JPH01138565U - - Google Patents
Info
- Publication number
- JPH01138565U JPH01138565U JP3243388U JP3243388U JPH01138565U JP H01138565 U JPH01138565 U JP H01138565U JP 3243388 U JP3243388 U JP 3243388U JP 3243388 U JP3243388 U JP 3243388U JP H01138565 U JPH01138565 U JP H01138565U
- Authority
- JP
- Japan
- Prior art keywords
- base metal
- inner periphery
- grindstone
- outer diameter
- wall thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010953 base metal Substances 0.000 claims description 6
- 239000006061 abrasive grain Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
- B24D5/126—Cut-off wheels having an internal cutting edge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/12—Saw-blades or saw-discs specially adapted for working stone
- B28D1/121—Circular saw blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Description
第１図は本考案の一実施例の内周刃砥石の要部
を示す断面図、第２図ないし第５図はそれぞれ本
考案の実験例の効果を示すグラフ、第６図は一般
的な内周刃砥石の平面図、第７図は同砥石の断面
図、第８図は従来の内周刃砥石で切断されたウエ
ハの形状を示す概略図、第９図は従来の内周刃砥
石の課題解決法の一例を示す切断装置の概略図、
第１０図は上記装置によつて切断されたウエハの
形状を示す概略図である。
１０……台金、１１……砥粒層、Ｔ……台金の
内周部肉厚、Ｄ……台金の公称外径。
Fig. 1 is a sectional view showing the main parts of an internal grindstone according to an embodiment of the present invention, Figs. 2 to 5 are graphs showing the effects of experimental examples of the present invention, and Fig. 6 is a general A plan view of the internal grinding wheel, Fig. 7 is a cross-sectional view of the same grinding wheel, Fig. 8 is a schematic diagram showing the shape of a wafer cut with a conventional internal grinding wheel, and Fig. 9 is a conventional internal cutting grindstone. A schematic diagram of a cutting device showing an example of a problem solving method,
FIG. 10 is a schematic diagram showing the shape of a wafer cut by the above apparatus. 10... Base metal, 11... Abrasive grain layer, T... Inner peripheral wall thickness of base metal, D... Nominal outer diameter of base metal.
Claims (1)
る砥粒層が形成された内周刃砥石において、前記
台金の内周部の肉厚を前記外径の５０００分の１
以下とし、かつ台金の抗張力を２３０Kgｆ／ｍm2
以上としたことを特徴とする内周刃砥石。 In an inner peripheral blade grindstone in which an abrasive grain layer made by dispersing superabrasive grains is formed on the inner periphery of a ring-shaped base metal, the wall thickness of the inner periphery of the base metal is 1/5000 of the outer diameter.
or less, and the tensile strength of the base metal is 230Kgf/mm 2
An internal grindstone characterized by the above-mentioned features.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3243388U JPH01138565U (en) | 1988-03-11 | 1988-03-11 | |
| DE19893908153 DE3908153C2 (en) | 1988-03-11 | 1989-03-13 | Internal cutting disc |
| US07/899,104 US5218948A (en) | 1988-03-11 | 1992-06-15 | Inside diameter blade |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3243388U JPH01138565U (en) | 1988-03-11 | 1988-03-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01138565U true JPH01138565U (en) | 1989-09-21 |
Family
ID=12358819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3243388U Pending JPH01138565U (en) | 1988-03-11 | 1988-03-11 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH01138565U (en) |
| DE (1) | DE3908153C2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0424953B1 (en) * | 1989-10-27 | 1995-06-14 | Sumitomo Electric Industries, Ltd. | Inner peripheral type thin plate blade: method of producing the same |
| JPH05318460A (en) * | 1992-05-25 | 1993-12-03 | Tokyo Seimitsu Co Ltd | Method for slicing semiconductor wafer |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62139854A (en) * | 1985-12-11 | 1987-06-23 | Hitachi Metals Ltd | Slicer having inner circular edge |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61106207A (en) * | 1984-10-31 | 1986-05-24 | 株式会社東京精密 | Manufacture of wafer |
| JPS61114813A (en) * | 1984-11-09 | 1986-06-02 | 日立精工株式会社 | Cutting method |
-
1988
- 1988-03-11 JP JP3243388U patent/JPH01138565U/ja active Pending
-
1989
- 1989-03-13 DE DE19893908153 patent/DE3908153C2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62139854A (en) * | 1985-12-11 | 1987-06-23 | Hitachi Metals Ltd | Slicer having inner circular edge |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3908153A1 (en) | 1989-09-21 |
| DE3908153C2 (en) | 1994-04-14 |