JPH01140837U - - Google Patents
Info
- Publication number
- JPH01140837U JPH01140837U JP3631288U JP3631288U JPH01140837U JP H01140837 U JPH01140837 U JP H01140837U JP 3631288 U JP3631288 U JP 3631288U JP 3631288 U JP3631288 U JP 3631288U JP H01140837 U JPH01140837 U JP H01140837U
- Authority
- JP
- Japan
- Prior art keywords
- solid
- imaging device
- state imaging
- semi
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
Description
図面は固体撮像装置の部品の斜視図であつて、
１はセラミツク製容器、４は本考案の枠状接着材
、５はキヤツプガラスを示す。
１はセラミツク製容器、４は本考案の枠状接着材
、５はキヤツプガラスを示す。
Claims (1)
- 熱硬化性樹脂及び硬化剤を含有する半硬化状の
接着剤を枠状に形成した固体撮像装置封止用接着
材。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3631288U JPH01140837U (ja) | 1988-03-22 | 1988-03-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3631288U JPH01140837U (ja) | 1988-03-22 | 1988-03-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01140837U true JPH01140837U (ja) | 1989-09-27 |
Family
ID=31262923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3631288U Pending JPH01140837U (ja) | 1988-03-22 | 1988-03-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01140837U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02177568A (ja) * | 1988-12-28 | 1990-07-10 | Toppan Printing Co Ltd | 半導体装置用透明被覆体 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5269570A (en) * | 1975-12-08 | 1977-06-09 | Mitsubishi Electric Corp | Sealing method for microwave integrated circuit container |
-
1988
- 1988-03-22 JP JP3631288U patent/JPH01140837U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5269570A (en) * | 1975-12-08 | 1977-06-09 | Mitsubishi Electric Corp | Sealing method for microwave integrated circuit container |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02177568A (ja) * | 1988-12-28 | 1990-07-10 | Toppan Printing Co Ltd | 半導体装置用透明被覆体 |