JPH0114050Y2 - - Google Patents
Info
- Publication number
- JPH0114050Y2 JPH0114050Y2 JP4401479U JP4401479U JPH0114050Y2 JP H0114050 Y2 JPH0114050 Y2 JP H0114050Y2 JP 4401479 U JP4401479 U JP 4401479U JP 4401479 U JP4401479 U JP 4401479U JP H0114050 Y2 JPH0114050 Y2 JP H0114050Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- reference value
- optical display
- pellet
- display element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 claims description 16
- 230000003287 optical effect Effects 0.000 claims description 15
- 238000012790 confirmation Methods 0.000 claims description 4
- 238000005553 drilling Methods 0.000 description 6
- 230000002950 deficient Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
【考案の詳細な説明】
〔考案の技術分野〕
この考案は表示装置組立てに好適な光表示素子
用回路基板に関する。[Detailed Description of the Invention] [Technical Field of the Invention] This invention relates to a circuit board for an optical display element suitable for assembling a display device.
ここで従来の光表示素子用回路基板について説
明する。第1図はこの考案の回路基板の一実施例
を示すものであるが、この図を利用して説明する
と、従来の回路基板は例えば〓字配列に複数個の
発光素子を取付けることができるように回路配線
パターンが形成されると共に、基準マークとし
て、アライメントマーク21,22,23を有す
るにとどまつている。このアライメントマーク2
1,22,23は、この基板1内の任意の場所に
中心線と平行又は垂直に前記回路配線パターンと
同時にパターニングされているドツト状の銅点で
ある。
Here, a conventional circuit board for an optical display element will be explained. Fig. 1 shows an embodiment of the circuit board of this invention.Using this figure, it will be explained that the conventional circuit board is designed so that, for example, a plurality of light emitting elements can be attached in a cross-shaped arrangement. A circuit wiring pattern is formed thereon, and only alignment marks 21, 22, and 23 are provided as reference marks. This alignment mark 2
Reference numerals 1, 22, and 23 denote dot-shaped copper points that are patterned at arbitrary locations within the substrate 1 parallel to or perpendicular to the center line at the same time as the circuit wiring pattern.
ところで、光表示装置は、このような回路基板
に〓字配列された複数個の発光素子からの個々の
光を有効に表示面へ現出させるために各発光素子
に対向するすり鉢状に開孔された〓字形ゼグメン
ト配列をもつた反射板を備えている。この反射板
は普通樹脂製板体で構成され、前記回路基板に重
ね合わせられるようになつている。この回路基板
には、前記反射板の両端部下面に取付けられた取
付けピンを嵌め込み固定するために、第1図の3
1および32の位置にドリルにより開孔が設けら
れる。 By the way, an optical display device has a cone-shaped opening facing each light emitting element in order to effectively display individual light from a plurality of light emitting elements arranged in a cross-shaped arrangement on a display surface. It is equipped with a reflector plate with a cross-shaped segment arrangement. This reflective plate is usually made of a resin plate and is adapted to be superimposed on the circuit board. In order to fit and fix the mounting pins attached to the lower surface of both ends of the reflector plate into this circuit board, there are shown in FIG.
Holes are drilled at positions 1 and 32.
そして、前記アイライメントマーク21,2
2,23の位置を光学的に検知し、この位置を基
準として、前記31,32の位置を定めて、ここ
にドリルにより開孔を形成したり、前記マーク2
1,22,23を基準にして、回路基板のペレツ
トマウント装置への装着時の傾きやずれをマイコ
ンにより算出させて、回路基板の配線パターンへ
の発光素子のマウント位置を定めている。 Then, the eye alignment marks 21, 2
The positions of the marks 2 and 23 are optically detected, and the positions of the marks 31 and 32 are determined based on these positions, and holes are formed there with a drill or the marks 2 are
1, 22, and 23 as references, a microcomputer calculates the inclination and deviation when the circuit board is mounted on the pellet mount device, and determines the mounting position of the light emitting element on the wiring pattern of the circuit board.
この種の光表示装置においては、反射板のセグ
メント開孔の大きさは、その底部において、発光
素子のサイズと近い大きさに形成されているのが
普通であり、反射板が回路基板に正確に密着して
重ね合わせ固定されるためには、前記回路基板へ
のドリル開孔の形成位置精度や、発光素子の配線
パターン上への取付け位置精度が高くなければな
らない。しかしながら、前記従来の技術では、ア
ライメントマーク21,22,23が小さなドツ
ト状の銅点であるために、装置製造作業工程中に
摩耗して鮮明さを失い、基準マークとしての役割
を失い易い。そのために、前記ドリル開孔や発光
素子のマウントの位置を精度良く定めることがで
きず、表示装置の歩留りを低下させる原因となつ
ている。
In this type of optical display device, the size of the segment aperture of the reflector is usually formed at the bottom to be close to the size of the light emitting element, so that the reflector can be precisely attached to the circuit board. In order to superimpose and fix the light emitting elements in close contact with each other, the precision of the position of forming the drill holes in the circuit board and the precision of the position of mounting the light emitting element on the wiring pattern must be high. However, in the conventional technique, since the alignment marks 21, 22, and 23 are small dot-shaped copper dots, they tend to wear out during the device manufacturing process and lose their sharpness, thus losing their role as reference marks. Therefore, the drill hole and the position of the light emitting element mount cannot be determined with high precision, which causes a decrease in the yield of display devices.
また、前記アライメントマーク21,22,2
3を基準とした光学的検知により、ドリル開孔や
発光素子のマウントの自動化を図つているもの
の、このマーク21,22,23の鮮明さの欠損
により、自動化が阻害されたり、あるいは誤動作
して不良品を多量に作り出すおそれがある。 Further, the alignment marks 21, 22, 2
Although we are trying to automate drilling hole drilling and mounting of light emitting elements using optical detection based on 3, the lack of sharpness of marks 21, 22, and 23 may hinder automation or cause malfunctions. There is a risk of producing a large amount of defective products.
そして、このようなことから、事前に、ドリル
開孔位置精度や発光素子のマウント位置精度を目
視により数量的に簡単に得て、組立装置のドリル
の移動量や発光素子マウント移動量を補正できる
ようにしたいところであるが、前記マーク21,
22,23ではこのような要望を満足することが
できない。更に、回路基板へのドリル開孔後及び
発光素子マウント後、その位置が正しく得られて
いるか目視により簡単に判別できないなどの多く
の問題点がある。 Therefore, it is possible to easily obtain numerically the drilling hole position accuracy and light emitting element mount position accuracy by visual inspection in advance, and correct the amount of movement of the drill of the assembly equipment and the amount of movement of the light emitting element mount. I would like to do this, but the mark 21,
22 and 23 cannot satisfy such a request. Further, there are many other problems, such as that after drilling holes in the circuit board and mounting the light emitting elements, it is not easy to visually determine whether the positions have been correctly obtained.
本考案は、前記従来の種々の問題点を解決した
光表示素子用回路基板を提供するものである。
The present invention provides a circuit board for an optical display element that solves the various problems of the conventional art.
本考案の光表示素子用回路基板は、回路基板
と、この基板の開孔予定域周辺に設けられ第1基
準値を示す内径及び第2基準値を示す外径を有す
る円環状の偏心確認マークと、前記基板上に形成
された複数対の電極パツド群と、これら各対の電
極パツドのうち光表示素子ペレツトが取付けられ
る各電極パツドの一辺にペレツト取付け位置を定
めるために所定の間隔をもつて対状に形成された
切欠きとを備え、前記開孔予定域に形成される開
孔の位置精度を前記偏心確認マークの内外径基準
値から数量的に確認できるようにしたことを特徴
とするものである。
The circuit board for an optical display element of the present invention includes a circuit board and an annular eccentricity check mark provided around the planned hole opening area of the board and having an inner diameter indicating a first reference value and an outer diameter indicating a second reference value. and a plurality of pairs of electrode pads formed on the substrate, each having a predetermined interval on one side of each electrode pad to which an optical display element pellet is attached among the pairs of electrode pads in order to determine a pellet attachment position. and notches formed in pairs, so that the positional accuracy of the hole to be formed in the planned hole opening area can be quantitatively confirmed from the reference value of the inner and outer diameters of the eccentricity confirmation mark. It is something to do.
以下図面を参照してこの考案の1実施例につい
て説明する。第1図に示すように、回路基板1上
にドリル開孔に対する偏心確認マークが開孔予定
域である31,32の位置に設けられ、この位置
は基板1に取着される反射板(図示せず)の取付
けピンが嵌めこまれる開孔の位置である。このマ
ークの形状は第2図に示すように、第1基準値を
示す内径(OF)をもつ内周311,321およ
び第2基準値を示す外径(OG)をもつ外周31
2,322からなる円環状である。例えばNC孔
41または42のドリル径(OE)を4とし、偏
心確認マーク31または32の内径(OF)を第
1基準値である4.2としておくと、もしもこの内
径に接しないで孔が開孔されたときにはこの孔の
ずれ精度は0.1以下であることを容易に目視によ
り判別できる。また偏心確認マークの第2基準値
である外径(OG)を5としておくと、このマー
クのパターン幅は0.4であり、孔が偏心確認マー
ク内径にくいこんで孔あけされた場合もくいこん
だ部分のパターン幅を目測することによつて、ず
れ精度が0.1〜0.4の範囲内でどの程度ずれたかが
目視により数量的に簡単に判別される。従つてこ
のような事前の目視値判別結果に応じて組立装置
のドリル移動量を修正することによつて以後のド
リル開孔を精確に形成することができる。一方、
光表示素子ペレツト取付けの基準を示す電極パツ
ド5,6については、第3図に拡大して示すよう
に、1対の電極パツドの内、アノード電極パツド
5に対向しているカソード電極パツド6の一辺に
そい、所定間隔をもつた1対の切欠き71,72
が設けられている。このときは図に点線で示すよ
うに11の電極パツド想定辺内に光表示素子ペレ
ツト10が取付けられることになる。たとえば切
欠きの深さ0.5mm程度、切欠きと切欠きの間隔を
5mm程度、切欠きの角度を60゜〜90゜程度に形成す
る。このときは切欠きが対状に形成されているの
で、これに合わせてペレツトを配設すれば、基板
上に所定通り位置ずれを起こすことなくきわめて
容易に取着させることが出来る。
An embodiment of this invention will be described below with reference to the drawings. As shown in FIG. 1, eccentricity check marks for drilling holes are provided on the circuit board 1 at positions 31 and 32, which are the planned drilling areas, and these positions are located on the reflector plate attached to the board 1 (see FIG. This is the position of the opening into which the mounting pin (not shown) is inserted. As shown in Figure 2, the shape of this mark is as follows: inner circumferences 311 and 321 with inner diameters (OF) indicating the first reference value and outer circumferences 31 and 321 with outer diameters (OG) indicating the second reference value.
It is an annular shape consisting of 2,322 pieces. For example, if the drill diameter (OE) of the NC hole 41 or 42 is set to 4, and the inner diameter (OF) of the eccentricity check mark 31 or 32 is set to the first standard value of 4.2, if the hole is drilled without touching this inner diameter, It can be easily determined visually that the deviation accuracy of this hole is 0.1 or less. In addition, if the outer diameter (OG), which is the second standard value of the eccentricity check mark, is set to 5, the pattern width of this mark is 0.4, and even if the hole is drilled into the inner diameter of the eccentricity check mark, it will be dug in. By visually measuring the pattern width of a portion, the amount of deviation within the range of deviation accuracy of 0.1 to 0.4 can be easily determined visually and quantitatively. Therefore, by correcting the amount of drill movement of the assembly device in accordance with the result of such prior visual value discrimination, subsequent drill holes can be formed accurately. on the other hand,
As for the electrode pads 5 and 6 that indicate the standard for attaching the optical display element pellet, as shown in an enlarged view in FIG. A pair of notches 71, 72 along one side with a predetermined interval
is provided. At this time, the optical display element pellet 10 is attached within the assumed side of the electrode pad 11, as shown by the dotted line in the figure. For example, the depth of the notches is about 0.5 mm, the interval between the notches is about 5 mm, and the angle of the notches is about 60° to 90°. In this case, since the notches are formed in pairs, by arranging the pellets in accordance with the notches, it is possible to attach the pellets to the substrate in a predetermined manner without causing any misalignment.
さらに第4図A,Bに示すように、L字形の増
設基準点81,82や円形の増設基準点9を設け
ている。これら増設基準点はそれぞれ形状を異に
し、それぞれの形状が発光色の異なるペレツトに
対応させて形成しているので、黄色、赤色などの
複数の発光色のペレツトを配設するときは、この
増設基準点の形状に対応させて誤りなく、かつき
わめて容易に各ペレツトを所定通り取着させるこ
とができる。 Furthermore, as shown in FIGS. 4A and 4B, L-shaped additional reference points 81 and 82 and circular additional reference points 9 are provided. Each of these additional reference points has a different shape, and each shape is formed to correspond to a pellet with a different luminescent color, so when placing pellets with multiple luminescent colors such as yellow and red, use this additional Each pellet can be attached in a predetermined manner without error and very easily in accordance with the shape of the reference point.
また仮にペレツトの配設位置がずれていた場合
は、前記切欠きによりペレツト位置について不良
であることが簡単に目視により判別できるので、
このような不良品を次の組立工程に送ることを防
止できる。 In addition, if the pellet placement position is misaligned, the notch allows you to easily visually determine that the pellet position is defective.
It is possible to prevent such defective products from being sent to the next assembly process.
なお前記実施例においては、偏心確認マークは
回路パターン形成時にパターニングして、位置精
度を最大限に高くしてある。また電極パツドにつ
いては、この考案の要旨に従つて変形構造のもの
が設けられるこというまでもない。 In the embodiment described above, the eccentricity check mark is patterned at the time of circuit pattern formation to maximize positional accuracy. Further, it goes without saying that electrode pads having a deformed structure may be provided in accordance with the gist of this invention.
このようにこの考案の回路基板では、第1基準
値を示す内径及び第2基準値を示す外径を有する
偏心確認マークを形成してあるために、ドリル開
孔位置が事前の検査時にどの程度ずれているか数
量的に簡単に目視確認でき、ドリル移動量の補正
が可能である。従つて、それ以後のドリル開孔位
置精度を保つて回路基板を作製できる。また、開
孔形成後にあつても、反射板取付け用の開孔のず
れの度合を数量的に目視確認できるので不具合の
ものを簡単かつ精確に除去し、反射板の回路基板
への取付けが精度よく所定通りに出来る。さらに
光表示素子ペレツトの回路パターンへの取付けが
所定通り容易適確に出来るなど、作業が確実にで
きるものであつて、この回路基板を用いて光表示
装置として構成よくきわめて良好な特性を備えた
ものが作業性よく得られるものである。
In this way, in the circuit board of this invention, since the eccentricity confirmation mark is formed with the inner diameter indicating the first reference value and the outer diameter indicating the second reference value, it is possible to determine the degree to which the drill hole position is at the time of preliminary inspection. Misalignment can be easily visually confirmed quantitatively, and the amount of drill movement can be corrected. Therefore, the circuit board can be manufactured while maintaining the accuracy of the drill hole position thereafter. In addition, even after the holes are formed, the degree of misalignment of the holes for attaching the reflector plate can be visually confirmed quantitatively, allowing for easy and accurate removal of defective holes and ensuring accurate attachment of the reflector plate to the circuit board. I can often do what I'm supposed to do. Furthermore, the work can be done reliably as the optical display element pellet can be easily and accurately attached to the circuit pattern as specified, and this circuit board can be used as an optical display device with a well-structured structure and extremely good characteristics. The product can be obtained with good workability.
なお発光色の異なる光表示素子ペレツトをそれ
ぞれ所定の位置へまちがいなくマウント出来ると
いう利点をも有するものである。 Furthermore, it also has the advantage that optical display element pellets having different luminescent colors can be mounted at predetermined positions without fail.
第1図はこの考案の回路基板の平面図、第2図
は環状偏心確認マークの平面図、第3図,第4図
A,Bは切欠きの設けられた電極パツドの平面図
である。
1……回路基板、31,32……環状偏心確認
マーク、5,6……電極パツド、71,72……
電極パツドに形成された切欠き、81,82,9
……増設基準点。
FIG. 1 is a plan view of the circuit board of this invention, FIG. 2 is a plan view of an annular eccentricity check mark, and FIGS. 3 and 4 A and B are plan views of electrode pads provided with notches. 1... Circuit board, 31, 32... Annular eccentricity confirmation mark, 5, 6... Electrode pad, 71, 72...
Notches formed in the electrode pad, 81, 82, 9
...Additional reference point.
Claims (1)
られ第1基準値を示す内径及び第2基準値を示す
外径を有する円環状の偏心確認マークと、前記基
板上に形成された複数対の電極パツド群と、これ
ら各対の電極パツドのうち光表示素子ペレツトが
取付けられる各電極パツドの一辺にペレツト取付
け位置を定めるために所定の間隔をもつて対状に
形成された切欠きとを備え、前記開孔予定域に形
成される開孔の位置精度を前記偏心確認マークの
内外径基準値から数量的に確認できるようにした
ことを特徴とする光表示素子用回路基板。 a circuit board, an annular eccentricity check mark provided around the planned hole opening area of the board and having an inner diameter indicating a first reference value and an outer diameter indicating a second reference value; and a plurality of pairs formed on the board. a group of electrode pads, and a notch formed in a pair at a predetermined interval on one side of each electrode pad to which an optical display element pellet is attached among these pairs of electrode pads in order to determine the pellet attachment position. A circuit board for an optical display element, characterized in that the positional accuracy of the hole formed in the planned hole area can be confirmed quantitatively from the reference value of the inner and outer diameters of the eccentricity confirmation mark.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4401479U JPH0114050Y2 (en) | 1979-04-05 | 1979-04-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4401479U JPH0114050Y2 (en) | 1979-04-05 | 1979-04-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55144373U JPS55144373U (en) | 1980-10-16 |
JPH0114050Y2 true JPH0114050Y2 (en) | 1989-04-25 |
Family
ID=28919528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4401479U Expired JPH0114050Y2 (en) | 1979-04-05 | 1979-04-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0114050Y2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4039498B2 (en) * | 1997-12-26 | 2008-01-30 | 章 岡田 | Interface device |
-
1979
- 1979-04-05 JP JP4401479U patent/JPH0114050Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS55144373U (en) | 1980-10-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4776088A (en) | Placement accuracy gauge for electrical components and method of using same | |
US5247844A (en) | Semiconductor pick-and-place machine calibration apparatus | |
JPH0114050Y2 (en) | ||
US4208783A (en) | Method for determining the offset between conductor paths and contact holes in a conductor plate | |
US5628636A (en) | Connector for a substrate with an electronic circuit | |
JP3012622B1 (en) | Manufacturing method of printed wiring board | |
JP2833174B2 (en) | Semiconductor device and mounting method thereof | |
JP2926922B2 (en) | Printed wiring board | |
JPH02125490A (en) | Printed circuit board | |
JP3857404B2 (en) | Printed wiring board | |
CN220653604U (en) | Alignment target of positioning area and printed circuit board | |
JPS587654Y2 (en) | printed wiring board | |
JPH05335438A (en) | Leadless chip carrier | |
JPH01287937A (en) | Film carrier tape | |
JPS5852695Y2 (en) | printed wiring board | |
JPH0349418Y2 (en) | ||
JPH0447473B2 (en) | ||
JPH0294691A (en) | Printed wiring board | |
JPS6112699Y2 (en) | ||
JPS6292342A (en) | Semiconductor package for surface mounting | |
JPH08330685A (en) | Circuit substrate | |
JPH0623014Y2 (en) | Substrate for hybrid integrated circuit | |
JPH0544733Y2 (en) | ||
JPS61174580A (en) | Liquid crystal display unit | |
JPS63296226A (en) | Manufacture of integrated circuit for sensor use |