JPH01145171U - - Google Patents
Info
- Publication number
- JPH01145171U JPH01145171U JP4156088U JP4156088U JPH01145171U JP H01145171 U JPH01145171 U JP H01145171U JP 4156088 U JP4156088 U JP 4156088U JP 4156088 U JP4156088 U JP 4156088U JP H01145171 U JPH01145171 U JP H01145171U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- sub
- component mounting
- circuit boards
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4156088U JPH01145171U (de) | 1988-03-29 | 1988-03-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4156088U JPH01145171U (de) | 1988-03-29 | 1988-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01145171U true JPH01145171U (de) | 1989-10-05 |
Family
ID=31267997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4156088U Pending JPH01145171U (de) | 1988-03-29 | 1988-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01145171U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006253506A (ja) * | 2005-03-11 | 2006-09-21 | Tdk Corp | 複合基板装置及び複合基板装置の製造方法 |
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1988
- 1988-03-29 JP JP4156088U patent/JPH01145171U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006253506A (ja) * | 2005-03-11 | 2006-09-21 | Tdk Corp | 複合基板装置及び複合基板装置の製造方法 |