JPH01138565U - - Google Patents
Info
- Publication number
- JPH01138565U JPH01138565U JP3243388U JP3243388U JPH01138565U JP H01138565 U JPH01138565 U JP H01138565U JP 3243388 U JP3243388 U JP 3243388U JP 3243388 U JP3243388 U JP 3243388U JP H01138565 U JPH01138565 U JP H01138565U
- Authority
- JP
- Japan
- Prior art keywords
- base metal
- inner periphery
- grindstone
- outer diameter
- wall thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010953 base metal Substances 0.000 claims description 6
- 239000006061 abrasive grain Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
- B24D5/126—Cut-off wheels having an internal cutting edge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/12—Saw-blades or saw-discs specially adapted for working stone
- B28D1/121—Circular saw blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3243388U JPH01138565U (ro) | 1988-03-11 | 1988-03-11 | |
| DE19893908153 DE3908153C2 (de) | 1988-03-11 | 1989-03-13 | Innenwirksame Schneidscheibe |
| US07/899,104 US5218948A (en) | 1988-03-11 | 1992-06-15 | Inside diameter blade |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3243388U JPH01138565U (ro) | 1988-03-11 | 1988-03-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01138565U true JPH01138565U (ro) | 1989-09-21 |
Family
ID=12358819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3243388U Pending JPH01138565U (ro) | 1988-03-11 | 1988-03-11 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH01138565U (ro) |
| DE (1) | DE3908153C2 (ro) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69020098T2 (de) * | 1989-10-27 | 1995-11-30 | Sumitomo Electric Industries | Dünne Klinge mit innerer peripherischer Schneide: Verfahren zu ihrer Herstellung. |
| JPH05318460A (ja) * | 1992-05-25 | 1993-12-03 | Tokyo Seimitsu Co Ltd | 半導体ウエハのスライシング方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62139854A (ja) * | 1985-12-11 | 1987-06-23 | Hitachi Metals Ltd | 内周刃スライサ− |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61106207A (ja) * | 1984-10-31 | 1986-05-24 | 株式会社東京精密 | ウエハー製造方法並びに装置 |
| JPS61114813A (ja) * | 1984-11-09 | 1986-06-02 | 日立精工株式会社 | 切断方法 |
-
1988
- 1988-03-11 JP JP3243388U patent/JPH01138565U/ja active Pending
-
1989
- 1989-03-13 DE DE19893908153 patent/DE3908153C2/de not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62139854A (ja) * | 1985-12-11 | 1987-06-23 | Hitachi Metals Ltd | 内周刃スライサ− |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3908153A1 (de) | 1989-09-21 |
| DE3908153C2 (de) | 1994-04-14 |