JPH01135736U - - Google Patents
Info
- Publication number
- JPH01135736U JPH01135736U JP3109188U JP3109188U JPH01135736U JP H01135736 U JPH01135736 U JP H01135736U JP 3109188 U JP3109188 U JP 3109188U JP 3109188 U JP3109188 U JP 3109188U JP H01135736 U JPH01135736 U JP H01135736U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- semiconductor pellet
- metal plate
- insulating substrate
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Wire Bonding (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3109188U JPH01135736U (US06633782-20031014-M00005.png) | 1988-03-08 | 1988-03-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3109188U JPH01135736U (US06633782-20031014-M00005.png) | 1988-03-08 | 1988-03-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01135736U true JPH01135736U (US06633782-20031014-M00005.png) | 1989-09-18 |
Family
ID=31256700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3109188U Pending JPH01135736U (US06633782-20031014-M00005.png) | 1988-03-08 | 1988-03-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01135736U (US06633782-20031014-M00005.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992002117A1 (en) * | 1990-07-26 | 1992-02-06 | Fujitsu Limited | Heat dissipating structure of semiconductor device |
-
1988
- 1988-03-08 JP JP3109188U patent/JPH01135736U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992002117A1 (en) * | 1990-07-26 | 1992-02-06 | Fujitsu Limited | Heat dissipating structure of semiconductor device |
| GB2252451A (en) * | 1990-07-26 | 1992-08-05 | Fujitsu Ltd | Heat dissipating structure of semiconductor device |
| US5262922A (en) * | 1990-07-26 | 1993-11-16 | Fujitsu, Limited | Heat radiation structure for semiconductor device |
| GB2252451B (en) * | 1990-07-26 | 1995-01-04 | Fujitsu Ltd | Heat radiation structure for semiconductor device |
