JPH01133570U - - Google Patents
Info
- Publication number
- JPH01133570U JPH01133570U JP2970888U JP2970888U JPH01133570U JP H01133570 U JPH01133570 U JP H01133570U JP 2970888 U JP2970888 U JP 2970888U JP 2970888 U JP2970888 U JP 2970888U JP H01133570 U JPH01133570 U JP H01133570U
- Authority
- JP
- Japan
- Prior art keywords
- gland
- packing
- shaft hole
- gland packing
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 210000004907 gland Anatomy 0.000 claims description 5
- 238000012856 packing Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Description
第1図は本考案の一実施例を示す適正荷重時の
半裁断面図、第2図は同じく概略的な回路図、第
3図は同じく荷重低下時の半裁断面図、第4図は
従来例を示す半裁断面図である。
1……ハウジング、2……軸孔、3……スタフ
イングボツクス、5……グランドボルト、6……
グランド、7……軸、8……グランドパツキン、
8a……グランドパツキン本体、9……感圧セン
サ、10,11……電極板、12……絶縁スペー
サ、13……絶縁外皮、14……回路、15……
表示ランプ(モニタ装置)。
Fig. 1 is a half-cut sectional view showing an embodiment of the present invention under proper load, Fig. 2 is a schematic circuit diagram, Fig. 3 is a half-cut sectional view when the load is reduced, and Fig. 4 is a conventional example. FIG. 1...Housing, 2...Shaft hole, 3...Stuffing box, 5...Gland bolt, 6...
Grand, 7...Axis, 8...Grand Patsukin,
8a...Gland packing body, 9...Pressure sensor, 10, 11...Electrode plate, 12...Insulating spacer, 13...Insulating outer cover, 14...Circuit, 15...
Indicator lamp (monitor device).
Claims (1)
クスと前記軸孔の内周に挿通した軸との間にグラ
ンドによつて圧縮された状態で介装されるグラン
ドパツキンに、モニタ装置を有する外部の回路と
接続され当該パツキンに付与された荷重によつて
前記回路を開閉する感圧センサを装着してなるこ
とを特徴とするグランドパツキン。 An external circuit having a monitor device is connected to a gland packing that is compressed and interposed by a gland between a stuffing box formed in the shaft hole of the housing and a shaft inserted into the inner periphery of the shaft hole. 1. A gland packing comprising: a pressure-sensitive sensor that opens and closes the circuit according to a load applied to the packing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2970888U JPH0422133Y2 (en) | 1988-03-08 | 1988-03-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2970888U JPH0422133Y2 (en) | 1988-03-08 | 1988-03-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01133570U true JPH01133570U (en) | 1989-09-12 |
JPH0422133Y2 JPH0422133Y2 (en) | 1992-05-20 |
Family
ID=31254151
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2970888U Expired JPH0422133Y2 (en) | 1988-03-08 | 1988-03-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0422133Y2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018155253A (en) * | 2017-03-15 | 2018-10-04 | Kyb株式会社 | Seal state detection device |
JP2019056451A (en) * | 2017-09-22 | 2019-04-11 | 株式会社フジキン | Valve with sensor and monitoring system and fluid supply device using the same |
JP2020051525A (en) * | 2018-09-27 | 2020-04-02 | 株式会社フジキン | Valve, method for assembling and method monitoring the same |
-
1988
- 1988-03-08 JP JP2970888U patent/JPH0422133Y2/ja not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018155253A (en) * | 2017-03-15 | 2018-10-04 | Kyb株式会社 | Seal state detection device |
JP2019056451A (en) * | 2017-09-22 | 2019-04-11 | 株式会社フジキン | Valve with sensor and monitoring system and fluid supply device using the same |
JP2020051525A (en) * | 2018-09-27 | 2020-04-02 | 株式会社フジキン | Valve, method for assembling and method monitoring the same |
Also Published As
Publication number | Publication date |
---|---|
JPH0422133Y2 (en) | 1992-05-20 |
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