JPS6447081U - - Google Patents
Info
- Publication number
- JPS6447081U JPS6447081U JP14012687U JP14012687U JPS6447081U JP S6447081 U JPS6447081 U JP S6447081U JP 14012687 U JP14012687 U JP 14012687U JP 14012687 U JP14012687 U JP 14012687U JP S6447081 U JPS6447081 U JP S6447081U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- flexible printed
- adhesive
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14012687U JPS6447081U (de) | 1987-09-16 | 1987-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14012687U JPS6447081U (de) | 1987-09-16 | 1987-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6447081U true JPS6447081U (de) | 1989-03-23 |
Family
ID=31404012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14012687U Pending JPS6447081U (de) | 1987-09-16 | 1987-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6447081U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09246683A (ja) * | 1996-03-13 | 1997-09-19 | Nec Corp | 電子部品の実装構造およびその製造方法 |
-
1987
- 1987-09-16 JP JP14012687U patent/JPS6447081U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09246683A (ja) * | 1996-03-13 | 1997-09-19 | Nec Corp | 電子部品の実装構造およびその製造方法 |