JPH0173965U - - Google Patents
Info
- Publication number
- JPH0173965U JPH0173965U JP1987168368U JP16836887U JPH0173965U JP H0173965 U JPH0173965 U JP H0173965U JP 1987168368 U JP1987168368 U JP 1987168368U JP 16836887 U JP16836887 U JP 16836887U JP H0173965 U JPH0173965 U JP H0173965U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- attachment
- printed
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000006073 displacement reaction Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987168368U JPH0173965U (de) | 1987-11-02 | 1987-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987168368U JPH0173965U (de) | 1987-11-02 | 1987-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0173965U true JPH0173965U (de) | 1989-05-18 |
Family
ID=31457488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987168368U Pending JPH0173965U (de) | 1987-11-02 | 1987-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0173965U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007134419A (ja) * | 2005-11-09 | 2007-05-31 | Nec Access Technica Ltd | 基板実装装置およびその実装方法ならびに基板連結部材およびプリント基板 |
-
1987
- 1987-11-02 JP JP1987168368U patent/JPH0173965U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007134419A (ja) * | 2005-11-09 | 2007-05-31 | Nec Access Technica Ltd | 基板実装装置およびその実装方法ならびに基板連結部材およびプリント基板 |
| JP4642637B2 (ja) * | 2005-11-09 | 2011-03-02 | Ｎｅｃアクセステクニカ株式会社 | 基板実装装置およびその実装方法ならびに基板連結部材およびプリント基板 |