JPH01143165U - - Google Patents
Info
- Publication number
- JPH01143165U JPH01143165U JP3939788U JP3939788U JPH01143165U JP H01143165 U JPH01143165 U JP H01143165U JP 3939788 U JP3939788 U JP 3939788U JP 3939788 U JP3939788 U JP 3939788U JP H01143165 U JPH01143165 U JP H01143165U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- semiconductor laser
- roller
- cleaving
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000003776 cleavage reaction Methods 0.000 claims 2
- 230000007017 scission Effects 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 4
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3939788U JPH01143165U (enExample) | 1988-03-25 | 1988-03-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3939788U JPH01143165U (enExample) | 1988-03-25 | 1988-03-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01143165U true JPH01143165U (enExample) | 1989-10-02 |
Family
ID=31265902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3939788U Pending JPH01143165U (enExample) | 1988-03-25 | 1988-03-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01143165U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022153830A (ja) * | 2021-03-30 | 2022-10-13 | 昭和電工マテリアルズ株式会社 | 支持部材の製造方法、及び、半導体装置の製造方法 |
-
1988
- 1988-03-25 JP JP3939788U patent/JPH01143165U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022153830A (ja) * | 2021-03-30 | 2022-10-13 | 昭和電工マテリアルズ株式会社 | 支持部材の製造方法、及び、半導体装置の製造方法 |
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