JPH01133701U - - Google Patents

Info

Publication number
JPH01133701U
JPH01133701U JP1988030869U JP3086988U JPH01133701U JP H01133701 U JPH01133701 U JP H01133701U JP 1988030869 U JP1988030869 U JP 1988030869U JP 3086988 U JP3086988 U JP 3086988U JP H01133701 U JPH01133701 U JP H01133701U
Authority
JP
Japan
Prior art keywords
terminal electrode
resistor
layers
electrode layers
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988030869U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988030869U priority Critical patent/JPH01133701U/ja
Priority to US07/293,416 priority patent/US4899126A/en
Publication of JPH01133701U publication Critical patent/JPH01133701U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10045—Mounted network component having plural terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49101—Applying terminal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
  • Details Of Resistors (AREA)
JP1988030869U 1988-03-07 1988-03-07 Pending JPH01133701U (US20090163788A1-20090625-C00002.png)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1988030869U JPH01133701U (US20090163788A1-20090625-C00002.png) 1988-03-07 1988-03-07
US07/293,416 US4899126A (en) 1988-03-07 1989-01-04 Thick film resistor type printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988030869U JPH01133701U (US20090163788A1-20090625-C00002.png) 1988-03-07 1988-03-07

Publications (1)

Publication Number Publication Date
JPH01133701U true JPH01133701U (US20090163788A1-20090625-C00002.png) 1989-09-12

Family

ID=12315735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988030869U Pending JPH01133701U (US20090163788A1-20090625-C00002.png) 1988-03-07 1988-03-07

Country Status (2)

Country Link
US (1) US4899126A (US20090163788A1-20090625-C00002.png)
JP (1) JPH01133701U (US20090163788A1-20090625-C00002.png)

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US5256836A (en) * 1989-06-09 1993-10-26 Toshiba Lighting & Technology Corporation Thick film hybrid circuit board device and method of manufacturing the same
US5408574A (en) * 1989-12-01 1995-04-18 Philip Morris Incorporated Flat ceramic heater having discrete heating zones
US4994737A (en) * 1990-03-09 1991-02-19 Cascade Microtech, Inc. System for facilitating planar probe measurements of high-speed interconnect structures
JP2637662B2 (ja) * 1992-02-25 1997-08-06 ローム株式会社 チップ型複合電子部品の製造方法及びチップ型ネットワーク抵抗器の製造方法
US5468936A (en) * 1993-03-23 1995-11-21 Philip Morris Incorporated Heater having a multiple-layer ceramic substrate and method of fabrication
JP2674523B2 (ja) * 1993-12-16 1997-11-12 日本電気株式会社 セラミック配線基板とその製造方法
JP3630456B2 (ja) * 1994-11-30 2005-03-16 浜松ホトニクス株式会社 電子増倍管
US6232789B1 (en) * 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
JPH08306503A (ja) * 1995-05-11 1996-11-22 Rohm Co Ltd チップ状電子部品
US6002394A (en) * 1995-10-02 1999-12-14 Starsight Telecast, Inc. Systems and methods for linking television viewers with advertisers and broadcasters
WO1997030461A1 (en) * 1996-02-15 1997-08-21 Bourns, Inc. Resistor network in ball grid array package
AT404207B (de) * 1996-02-16 1998-09-25 Mikroelektronik Ges M B H Ab Verfahren zum herstellen elektrischer schaltkreise
DE19631477A1 (de) * 1996-08-03 1998-02-05 Bosch Gmbh Robert In Hybridtechnik hergestellte abgleichbare Spannungsteiler-Anordnung
JPH10189318A (ja) * 1996-12-27 1998-07-21 Hokuriku Electric Ind Co Ltd ネットワーク抵抗器の製造方法
US6305923B1 (en) * 1998-06-12 2001-10-23 Husky Injection Molding Systems Ltd. Molding system using film heaters and/or sensors
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
DE10143173A1 (de) * 2000-12-04 2002-06-06 Cascade Microtech Inc Wafersonde
US6664500B2 (en) * 2000-12-16 2003-12-16 Anadigics, Inc. Laser-trimmable digital resistor
KR20020079522A (ko) * 2001-04-10 2002-10-19 야자키 소교 가부시키가이샤 후막저항판 및 그 제조방법
CN101335235B (zh) 2002-03-12 2010-10-13 浜松光子学株式会社 基板的分割方法
TWI326626B (en) * 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
ES2356817T3 (es) 2002-03-12 2011-04-13 Hamamatsu Photonics K.K. Método de corte de un objeto procesado.
AU2003233659A1 (en) * 2002-05-23 2003-12-12 Cascade Microtech, Inc. Probe for testing a device under test
US20040080397A1 (en) * 2002-10-25 2004-04-29 Mike Cubon Method of protecting a thick film resistor
US6724205B1 (en) * 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
TWI520269B (zh) 2002-12-03 2016-02-01 Hamamatsu Photonics Kk Cutting method of semiconductor substrate
FR2852250B1 (fr) * 2003-03-11 2009-07-24 Jean Luc Jouvin Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau
WO2004080643A1 (ja) * 2003-03-12 2004-09-23 Hamamatsu Photonics K.K. レーザ加工方法
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
WO2005065258A2 (en) 2003-12-24 2005-07-21 Cascade Microtech, Inc. Active wafer probe
GB0415045D0 (en) * 2004-07-05 2004-08-04 Tyco Electronics Ltd Uk Electrical device having a heat generating resistive element
JP2008512680A (ja) 2004-09-13 2008-04-24 カスケード マイクロテック インコーポレイテッド 両面プロービング構造体
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
TWI303542B (en) * 2006-03-21 2008-11-21 Ind Tech Res Inst Film resistor embedded in a multiple-layer circuit board and manufacturing thereof
TWI285068B (en) * 2006-03-24 2007-08-01 Ind Tech Res Inst An adjustable resistor embedded in a multi-layer substrate and method for forming the same
US7764072B2 (en) * 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7723999B2 (en) * 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7443186B2 (en) * 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7403028B2 (en) * 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7911318B2 (en) * 2007-02-16 2011-03-22 Industrial Technology Research Institute Circuit boards with embedded resistors
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US8687369B2 (en) * 2012-02-20 2014-04-01 Apple Inc. Apparatus for creating resistive pathways
CN109673111B (zh) * 2017-10-13 2021-08-20 宏启胜精密电子(秦皇岛)有限公司 电路板的制作方法
TR2022014928A2 (tr) * 2022-09-29 2022-10-21 Munzur Üni̇versi̇tesi̇ Rektörlüğü Mi̇kro elektroni̇k endüstri̇si̇ uygulamalari i̇çi̇n sulu olmayan yeşi̇l solventler i̇çeri̇si̇nde yüksek düzeyde i̇letken ve korozyona dayanikli cu(ag) alaşiminin elektroki̇myasal üreti̇m yöntemi̇

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US2585752A (en) * 1948-05-26 1952-02-12 Sprague Electric Co Production of discontinuous, conducting coatings upon insulating surfaces
US2758267A (en) * 1955-06-22 1956-08-07 Du Pont Silver conductors
GB1234688A (en) * 1968-04-06 1971-06-09 Sumitomo Chemical Co Novel disperse dyes
US3621442A (en) * 1968-11-07 1971-11-16 Allen Bradley Co Terminal connection of electronic devices
US3775725A (en) * 1970-04-30 1973-11-27 Hokuriku Elect Ind Printed resistor
US3909680A (en) * 1973-02-16 1975-09-30 Matsushita Electric Ind Co Ltd Printed circuit board with silver migration prevention
GB2061075B (en) * 1979-10-11 1983-08-10 Tdk Electronics Co Ltd Ptc heating apparatus
US4695504A (en) * 1985-06-21 1987-09-22 Matsushita Electric Industrial Co., Ltd. Thick film resistor composition
US4816615A (en) * 1987-08-20 1989-03-28 General Electric Company Thick film copper conductor inks

Also Published As

Publication number Publication date
US4899126A (en) 1990-02-06

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