JPH02139062U - - Google Patents
Info
- Publication number
- JPH02139062U JPH02139062U JP4803889U JP4803889U JPH02139062U JP H02139062 U JPH02139062 U JP H02139062U JP 4803889 U JP4803889 U JP 4803889U JP 4803889 U JP4803889 U JP 4803889U JP H02139062 U JPH02139062 U JP H02139062U
- Authority
- JP
- Japan
- Prior art keywords
- base metal
- inner peripheral
- grindstone
- abrasive grain
- grain layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010953 base metal Substances 0.000 claims description 8
- 239000006061 abrasive grain Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Description
第１図は本考案の一実施例の内周刃砥石の要部
を示す断面図、第２図ないし第５図はそれぞれ本
考案の実験例の効果を示すグラフ、第６図は一般
的な内周刃砥石の平面図、第７図は同砥石の断面
図、第８図は従来の内周刃砥石で切断されたウエ
ハの形状を示す概略図、第９図は従来の内周刃砥
石の課題解決法の一例を示す切断装置の概略図、
第１０図は上記装置によつて切断されたウエハの
形状を示す概略図である。
１０……台金、１１……砥粒層、Ｔ……台金の
内周部肉厚、Ｄ……台金の公称外径、Ｃ……砥粒
層の台金半径方向の幅。
Fig. 1 is a sectional view showing the main parts of an internal grindstone according to an embodiment of the present invention, Figs. 2 to 5 are graphs showing the effects of experimental examples of the present invention, and Fig. 6 is a general A plan view of the internal grinding wheel, Fig. 7 is a cross-sectional view of the same grinding wheel, Fig. 8 is a schematic diagram showing the shape of a wafer cut with a conventional internal grinding wheel, and Fig. 9 is a conventional internal cutting grindstone. A schematic diagram of a cutting device showing an example of how to solve the problem of
FIG. 10 is a schematic diagram showing the shape of a wafer cut by the above apparatus. 10...Base metal, 11...Abrasive grain layer, T...Inner peripheral wall thickness of base metal, D...Nominal outer diameter of base metal, C...Width of the abrasive grain layer in the radial direction of the base metal.
Claims (1)
てなる砥粒層が形成された内周刃砥石において、
前記台金の内周部の肉厚を前記外径の５０００分
の１以下とし、かつ台金の拡張力を２３０Kgｆ／
mm２以上としたことを特徴とする内周刃砥石。 (2) 前記砥粒層の台金半径方向の幅を１mm以下
にしたことを特徴とする第１項記載の内周刃砥石
。[Scope of Claim for Utility Model Registration] (1) In an inner peripheral edge grindstone in which an abrasive grain layer made of dispersed superabrasive grains is formed on the inner periphery of a ring-shaped base metal,
The wall thickness of the inner circumference of the base metal is 1/5000 or less of the outer diameter, and the expansion force of the base metal is 230 kgf/
An inner peripheral grindstone characterized by having a diameter of mm2 or more . (2) The inner peripheral edge grindstone according to item 1, wherein the width of the abrasive grain layer in the radial direction of the base metal is 1 mm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989048038U JP2516937Y2 (en) | 1989-04-24 | 1989-04-24 | Inner circumference whetstone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989048038U JP2516937Y2 (en) | 1989-04-24 | 1989-04-24 | Inner circumference whetstone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02139062U true JPH02139062U (en) | 1990-11-20 |
| JP2516937Y2 JP2516937Y2 (en) | 1996-11-13 |
Family
ID=31564500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989048038U Expired - Fee Related JP2516937Y2 (en) | 1989-04-24 | 1989-04-24 | Inner circumference whetstone |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2516937Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63172563U (en) * | 1987-04-28 | 1988-11-09 |
-
1989
- 1989-04-24 JP JP1989048038U patent/JP2516937Y2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63172563U (en) * | 1987-04-28 | 1988-11-09 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2516937Y2 (en) | 1996-11-13 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |