JPH01135737U - - Google Patents

Info

Publication number
JPH01135737U
JPH01135737U JP3151588U JP3151588U JPH01135737U JP H01135737 U JPH01135737 U JP H01135737U JP 3151588 U JP3151588 U JP 3151588U JP 3151588 U JP3151588 U JP 3151588U JP H01135737 U JPH01135737 U JP H01135737U
Authority
JP
Japan
Prior art keywords
lead frame
hole
electrode
electronic component
component element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3151588U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3151588U priority Critical patent/JPH01135737U/ja
Publication of JPH01135737U publication Critical patent/JPH01135737U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Wire Bonding (AREA)
JP3151588U 1988-03-09 1988-03-09 Pending JPH01135737U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3151588U JPH01135737U (zh) 1988-03-09 1988-03-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3151588U JPH01135737U (zh) 1988-03-09 1988-03-09

Publications (1)

Publication Number Publication Date
JPH01135737U true JPH01135737U (zh) 1989-09-18

Family

ID=31257419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3151588U Pending JPH01135737U (zh) 1988-03-09 1988-03-09

Country Status (1)

Country Link
JP (1) JPH01135737U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006040928A (ja) * 2004-07-22 2006-02-09 Nec Electronics Corp 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006040928A (ja) * 2004-07-22 2006-02-09 Nec Electronics Corp 半導体装置
JP4550503B2 (ja) * 2004-07-22 2010-09-22 ルネサスエレクトロニクス株式会社 半導体装置

Similar Documents

Publication Publication Date Title
JPH01135737U (zh)
JPH0316354U (zh)
JPS6438819U (zh)
JPH0410362U (zh)
JPS6024466U (ja) はんだ・ろう付け用合わせ材
JPH0211337U (zh)
JPH0263590U (zh)
JPH03122524U (zh)
JPS6136387U (ja) レ−ザ接合構造
JPH0343762U (zh)
JPS6182375U (zh)
JPS6183041U (zh)
JPS61162365U (zh)
JPH0338619U (zh)
JPS63105320U (zh)
JPH03124556U (zh)
JPS62178521U (zh)
JPS6298187U (zh)
JPH0323937U (zh)
JPS61102033U (zh)
JPS63142822U (zh)
JPS645370U (zh)
JPS633157U (zh)
JPS61114848U (zh)
JPH0350754U (zh)