JPH01140900U - - Google Patents
Info
- Publication number
- JPH01140900U JPH01140900U JP3864488U JP3864488U JPH01140900U JP H01140900 U JPH01140900 U JP H01140900U JP 3864488 U JP3864488 U JP 3864488U JP 3864488 U JP3864488 U JP 3864488U JP H01140900 U JPH01140900 U JP H01140900U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- board
- metal rod
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 1
Description
第１図は本考案によるプリント基板のカツトモ
デル図である。第２図はプリント基板表面より見
た金属棒の配置、部品取り付け穴位置（一例）、
基板固定ネジ穴位置を示した図である。第３図は
従来のプリント基板のカツトモデル図である。第
４図は実施例２のカツトモデル図である。
１……金属棒、２……プリント基板固定用ネジ
穴、３……部品取り付け穴、４……プリント基板
（絶縁物）、５……金属板（格子状に加工）。
FIG. 1 is a cut model diagram of a printed circuit board according to the present invention. Figure 2 shows the arrangement of the metal rods as seen from the surface of the printed circuit board, the position of the component mounting holes (an example),
It is a figure showing the board fixing screw hole position. FIG. 3 is a cut model diagram of a conventional printed circuit board. FIG. 4 is a cut model diagram of the second embodiment. 1... Metal rod, 2... Screw hole for fixing the printed circuit board, 3... Parts mounting hole, 4... Printed circuit board (insulator), 5... Metal plate (processed into a grid shape).
Claims (1)
得られることを特徴とする半導体素子実装用プリ
ント基板。 A printed circuit board for mounting semiconductor elements, characterized by having a metal rod embedded inside the board to obtain a shielding effect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3864488U JPH01140900U (en) | 1988-03-23 | 1988-03-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3864488U JPH01140900U (en) | 1988-03-23 | 1988-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01140900U true JPH01140900U (en) | 1989-09-27 |
Family
ID=31265190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3864488U Pending JPH01140900U (en) | 1988-03-23 | 1988-03-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01140900U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001067540A1 (en) * | 2000-03-06 | 2001-09-13 | Fujitsu Limited | Shielding metal plate and circuit device comprising the same |
-
1988
- 1988-03-23 JP JP3864488U patent/JPH01140900U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001067540A1 (en) * | 2000-03-06 | 2001-09-13 | Fujitsu Limited | Shielding metal plate and circuit device comprising the same |
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