JPH01140870U - - Google Patents
Info
- Publication number
- JPH01140870U JPH01140870U JP3747688U JP3747688U JPH01140870U JP H01140870 U JPH01140870 U JP H01140870U JP 3747688 U JP3747688 U JP 3747688U JP 3747688 U JP3747688 U JP 3747688U JP H01140870 U JPH01140870 U JP H01140870U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- circuit board
- glass substrate
- coupling agent
- electronic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229920000642 polymer Polymers 0.000 description 2
- 229910000521 B alloy Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3747688U JPH01140870U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-03-22 | 1988-03-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3747688U JPH01140870U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-03-22 | 1988-03-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01140870U true JPH01140870U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-09-27 |
Family
ID=31264056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3747688U Pending JPH01140870U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-03-22 | 1988-03-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01140870U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015115503A1 (ja) * | 2014-01-28 | 2015-08-06 | コニカミノルタ株式会社 | 導電性パターン、導電性パターン付き基材、導電性パターン付き基材の製造方法、表面に導電性パターンを有する構造体及び該構造体の製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60136394A (ja) * | 1983-12-26 | 1985-07-19 | 三井東圧化学株式会社 | 印酢配線板の製造方法 |
| JPS61279195A (ja) * | 1985-06-05 | 1986-12-09 | 古河電気工業株式会社 | 回路基板の製造方法 |
| JPS62263690A (ja) * | 1986-05-12 | 1987-11-16 | ジエコ−株式会社 | 厚膜回路基板の製造方法 |
-
1988
- 1988-03-22 JP JP3747688U patent/JPH01140870U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60136394A (ja) * | 1983-12-26 | 1985-07-19 | 三井東圧化学株式会社 | 印酢配線板の製造方法 |
| JPS61279195A (ja) * | 1985-06-05 | 1986-12-09 | 古河電気工業株式会社 | 回路基板の製造方法 |
| JPS62263690A (ja) * | 1986-05-12 | 1987-11-16 | ジエコ−株式会社 | 厚膜回路基板の製造方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015115503A1 (ja) * | 2014-01-28 | 2015-08-06 | コニカミノルタ株式会社 | 導電性パターン、導電性パターン付き基材、導電性パターン付き基材の製造方法、表面に導電性パターンを有する構造体及び該構造体の製造方法 |
| KR20160113216A (ko) * | 2014-01-28 | 2016-09-28 | 코니카 미놀타 가부시키가이샤 | 도전성 패턴, 도전성 패턴을 구비한 기재, 도전성 패턴을 구비한 기재의 제조 방법, 표면에 도전성 패턴을 갖는 구조체 및 그 구조체의 제조 방법 |
| JPWO2015115503A1 (ja) * | 2014-01-28 | 2017-03-23 | コニカミノルタ株式会社 | 導電性パターン、導電性パターン付き基材、導電性パターン付き基材の製造方法、表面に導電性パターンを有する構造体及び該構造体の製造方法 |