JPH01143131U - - Google Patents
Info
- Publication number
- JPH01143131U JPH01143131U JP3996788U JP3996788U JPH01143131U JP H01143131 U JPH01143131 U JP H01143131U JP 3996788 U JP3996788 U JP 3996788U JP 3996788 U JP3996788 U JP 3996788U JP H01143131 U JPH01143131 U JP H01143131U
- Authority
- JP
- Japan
- Prior art keywords
- bias
- height
- post
- same
- applying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Wire Bonding (AREA)
Description
第１図はこの考案の一実施例によるバイアスポ
ストを使用した場合の図である。第２図は従来の
バイアスポストを使用した場合の図である。
１は基板、２ａ，２ｂ，３はバイアスポスト、
４，５は各種デバイス、６は金ワイヤ。なお、図
中、同一符号は同一、又は相当部分を示す。
FIG. 1 is a diagram showing a case where a bias post according to an embodiment of this invention is used. FIG. 2 shows a case where a conventional bias post is used. 1 is the substrate, 2a, 2b, 3 are bias posts,
4 and 5 are various devices, and 6 is gold wire. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
イアスポストをデバイスの高さと同じにしたこと
を特徴とするバイアスポスト。 A bias post characterized in that the height of the bias post is the same as the height of the device in a method of applying a bias to the device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3996788U JPH01143131U (en) | 1988-03-26 | 1988-03-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3996788U JPH01143131U (en) | 1988-03-26 | 1988-03-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01143131U true JPH01143131U (en) | 1989-10-02 |
Family
ID=31266448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3996788U Pending JPH01143131U (en) | 1988-03-26 | 1988-03-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01143131U (en) |
-
1988
- 1988-03-26 JP JP3996788U patent/JPH01143131U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH01143131U (en) | ||
| JPS64331U (en) | ||
| JPH01100452U (en) | ||
| JPH0195756U (en) | ||
| JPS6364051U (en) | ||
| JPH0233450U (en) | ||
| JPS5927242U (en) | Anchor using net-like material | |
| JPS6452249U (en) | ||
| JPS6448662U (en) | ||
| JPS6365267U (en) | ||
| JPS63131144U (en) | ||
| JPH0456335U (en) | ||
| JPH0272537U (en) | ||
| JPS6355556U (en) | ||
| JPH01145130U (en) | ||
| JPH0284329U (en) | ||
| JPS6179542U (en) | ||
| JPS60101756U (en) | Lead frame for semiconductor devices | |
| JPH0211336U (en) | ||
| JPS6395564U (en) | ||
| JPH0178047U (en) | ||
| JPH01130556U (en) | ||
| JPS63110029U (en) | ||
| JPH01127255U (en) | ||
| JPS62193311U (en) |