JPH01143126U - - Google Patents
Info
- Publication number
- JPH01143126U JPH01143126U JP1988039111U JP3911188U JPH01143126U JP H01143126 U JPH01143126 U JP H01143126U JP 1988039111 U JP1988039111 U JP 1988039111U JP 3911188 U JP3911188 U JP 3911188U JP H01143126 U JPH01143126 U JP H01143126U
- Authority
- JP
- Japan
- Prior art keywords
- opening
- frame
- cover
- frame holder
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/781—Means for controlling the bonding environment, e.g. valves, vacuum pumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78703—Mechanical holding means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988039111U JPH01143126U (US07223432-20070529-C00017.png) | 1988-03-23 | 1988-03-23 | |
| US07/305,024 US4938834A (en) | 1988-03-23 | 1989-02-02 | Apparatus for preventing the oxidation of lead frames during bonding |
| US07/769,164 US5162068A (en) | 1988-03-23 | 1991-09-30 | Method for preventing oxidation of lead frame in bonding system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988039111U JPH01143126U (US07223432-20070529-C00017.png) | 1988-03-23 | 1988-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01143126U true JPH01143126U (US07223432-20070529-C00017.png) | 1989-10-02 |
Family
ID=12543970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988039111U Pending JPH01143126U (US07223432-20070529-C00017.png) | 1988-03-23 | 1988-03-23 |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US4938834A (US07223432-20070529-C00017.png) |
| JP (1) | JPH01143126U (US07223432-20070529-C00017.png) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5603892A (en) * | 1994-06-09 | 1997-02-18 | Fujitsu Limited | System for maintaining a controlled atmosphere in an electronic circuit package |
| USD381940S (en) * | 1996-05-13 | 1997-08-05 | Burton Randy E | Tail gate protector pad |
| JP4043495B2 (ja) * | 2006-04-20 | 2008-02-06 | 株式会社カイジョー | ワーククランプ及びワイヤボンディング装置 |
| US7578423B1 (en) * | 2008-06-06 | 2009-08-25 | Asm Technology Singapore Pte Ltd. | Assembly for reducing oxidation of semiconductor devices |
| JP6266167B2 (ja) * | 2015-11-05 | 2018-01-24 | 古河電気工業株式会社 | ダイボンディング装置およびダイボンディング方法 |
| EP4299231A1 (de) * | 2022-06-29 | 2024-01-03 | Sonplas GmbH | Vorrichtung und verfahren zum beschneiden eines folienartigen werkstücks |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3650042A (en) * | 1969-05-19 | 1972-03-21 | Ibm | Gas barrier for interconnecting and isolating two atmospheres |
| US3652365A (en) * | 1970-01-02 | 1972-03-28 | William C Mallonee | Gas injection apparatus |
| JPS58159739A (ja) * | 1982-03-19 | 1983-09-22 | オリンパス光学工業株式会社 | レ−ザ手術装置 |
| US4568277A (en) * | 1983-12-20 | 1986-02-04 | International Business Machines Corporation | Apparatus for heating objects to and maintaining them at a desired temperature |
| US4732313A (en) * | 1984-07-27 | 1988-03-22 | Kabushiki Kaisha Toshiba | Apparatus and method for manufacturing semiconductor device |
| JPS62178533A (ja) * | 1986-01-30 | 1987-08-05 | Mitsui Toatsu Chem Inc | ビスフエノ−ルの製造方法 |
-
1988
- 1988-03-23 JP JP1988039111U patent/JPH01143126U/ja active Pending
-
1989
- 1989-02-02 US US07/305,024 patent/US4938834A/en not_active Expired - Fee Related
-
1991
- 1991-09-30 US US07/769,164 patent/US5162068A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US5162068A (en) | 1992-11-10 |
| US4938834A (en) | 1990-07-03 |
