JPH01139448U - - Google Patents
Info
- Publication number
- JPH01139448U JPH01139448U JP3481788U JP3481788U JPH01139448U JP H01139448 U JPH01139448 U JP H01139448U JP 3481788 U JP3481788 U JP 3481788U JP 3481788 U JP3481788 U JP 3481788U JP H01139448 U JPH01139448 U JP H01139448U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- chip
- sealed
- electronic component
- main surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Details Of Resistors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3481788U JPH01139448U (pl) | 1988-03-16 | 1988-03-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3481788U JPH01139448U (pl) | 1988-03-16 | 1988-03-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01139448U true JPH01139448U (pl) | 1989-09-22 |
Family
ID=31261492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3481788U Pending JPH01139448U (pl) | 1988-03-16 | 1988-03-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01139448U (pl) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH054499U (ja) * | 1991-06-28 | 1993-01-22 | 関西日本電気株式会社 | チツプ型電子部品 |
JP2012235161A (ja) * | 2012-08-01 | 2012-11-29 | Rohm Co Ltd | パッケージ型二端子半導体装置の構造 |
-
1988
- 1988-03-16 JP JP3481788U patent/JPH01139448U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH054499U (ja) * | 1991-06-28 | 1993-01-22 | 関西日本電気株式会社 | チツプ型電子部品 |
JP2012235161A (ja) * | 2012-08-01 | 2012-11-29 | Rohm Co Ltd | パッケージ型二端子半導体装置の構造 |