molecular weight of the obtained resin was 4. It was lXIO3.

The results of infrared spectroscopic analysis of this resin were similar to those in Example 1, but the characteristic absorption absorbance at the time of OH group of 8200-3500an' was calculated by setting the absorbance of the characteristic absorption of ester group to 100 in the case of Example 1. In this case, the absorbance of OH group is 45
In contrast, this resin was dissolved in ethyl ethyl ketone with 8 and further sensitized with 0.1 part by weight of 2-hydroxy-2-methyl-1-phenylpropan-1-one per 100 parts by weight of the resin. It was added as an agent, coated on a glass plate, and dried to form a coating film with a thickness of 25 microns. A striped test negative mask (chromium vapor deposition mask with glass thickness of 0.5 mm) with a line width of 20 microns and a line spacing of 20 microns was placed closely on the paint film, and a 1 kW high-pressure mercury lamp was applied for 60 seconds from a height of 20 ann above the mask. Irradiated.

After irradiation, the unexposed areas were removed using a mixed solvent of methyl ethyl ketone/ethanol = 171, and as a result, it was confirmed that a reverse pattern of the negative mask had been formed.

A coating film of the above resin composition was applied to a borosilicate glass plate (thickness 1
．． 0 mm) to a thickness of 500 microns, and the entire surface of the coating was irradiated with a 1 kW high-pressure mercury lamp from a height of 20 nm for 60 seconds. This coating/borosilicate glass composite has an average of 94
．． It showed the transparency of Section 4. After leaving this coating film/borosilicate glass composite in a constant temperature and humidity chamber at 60°C x 90% for one week, it was taken out and its permeation properties were measured.
It was found that the transmittance for visible light with a wavelength of nm deteriorated to an average of 37.2.

Comparative Example 3 Structural formula % Formula %) The resin was made into a 57.5:42.5 (molar ratio) copolymer of n-butyl methacrylate and 2-hydroxyethyl methacrylate (polymerized in methyl ethyl ketone using lauroyl peroxide as a polymerization initiator). It was synthesized by reacting cinnamoyl chloride in an amount of 7.5/42.5 equivalents of 2-hydroxyethyl methacrylate units in pyridine.

The results of infrared spectroscopic analysis of this resin are similar to those of Example 2, and 3500-3200 an OH
A characteristic absorption of the ester group was observed near 1720 an-', and 1H-nuclear magnetic resonance analysis showed a characteristic absorption of δ6.13.
Benzene nucleus proton at '7.7 ppm, δ6.0-6
．． An absorption peak of protons bonded to carbon-carbon double bonds was observed at 6 ppm.

A coating film of the above resin composition was applied to a borosilicate glass plate (thickness 1
．． 0 mm) to a thickness of 500 microns, and the entire surface of the coating was irradiated with a high-pressure mercury lamp of 1K from a height of 20 ann for 40 seconds. This coating/borosilicate glass composite exhibits an average resistance of 87% for visible light in the wavelength range of 450-700 nm.
It showed 0% transparency. After leaving this coating film/borosilicate glass composite in a constant temperature and humidity chamber at 70°C and 90% RH for one week, it was taken out and its permeation properties were measured.
It was found that the transmittance for visible light with a wavelength of nm deteriorated to an average of 54.6 inches.

〔Effect of the invention〕

As explained above, the photosensitive resin of the present invention not only has excellent light transmittance, but also has excellent moisture resistance without deterioration of light transmittance even when used under high temperature and high humidity conditions, and is suitable for photosensitive resin application fields. There is a great value in using it.

Claims (1)

[Claims] 1. General formula 0<+m+l+<1 n+m+l=1 ▲There are mathematical formulas, chemical formulas, tables, etc.▼ (R^1 in the formula is a hydrogen atom, a methyl group, and R^2 is -C-
O-R group (R is a hydrocarbon group), phenyl group, R^3 is a hydrogen atom, a methyl group, R^4 is a hydrocarbon group having a hydroxyl group, R^5 is a hydrogen atom, a methyl group, R^6 is a A photosensitive resin 2 represented by a photosensitive atomic group (a photosensitive atomic group capable of forming a crosslinked structure upon irradiation with light), a group in which R^6 in claim 1 is an allyl group, an acrylic group, a methacryl group, a cinnamyl group, or a vinyl group. A photosensitive resin that is a hydrocarbon group containing an atomic group selected from