JPH01140829U - - Google Patents

Info

Publication number
JPH01140829U
JPH01140829U JP1988036479U JP3647988U JPH01140829U JP H01140829 U JPH01140829 U JP H01140829U JP 1988036479 U JP1988036479 U JP 1988036479U JP 3647988 U JP3647988 U JP 3647988U JP H01140829 U JPH01140829 U JP H01140829U
Authority
JP
Japan
Prior art keywords
semiconductor device
bonding pad
bonding
bonding wire
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988036479U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988036479U priority Critical patent/JPH01140829U/ja
Publication of JPH01140829U publication Critical patent/JPH01140829U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/90
    • H10W72/07552
    • H10W72/07553
    • H10W72/50
    • H10W72/527
    • H10W72/5363
    • H10W72/537
    • H10W72/59
    • H10W72/926
    • H10W72/932
    • H10W72/983
    • H10W74/00

Landscapes

  • Wire Bonding (AREA)
JP1988036479U 1988-03-18 1988-03-18 Pending JPH01140829U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988036479U JPH01140829U (cg-RX-API-DMAC10.html) 1988-03-18 1988-03-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988036479U JPH01140829U (cg-RX-API-DMAC10.html) 1988-03-18 1988-03-18

Publications (1)

Publication Number Publication Date
JPH01140829U true JPH01140829U (cg-RX-API-DMAC10.html) 1989-09-27

Family

ID=31263081

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988036479U Pending JPH01140829U (cg-RX-API-DMAC10.html) 1988-03-18 1988-03-18

Country Status (1)

Country Link
JP (1) JPH01140829U (cg-RX-API-DMAC10.html)

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