JPH01132773A - Production of face of timepiece - Google Patents
Production of face of timepieceInfo
- Publication number
- JPH01132773A JPH01132773A JP62290815A JP29081587A JPH01132773A JP H01132773 A JPH01132773 A JP H01132773A JP 62290815 A JP62290815 A JP 62290815A JP 29081587 A JP29081587 A JP 29081587A JP H01132773 A JPH01132773 A JP H01132773A
- Authority
- JP
- Japan
- Prior art keywords
- resist film
- layer
- chemical
- metal layer
- plating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 238000007747 plating Methods 0.000 claims abstract description 52
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 43
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000000126 substance Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 23
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 22
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 16
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000010931 gold Substances 0.000 claims abstract description 11
- 229910052737 gold Inorganic materials 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 5
- 238000005530 etching Methods 0.000 claims abstract description 3
- 239000012811 non-conductive material Substances 0.000 claims description 4
- 239000000615 nonconductor Substances 0.000 abstract description 2
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 2
- 238000004049 embossing Methods 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
Abstract
Description
【発明の詳細な説明】 C産業上の利用分野〕 本発明は、時計文字板の製造方法に関するものである。[Detailed description of the invention] C Industrial application field] The present invention relates to a method of manufacturing a watch dial.
本発明は、時計文字板において非導電体からなる時計用
文字板の基板上に、第1の金属層として化学ニッケルめ
っき方法によりニッケルめっき層を形成した後、該ニッ
ケルめっき層上面の一部にレジスト膜を形成し、レジス
ト膜のない部分をエツチングし、その後にレジスト膜を
剥離し、かつ第1の金属層の上に第2の金属層として、
化学金めっき方法による金めつき層あるいは化学パラジ
ウムめっき方法によるパラジウムめっき層あるいは化学
パラジウムめっき方法によるパラジウムめっき層を形成
することにより、金属的な輝きのある盛り上がった文字
や目盛りあるいは複雑な模様の作製を実現するようにし
たものである。In the present invention, a nickel plating layer is formed as a first metal layer on a substrate of a watch dial made of a non-conductive material by a chemical nickel plating method, and then a part of the upper surface of the nickel plating layer is forming a resist film, etching the part without the resist film, then peeling off the resist film, and forming a second metal layer on the first metal layer;
By forming a gold plating layer using a chemical gold plating method, a palladium plating layer using a chemical palladium plating method, or a palladium plating layer using a chemical palladium plating method, it is possible to create raised letters, scales, or complex patterns with a metallic shine. It was designed to realize the following.
従来、金属的な輝きのある盛り上がった文字や目盛りあ
るいは模様のある時計文字板を得る技術としては、プレ
スを用いたエンボス加工があった。Conventionally, embossing using a press has been used as a technique for obtaining a watch dial with raised letters, scales, or patterns that have a metallic shine.
上記のようなエンボス加工は、黄銅型の文字板を用い、
文字板裏部から凸形状のプレスで文字板表面に文字や目
盛りあるいは模様等を浮き出させる方法であったので、
複雑形状の模様や細い線を表現することができなかった
。さらにエンボス加工は、文字板に塗料を塗装してから
行うていたので、作製された文字板凸部と基部との境界
部に、塗料のハガレあるいはゆがみ等が生じやすいなと
の欠点を有していた。Embossing as above is done using a brass type dial.
This method used a convex press from the back of the dial to emboss letters, scales, patterns, etc. on the dial surface.
It was not possible to express complex patterns or thin lines. Furthermore, since the embossing process was performed after the dial was coated with paint, there was a drawback that the paint was likely to peel or distort at the boundary between the dial protrusion and the base. was.
上記問題点を解決するために、本発明においては、非導
電体からなる時計用文字板の基板上に、第1の金属層と
して化学ニッケルめっき方法によりニッケルめっき層を
形成した後、該ニッケルめっき層上面の一部にレジスト
膜を゛形成し、レジスト膜のない部分をエツチングし、
その後にレジスト膜を剥離し、かつ第1の金属層の上に
第2の金属層として、化学金めっき方法による金めつき
層あるいは化学パラジウムめっき方法によるパラジウム
めっき層を形成することにより、金属的な輝きのある盛
り上がった文字や目盛りあるいは複雑な模様の作製を実
現した。In order to solve the above problems, in the present invention, a nickel plating layer is formed as a first metal layer by a chemical nickel plating method on a substrate of a watch dial made of a non-conductive material, and then the nickel plating layer is formed by a chemical nickel plating method. A resist film is formed on a part of the upper surface of the layer, and the parts without the resist film are etched.
Thereafter, the resist film is peeled off, and a gold plating layer using a chemical gold plating method or a palladium plating layer using a chemical palladium plating method is formed as a second metal layer on the first metal layer. We have realized the creation of shiny raised letters, scales, and complex patterns.
本発明は、非4電体に金属あるいは合金をめっきするた
めに化学めっき方法を採用した。化学ニッケルめっき方
法は非導電体に直接化宇金めっき方法あるいは、化学パ
ラジウムめっき方法を適用することが比較的困難である
ために採用するもので、lOμm程度の厚付けが可能で
ある。化学金めっき方法あるいは化学パラジウムめっき
方法は、本来の目的である、文字や目盛りあるいは複雑
な模様の金属的な輝きを得るために採用され、さらに第
1の金属層の化学ニッケルめっき層を保護するために採
用されるものである。また、文字板上では、それぞれの
文字や目盛り等が独立しているため、電気めっき方法で
金属あるいは合金をめっきすることが不可能であるとい
う理由により、化学めっき方法が採用されるものである
。The present invention employs a chemical plating method to plate a metal or alloy on a non-quaternary electric body. The chemical nickel plating method is adopted because it is relatively difficult to directly apply chemical nickel plating or chemical palladium plating to non-conductors, and it is possible to achieve a thickness of about 10 μm. The chemical gold plating method or the chemical palladium plating method is adopted to obtain the metallic shine of letters, scales, or complex patterns, which is the original purpose, and also to protect the chemical nickel plating layer of the first metal layer. It is adopted for this purpose. Furthermore, since each letter, scale, etc. on the dial is independent, it is impossible to plate metal or alloy with electroplating, so chemical plating is used. .
ABS (アクリロニトリル・ブタジェン・スチレン)
樹脂製の時計用文字板1に、化学ニッケルめっき皮膜層
2を5μm形成させ、このニッケル層の上面にフォトレ
ジスト法等によってレジスト膜を形成し、その後レジス
ト膜のない部分をエツチングし、さらにレジスト膜を除
去した後に、化学パラジウムめっき皮膜N3を5μm形
成させて、第1図のような時計文字板を得た。ABS (acrylonitrile, butadiene, styrene)
A chemical nickel plating film layer 2 of 5 μm thickness is formed on a resin watch dial 1, a resist film is formed on the upper surface of this nickel layer by a photoresist method, etc., and then the parts without the resist film are etched, and then the resist film is removed. After removing the film, a chemical palladium plating film N3 with a thickness of 5 μm was formed to obtain a watch dial as shown in FIG.
上記のようにして、金属的な輝きのある、約10μm盛
り上がった文字や目盛りあるいは複雑な模様を表面に形
成した時計文字板を得ることができた。As described above, it was possible to obtain a watch dial plate with metallic shine and having letters, scales, or complex patterns raised by about 10 μm formed on its surface.
本発明は、時計文字板において、非導電体からなる時計
用文字板の基板上に、第1の金属層として化学ニッケル
めっき方法によりニッケルめっき層を形成した後、該ニ
ッケルめっき層上面の一部にレジスト膜を形成し、レジ
スト膜のない部分をエツチングし、その後にレジスト膜
を剥離し、かつ第1の金属層の上に第2の金属層として
、化学金めつき方法による金めつき層あるいは化学パラ
ジウムめっき方法によるパラジウムめっき層を形成する
ことにより、金属的な輝きのある盛り上がった文字や目
盛りあるいは複雑な模様の作製を実現することができた
。In a watch dial, the present invention forms a nickel plating layer as a first metal layer by a chemical nickel plating method on a substrate of a watch dial made of a non-conductive material, and then forms a part of the upper surface of the nickel plating layer. A resist film is formed on the surface, the parts without the resist film are etched, and then the resist film is peeled off, and a gold plating layer is formed on the first metal layer as a second metal layer using a chemical gold plating method. Alternatively, by forming a palladium plating layer using a chemical palladium plating method, it was possible to create raised letters, scales, or complex patterns with a metallic shine.
第1図は本発明実施例の断面図である。 1・・・時計用文字板 2・・・化学ニッケルめっき皮膜層 3・・・化学パラジウムめっき皮膜層 以上 出願人 セイコー電子工業株式会社 FIG. 1 is a sectional view of an embodiment of the present invention. 1...Clock dial 2...Chemical nickel plating film layer 3...Chemical palladium plating film layer that's all Applicant: Seiko Electronics Industries Co., Ltd.
Claims (2)
字板の基板上に、第1の金属層として化学ニッケルめっ
き方法によりニッケルめっき層を形成した後、該ニッケ
ルめっき層上面の一部にレジスト膜を形成し、レジスト
膜のない部分をエッチングし、その後にレジスト膜を剥
離しかつ第1の金属層の上に第2の金属層を形成するこ
とを特徴とする時計文字板の製造方法。(1) In a watch dial, after forming a nickel plating layer as the first metal layer by a chemical nickel plating method on the substrate of the watch dial made of a non-conductive material, a part of the upper surface of the nickel plating layer is A method for manufacturing a watch dial, comprising forming a resist film, etching the portion without the resist film, then peeling off the resist film, and forming a second metal layer on the first metal layer. .
き層あるいは化学パラジウムめっき方法によるパラジウ
ムめっき層であることを特徴とする特許請求の範囲第1
項記載の時計文字板の製造方法。(2) Claim 1, characterized in that the second metal layer is a gold plating layer formed by a chemical gold plating method or a palladium plating layer formed by a chemical palladium plating method.
Method for manufacturing a clock dial as described in Section 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62290815A JPH01132773A (en) | 1987-11-18 | 1987-11-18 | Production of face of timepiece |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62290815A JPH01132773A (en) | 1987-11-18 | 1987-11-18 | Production of face of timepiece |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01132773A true JPH01132773A (en) | 1989-05-25 |
Family
ID=17760840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62290815A Pending JPH01132773A (en) | 1987-11-18 | 1987-11-18 | Production of face of timepiece |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01132773A (en) |
-
1987
- 1987-11-18 JP JP62290815A patent/JPH01132773A/en active Pending
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